IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society

The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.

Table of contents

754
Editorial CPMT Society to Merge Transactions in 2011
Johnson, R. Wayne et al. | 2010
756
List of Reviewers
| 2010
756
Our Thanks to Reviewers IEEE Transactions on Advanced Packaging
| 2010
758
Foreword Special Section on Recent Progress in Electrical Modeling and Simulation of High-Speed ICs and Packages
Jiao, Dan et al. | 2010
760
SPECIAL SECTION PAPERS Waveform Relaxation Time Domain Solver for Subsystem Arrays
Antonini, G et al. | 2010
760
Waveform Relaxation Time Domain Solver for Subsystem Arrays
Antonini, G / Ruehli, A E et al. | 2010
769
A Flexible Time-Stepping Scheme for Hybrid Field-Circuit Simulation Based on the Extended Time-Domain Finite Element Method
Rui Wang, / Jian-Ming Jin, et al. | 2010
777
A Thermal Simulation Process Based on Electrical Modeling for Complex Interconnect, Packaging, and 3DI Structures
Lijun Jiang, / Chuan Xu, / Rubin, B J et al. | 2010
787
A Novel High-Capacity Electromagnetic Compression Technique Based on a Direct Matrix Solution
Youngae Han, / Jinsong Zhao, et al. | 2010
794
An LU Decomposition Based Direct Integral Equation Solver of Linear Complexity and Higher-Order Accuracy for Large-Scale Interconnect Extraction
Wenwen Chai, / Dan Jiao, et al. | 2010
804
Electromagnetic Modeling of Through-Silicon Via (TSV) Interconnections Using Cylindrical Modal Basis Functions
Ki Jin Han, / Swaminathan, M / Bandyopadhyay, T et al. | 2010
818
A Markov Chain Based Hierarchical Algorithm for Fabric-Aware Capacitance Extraction
El-Moselhy, T / Elfadel, I M / Daniel, L et al. | 2010
828
Physics-Based Gridding for Electrical Package Analysis Codes
Rubin, B J et al. | 2010
839
Random Rough Surface Effects on Wave Propagation in Interconnects
Leung Tsang, / Braunisch, H / Ruihua Ding, et al. | 2010
857
Accurate Characterization of Broadband Multiconductor Transmission Lines for High-Speed Digital Systems
Joong-Ho Kim, / Dan Oh, / Woopoung Kim, et al. | 2010
868
A Pluggable Large Core Step Index Plastic Optical Fiber With Built-In Mode Conditioners for Gigabit Ultra Short Reach Networks
Chandrappan, J / Zhang Jing, / Ng Rui Jie, et al. | 2010
876
Proximity Lithography in Sub-10 Micron Circuitry for Packaging Substrate
Fengtao Wang, / Fuhan Liu, / Linghua Kong, et al. | 2010
883
A 3-D X-Band T/R Module Package With an Anodized Aluminum Multilayer Substrate for Phased Array Radar Applications
Sung-Ku Yeo, / Jong-Hoon Chun, / Young-Se Kwon, et al. | 2010
892
Interfacial Design of Anisotropic Conductive Adhesive Based Interconnects Using Molecular Wires and Understanding of Their Electrical Conduction
Rongwei Zhang, / Kyoung-Sik Moon, / Wei Lin, et al. | 2010
899
A Homogeneous Electrically Conductive Silver Paste
Jianguo Liu, / Yu Cao, / Xiaoye Wang, et al. | 2010
904
Wafer-Level Vacuum Packaging of Micromachined Thermoelectric IR Sensors
Dehui Xu, / Errong Jing, / Bin Xiong, et al. | 2010
912
Sn Bumping Without Photoresist Mould and Si Dice Stacking for 3-D Packaging
Sung Jun Hong, / Ji Heon Jun, / Jae Pil Jung, et al. | 2010
918
Issues in the Use of Thermal Transients to Achieve Accurate Time-Constant Spectrums and Differential Structure Functions
