IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
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ForewordRahal-Arabi, T. et al. | 2005
- 2
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EPEP'03 SPECIAL SECTION - ForewordRahal-Arabi, T. et al. | 2005
- 4
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Extraction of er(f) and tan d(f) for Printed Circuit Board Insulators Up to 30 GHz Using the Short-Pulse Propagation TechniqueDeutsch, A. et al. | 2005
- 4
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Extraction of /spl epsiv//sub r/(f) and tan/spl delta/(f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation techniqueDeutsch, A. / Winkel, T.-M. / Kopcsay, G.V. et al. | 2005
- 13
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DEPACT: delay extraction-based passive compact transmission-line macromodeling algorithmNakhla, N.M. / Dounavis, A. / Achar, R. et al. | 2005
- 24
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T-Rex, a blade packaging architecture for mainframe serversKatopis, G.A. / Becker, W.D. / Harrer, H.H. et al. | 2005
- 32
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Simulation and sensitivity analysis of nonuniform transmission lines using integrated congruence transformGad, E. / Nakhla, M. et al. | 2005
- 45
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Extraction of noise current signatures using wavelets in packaged digital systemsMandrekar, R. / Swaminathan, M. et al. | 2005
- 57
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Experimental validation of crosstalk simulations for on-chip interconnects using S-parametersKobrinsky, M.J. / Chakravarty, S. / Jiao, D. et al. | 2005
- 63
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A CAD methodology and tool for the characterization of wide on-chip busesElfadel, I.M. / Deutsch, A. / Kopcsay, G.V. et al. | 2005
- 71
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Modeling and sensitivity analysis of circuit parameters for flip-chip interconnects using neural networksPratap, R.J. / Staiculescu, D. / Pinel, S. et al. | 2005
- 79
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Reliability issues of low-cost overmolded flip-chip packagesYaomin Lin, / Wenning Liu, / Yifan Guo, et al. | 2005
- 89
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High electromagnetic shielding of plastic package for 2.5-Gb/s optical transceiver modulesTzong-Lin Wu, / Cheng-Wei Lin, / Wen-Chi Hung, et al. | 2005
- 96
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CAD flows for chip-package coverificationVarma, A.K. / Glaser, A. / Franzon, P.D. et al. | 2005
- 102
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Warpage-induced lithographic limitations of FR-4 and the need for novel board materials for future microvia and global interconnect needsBanerji, S. / Raj, P.M. / Bhattacharya, S. et al. | 2005
- 114
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Compact packaging of optical and electronic components for on-board optical interconnectsHan Seo Cho, / Kun-Mo Chu, / Saekyoung Kang, et al. | 2005
- 121
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Wavelength-tunable laser module using low-temperature cofired ceramic substratesHeikkinen, V. / Aikio, J. / Alajoki, T. et al. | 2005
- 128
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Microstructural evolution of lead-free Sn-Bi-Ag-Cu SMT joints during agingWu, C.M.L. / Huang, M.L. et al. | 2005
- 134
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Analysis of RF MEMS switch packaging Process for yield improvementMercado, L.L. / Kuo, S.-M. / Tien-Yu Lee, et al. | 2005
- 142
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Quality without compromise| 2005
- 143
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Leading the field since 1884| 2005
- 144
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IEEE Transactions on Electronics Packaging Manufacturing table of contents| 2005
- 145
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IEEE Transactions on Components and Packaging Technology table of contents| 2005
- 147
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IEEE copyright form| 2005
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Table of contents| 2005
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IEEE Transactions on Advanced Packaging publication information| 2005
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IEEE Components, Packaging, and Manufacturing Technology Society Information for authors| 2005
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IEEE Components, Packaging, and Manufacturing Technology Society Information| 2005