IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
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Table of contents| 2004
- 239
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Foreword Special Issue on System-On-Package (SOP)Tummala, R.R. et al. | 2004
- 241
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SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decadeTummala, R.R. et al. | 2004
- 250
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The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decadeTummala, R.R. / Swaminathan, M. / Tentzeris, M.M. et al. | 2004
- 268
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Stackable system-on-packages with integrated componentsBecker, K.-F. / Erik Jung, / Ostmann, A. et al. | 2004
- 278
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Design and development of optoelectronic mixed signal system-on-package (SOP)Iyer, M.K. / Ramana, P.V. / Sudharsanam, K. et al. | 2004
- 286
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Power distribution networks for system-on-package: status and challengesSwaminathan, M. / Joungho Kim, / Novak, I. et al. | 2004
- 286
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Power Distribution Networks for System on a Package: Status and ChallengesSwaminathan, M. / Kim, J. / Novak, I. et al. | 2004
- 301
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Future microprocessors and off-chip SOP interconnectHofstee, H.P. et al. | 2004
- 304
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Electromagnetic interference (EMI) of system-on-package (SOP)Sudo, T. / Sasaki, H. / Masuda, N. et al. | 2004
- 315
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Next-generation microvia and global wiring technologies for SOPSundaram, V. / Tummala, R.R. / Fuhan Liu, et al. | 2004
- 326
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Embedded resistors and capacitors for organic-based SOPUlrich, R. et al. | 2004
- 332
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3-D-Integrated RF and Millimeter-Waves Functions and Module Using Liquid Crystal Polymer System-on-Package TechnologyTentzeris, M. M. / Laskar, J. / Papapolymerou, J. et al. | 2004
- 332
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3-D-integrated RF and millimeter-wave functions and modules using liquid crystal polymer (LCP) system-on-package technologyTentzeris, M.M. / Laskar, J. / Papapolymerou, J. et al. | 2004
- 341
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SOP integration and codesign of antennasBrebels, S. / Ryckaert, J. / Come, B. et al. | 2004
- 352
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Low-cost test of embedded RF/analog/mixed-signal circuits in SOPsAkbay, S.S. / Halder, A. / Chatterjee, A. et al. | 2004
- 364
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Cost and Performance Tradeoff Analysis in Radio and Mixed-Signal System-on-Package Design (Invited Paper)Zheng, L.-R. / Duo, X. / Shen, M. et al. | 2004
- 364
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Cost and performance tradeoff analysis in radio and mixed-signal system-on-package designLi-Rong Zheng, / Xinzhong Duo, / Shen, M. et al. | 2004
- 376
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Planar lightwave integrated circuits with embedded actives for board and substrate level optical signal distributionJokerst, N.M. / Gaylord, T.K. / Glytsis, E. et al. | 2004
- 386
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Chip-to-chip optoelectronics SOP on organic boards or packagesGee-Kung Chang, / Guidotti, D. / Fuhan Liu, et al. | 2004
- 398
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Thermal modeling and performance of high heat flux SOP packagesArik, M. / Garg, J. / Bar-Cohen, A. et al. | 2004
- 413
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Next generation of 100-/spl mu/m-pitch wafer-level packaging and assembly for systems-on-packageTay, A.A.O. / Iyer, M.K. / Tummala, R.R. et al. | 2004
- 413
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Next Generation of 100-mum-Pitch Wafer-Level Packaging and Assembly for Systems-on-PackageTay, A. A. O. / Iyer, M. K. / Tummala, R. R. et al. | 2004
- 426
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Intelligent SOP manufacturingMay, G.S. et al. | 2004
- 438
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System-level reliability assessment of mixed-signal convergent microsystemsPucha, R.V. / Hegde, S. / Damani, M. et al. | 2004
- 453
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6th International Symposium on Quality Electronic Design (ISQED 2005)| 2004
- 454
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22nd ICEC—50th IEEE Holm Conference on Electrical Contacts 2004| 2004
- 455
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Explore IEL IEEE's most comprehensive resource| 2004
- 456
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Leading the field since 1884| 2004
- 457
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IEEE Member Digital Library| 2004
- 458
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IEEE Transactions on Electronics Packaging Manufacturing - table of contents| 2004
- 459
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IEEE Transactions on Components and Packaging Technology - table of contents| 2004
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[Front cover]| 2004
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IEEE Transactions on Advanced Packaging publication information| 2004
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IEEE Components, Packaging, and Manufacturing Technology Society Information for authors| 2004
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IEEE Components, Packaging, and Manufacturing Technology Society Information| 2004