Salleras, Marc / Carmona, Manuel / Marco, Santiago et al. | 2010
924
Transient Thermal Network Modeling Applied to Multiscale Systems. Part I: Definition and Validation
Miana, M / Cortés, Cristóbal / Pelegay, José Luis et al. | 2010
938
Transient Thermal Network Modeling Applied to Multiscale Systems. Part II: Application to an Electronic Control Unit of an Automobile
Miana, M / Cortés, C / Pelegay, J L et al. | 2010
953
Compromise Impedance Match Design for Pogo Pins With Different Single-Ended and Differential Signal-Ground Patterns
Ruey-Bo Sun, / Ruey-Beei Wu, / Shih-Wei Hsiao, et al. | 2010
961
Enhanced Microstrip Guard Trace for Ringing Noise Suppression Using a Dielectric Superstrate
Yung-Shou Cheng, / Wei-Da Guo, / Chih-Pin Hung, et al. | 2010
969
A Wideband Common-Mode Suppression Filter for Bend Discontinuities in Differential Signaling Using Tightly Coupled Microstrips
Gazda, C / Vande Ginste, D / Rogier, H et al. | 2010
979
Self-Consistent Simulation of Opto-Electronic Circuits Using a Modified Nodal Analysis Formulation
Gunupudi, P / Smy, T / Klein, J et al. | 2010
994
Design of a Common Mode Filter by Using Planar Electromagnetic Bandgap Structures
de Paulis, F / Raimondo, L / Connor, S et al. | 2010
1003
Multiparameter Sensitivity Analysis of Multiple Coupled Vias in Board and Package Structures for Early Design and Optimization
Ying Li, / Jandhyala, V et al. | 2010
1012
Parameterized Model Order Reduction of Electromagnetic Systems Using Multiorder Arnoldi
Ahmadloo, M / Dounavis, A et al. | 2010
1021
A Hierarchical Simulation Flow for Return-Loss Optimization of Microprocessor Package Vertical Interconnects
Sathanur, A V / Jandhyala, V / Braunisch, H et al. | 2010
1034
Passivity Check of $S$-Parameter Descriptor Systems via $S$-Parameter Generalized Hamiltonian Methods
Zheng Zhang, / Ngai Wong, et al. | 2010
1034
Passivity Check of Formula Not Shown -Parameter Descriptor Systems via Formula Not Shown -Parameter Generalized Hamiltonian Methods
Zhang, Z. / Wong, N. et al. | 2010
1043
A Theoretically Rigorous Full-Wave Finite-Element-Based Solution of Maxwell's Equations From dc to High Frequencies
Jianfang Zhu, / Dan Jiao, et al. | 2010
1051
Guard Trace Design for Improvement on Transient Waveforms and Eye Diagrams of Serpentine Delay Lines
Guang-Hwa Shiue, / Chia-Ying Chao, / Ruey-Beei Wu, et al. | 2010
1061
High Quality and Low Loss Millimeter Wave Passives Demonstrated to 77-GHz for SiP Technologies Using Embedded Wafer-Level Packaging Platform (EMWLP)
Ying Ying Lim, / Xianghua Xiao, / Vempati, Srinivasa Rao et al. | 2010
1072
RF Characterization and Analytical Modelling of Through Silicon Vias and Coplanar Waveguides for 3D Integration
Lamy, Y P R / Jinesh, K B / Roozeboom, F et al. | 2010
1080
Design of a Controllable Delay Line
Kabiri, A / Qing He, / Kermani, M H et al. | 2010
1088
Table of contents
| 2010
1091
2010 Index IEEE Transactions on Advanced Packaging Vol. 33
| 2010
1091
2010 Index
| 2010
C2
IEEE Transactions on Advanced Packaging publication information
| 2010
C3
IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
| 2010
C4
IEEE Components, Packaging, and Manufacturing Technology Society Information
| 2010
SPECIAL SECTION ON RECENT PROGRESS IN ELECTRICAL MODELING AND SIMULATION OF HIGH-SPEED ICs AND PACKAGES
| 2010
Feedback