IEEE transactions on advanced packaging : a publication of the IEEE Components, Packaging, and Manufacturing Technology Society and the Lasers and Electro-Optics Society
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 235
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Foreword Special Section on High-Speed I/O ChannelsBeyene, Wendem T. et al. | 2009
- 237
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Modeling and Analysis of High-Speed I/O LinksBalamurugan, G. / Casper, B. / Jaussi, J.E. et al. | 2009
- 237
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SPECIAL SECTION PAPERS - Modeling and Analysis of High-Speed I-O LinksBalamurugan, G. et al. | 2009
- 248
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On-Die Power Supply Noise Measurement TechniquesAlon, E. / Abramzon, V. / Nezamfar, B. et al. | 2009
- 260
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Statistical Simulation of Physical Transmission MediaSanders, A. et al. | 2009
- 268
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Channel Coding For High-Speed Links: A Systematic Look at Code Performance and System SimulationBlitvic, N. / Lee, M. / Stojanovic, V. et al. | 2009
- 280
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Predicting Microwave Digital Signal IntegrityBuckwalter, J.F. et al. | 2009
- 290
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Jitter Challenges and Reduction Techniques at 10 Gb/s and BeyondLi, M.P. et al. | 2009
- 298
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Frequency-Division Bidirectional Communication Over Chip-to-Chip ChannelsBichan, M. / Hossain, M. / Carusone, A.C. et al. | 2009
- 306
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Advanced Modeling and Accurate Characterization of a 16 Gb/s Memory InterfaceBeyene, W.T. / Madden, C. / Jung-Hoon Chun, et al. | 2009
- 328
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Is 25 Gb/s On-Board Signaling Viable?Kam, D.G. / Ritter, M.B. / Beukema, T.J. et al. | 2009
- 345
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160 Gb/s Bidirectional Polymer-Waveguide Board-Level Optical Interconnects Using CMOS-Based TransceiversDoany, F.E. / Schow, C.L. / Baks, C.W. et al. | 2009
- 360
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Foreword Wafer-Level Packaging: Interconnects for Enhanced ReliabilityNguyen, Luu T. et al. | 2009
- 360
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SPECIAL SECTION ON WAFER-LEVEL PACKAGING - FOREWORD - Wafer-Level Packaging: Interconnects for Enhanced ReliabilityNguyen, L.T. et al. | 2009
- 362
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SPECIAL SECTION PAPERS - Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip InterconnectsWu, W.-C. et al. | 2009
- 362
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Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip-Chip InterconnectsWei-Cheng Wu, / Chang, E.Y. / Ruey-Bing Hwang, et al. | 2009
- 372
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Wafer-Level Packaging With Soldered Stress-Engineered Micro-SpringsChow, E.M. / Fork, D.K. / Chua, C.L. et al. | 2009
- 379
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Planar Microspring—A Novel Compliant Chip-to-Package Interconnect for Wafer-Level PackagingLiao, E.B. / Tay, A.A.O. / Ang, S.S.T. et al. | 2009
- 390
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Investigation of the Trace Line Failure Mechanism and Design of Flexible Wafer Level PackagingMing-Chih Yew, / Yuan, C.C.A. / Chung-Jung Wu, et al. | 2009
- 399
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Foreword Special Section on Packaging for Micro/Nano-Scale SystemsChiou, J. Albert / Lee, Y. C. / Kurabayashi, Katsuo et al. | 2009
- 402
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SPECIAL SECTION PAPERS - Performance Evaluation and Equivalent Model of Silicon Interconnects for Fully-Encapsulated RF MEMS DevicesChen, K.-L. et al. | 2009
- 402
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Performance Evaluation and Equivalent Model of Silicon Interconnects for Fully-Encapsulated RF MEMS DevicesKuan-Lin Chen, / Salvia, J. / Potter, R. et al. | 2009
- 410
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A Microfluidic Packaging Technique for Lab-on-Chip ApplicationsGhafar-Zadeh, E. / Sawan, M. / Therriault, D. et al. | 2009
- 417
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Design, Fabrication, and Assembly of an Optical Biosensor Probe Package for OCT (Optical Coherence Tomography) ApplicationPremachandran, C.S. / Khairyanto, A. / Sheng, K. et al. | 2009
- 423
