IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 234
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Improvements in Noise Suppression for I/O Circuits Using Embedded Planar CapacitorsMuthana, P. / Srinivasan, K. / Engin, A.E. et al. | 2008
- 246
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Eye-Pattern Design for High-Speed Differential Links Using Extended Passive EqualizationKi Jin Han, / Hayato Takeuchi, / Swaminathan, M. et al. | 2008
- 258
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40-Gb/s Package Design Using Wire-Bonded Plastic Ball Grid ArrayDong Gun Kam, / Joungho Kim, et al. | 2008
- 267
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A Semi-Analytical Approach for System-Level Electrical Modeling of Electronic Packages With Large Number of ViasZaw Zaw Oo, / En-Xiao Liu, / Er-Ping Li, et al. | 2008
- 275
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A Transmission-Line Model for Full-Wave Analysis of Mixed-Mode PropagationChiariello, A.G. / Maffucci, A. / Miano, G. et al. | 2008
- 285
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An Ultra-Compact Planar Bandpass Filter With Open-Ground Spiral for Wireless ApplicationKaixue Ma, / Kiat Seng Yeo, / Jian-Guo Ma, et al. | 2008
- 292
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Full-Wave Solver for Microstrip Trace and Through-Hole Via in Layered MediaChong-Jin Ong, / Boping Wu, / Leung Tsang, et al. | 2008
- 303
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Delaunay–Voronoi Modeling of Power-Ground Planes With Source Port CorrectionKai-Bin Wu, / Guang-Hwa Shiue, / Wei-Da Guo, et al. | 2008
- 311
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Design and Analysis of Ultra-Miniaturized Meandering Photonic Crystals Delay LinesFakharzadeh, M. / Ramahi, O.M. / Safavi-Naeini, S. et al. | 2008
- 320
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A Fast Computation Method in Frequency Domain for Power Ground Plane Impedance Calculation Using the Mobius TransformYoungsuk Suh, / Pinping Sun, / Insung Kim, et al. | 2008
- 326
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A Complete Finite-Element Analysis of Multilayer Anisotropic Transmission Lines From DC to Terahertz FrequenciesShih-Hao Lee, / Kaiyu Mao, / Jian-Ming Jin, et al. | 2008
- 339
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A Finite-Element Domain-Decomposition Methodology for Electromagnetic Modeling of Multilayer High-Speed InterconnectsHong Wu, / Cangellaris, A.C. et al. | 2008
- 351
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Fabrication and Characteristics of 40-Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser ModulesHo-Gyeong Yun, / Kwang-Seong Choi, / Yong-Hwan Kwon, et al. | 2008
- 357
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A Micromachined Chip-to-Board Interconnect System Using Electroplating Bonding TechnologyYeun-Ho Joung, / Allen, M.G. et al. | 2008
- 367
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New 3-D Chip Stacking Architectures by Wire-On-Bump and Bump-On-FlexBaik-Woo Lee, / Jui-Yun Tsai, / Hotae Jin, et al. | 2008
- 377
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Development of Stretch Solder Interconnections for Wafer Level PackagingRajoo, R. / Lim, S.S. / Wong, E.H. et al. | 2008
- 386
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Mechanical Behavior and Low-Cycle Shear Fatigue Life of the Pure Ni Laser-Welded Joints in Optoelectronics PackagingTan, C.W. / Chan, Y.C. / Leung, N.W. et al. | 2008
- 394
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Effects in Surface Free Energy of Sputter-Deposited TaNx FilmsChun-Wei Fan, / Shih-Chin Lee, et al. | 2008
- 399
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Eddy Current Induced Heating for the Solder Reflow of Area Array PackagesMingyu Li, / Hongbo Xu, / Lee, S.-W.R. et al. | 2008
- 404
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Microchip Self-Assembly on a Substrate Using Plasma TreatmentChia-Shou Chang, / Ruoh-Huey Uang, / Enboa Wu, et al. | 2008
- 410
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Thermal Aging Reliability of Package-Level Polymer Optical WaveguidesHegde, S.G. / Sitaraman, S.K. et al. | 2008
- 417
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Effects of CNT-BaTiO3 Composite Particles Prepared by Mechanical Process on Dielectric Properties of Epoxy Hybrid FilmsPark, H.J. et al. | 2008
- 417
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Effects of ${\hbox{CNT/BaTiO}}_{3}$ Composite Particles Prepared by Mechanical Process on Dielectric Properties of Epoxy Hybrid FilmsHui Joon Park, / Seung Min Hong, / Sang-Soo Lee, et al. | 2008
- 423
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622-Mb/s Bidirectional SFP Optical Transceiver Using an Integrated WDM Optical SubassemblyHyun-Jae Yoon, / Jeong-Geon Kim, et al. | 2008
- 429
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Heat driven cooling of portable electronics using thermoelectric technologySolbrekken, G.L. / Yazawa, K. / Bar-Cohen, A. et al. | 2008
- 438
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Table of contents| 2008
- C2
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IEEE Transactions on Advanced Packaging publication information| 2008
- C3
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IEEE Components, Packaging, and Manufacturing Technology Society Information for authors| 2008
- C4
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IEEE Components, Packaging, and Manufacturing Technology Society Information| 2008