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Optimized Thermoelectric Refrigeration in the Presence of Thermal Boundary ResistancePettes, A.M. / Hodes, M.S. / Goodson, K.E. et al. | 2009
- 431
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A Modular Stackable Concept for Heat Removal From 3-D Stacked Chip Electronics by Interleaved Solid Spreaders and Synthetic JetsGerlach, D.W. / Gerty, D. / Mahalingam, R. et al. | 2009
- 440
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Quantitative Characterization of True Leak Rate of Micro to Nanoliter Packages Using Helium Mass SpectrometerGoswami, A. / Bongtae Han, / Ham, S.-J. et al. | 2009
- 448
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Low-Temperature SU-8 Based Wafer-Level Hermetic Packaging for MEMS DevicesZine-El-Abidine, I. / Okoniewski, M. et al. | 2009
- 448
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A Low-Temperature SU-8 Based Wafer-Level Hermetic Packaging for MEMS DevicesZine-El-Abidine, I. / Okoniewski, M. et al. | 2009
- 453
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A Cost-Effective MEMS Cavity Packaging Technology for Mass ProductionJun Su Lee, / Faheem, F.F. / Jeong Tae Kim, et al. | 2009
- 461
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Ultrasonic Bonding for MEMS Sealing and PackagingJongbaeg Kim, / Bongwon Jeong, / Mu Chiao, et al. | 2009
- 468
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Microcantilever Probe Cards With Silicon and Nickel Composite Micromachining Technique for Wafer-Level Burn-In TestingFei Wang, / Xinxin Li, / Songlin Feng, et al. | 2009
- 478
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Damage Mechanics of Low Temperature Electromigration and ThermomigrationShidong Li, / Abdulhamid, M.F. / Basaran, C. et al. | 2009
- 486
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Fabrication and Testing of a Wafer-Level Vacuum Package for MEMS DevicePremachandran, C.S. / Ser Choong Chong, / Liw, S. et al. | 2009
- 491
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Characterization of Fully Embedded RF Inductors in Organic SOP TechnologyHwan-Hee Lee, / Jae-Yeong Park, et al. | 2009
- 497
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Improving the Yield and Turn-Around Time of Focused Ion Beam Microsurgery of Integrated Circuits by LCVD MethodRemes, J. / Vahakangas, J. / Uusimaki, A. et al. | 2009
- 503
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Development of a New Interposer Including Embedded Thin Film Passive ElementsMori, T. / Yamaguchi, M. / Kuramochi, S. et al. | 2009
- 509
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Demonstration of Direct Coupled Optical/Electrical Circuit BoardTeck Guan Lim, / Ramana, P.V. / Lee, B.S.P. et al. | 2009
- 517
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Multiple Scales Method in VLSI Interconnects Threshold Crossing Time CalculationLigocka, A. / Bandurski, W. et al. | 2009
- 528
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Development of a Disposable Bio-Microfluidic Package With Reagents Self-Contained Reservoirs and Micro-Valves for a DNA Lab-on-a-Chip (LOC) ApplicationLing Xie, / Premachandran, C.S. / Chew, M. et al. | 2009
- 536
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Analytical Solution for the Damped-Dynamics of Printed Circuit Board and Applied to Study the Effects of Distorted Half-Sine Support ExcitationWong, E.H. / Mai, Y.-W. / Woo, M. et al. | 2009
- 546
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On the Thermal–Mechanical Behaviors of a Novel Nanowire-Based Anisotropic Conductive Film TechnologyHsien-Chie Cheng, / Wen-Hwa Chen, / Chieh-Sheng Lin, et al. | 2009
- 564
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Development of Nickel Wire Bonding for High-Temperature Packaging of SiC DevicesBurla, R.K. / Li Chen, / Zorman, C.A. et al. | 2009
- 575
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The IEEE Digital Library| 2009
- 576
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IEEE Foundation| 2009
- 577
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Join the IEEE Engineering in Medicine and Biology Society| 2009
- 578
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Table of contents| 2009
- C2
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IEEE Transactions on Advanced Packaging publication information| 2009
- C3
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IEEE Components, Packaging, and Manufacturing Technology Society Information for authors| 2009
- C4
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IEEE Components, Packaging, and Manufacturing Technology Society Information| 2009