IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B ADVANCED PACKAGING
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
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ContentsHenning, A.K. / Firch, J.S. / Harris, J.M. et al. | 1998
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1998 Index: IEEE Transactions on Components, Packaging, and Manufacturing Technology — Part B: Advanced packaging Vol. 21| 1998
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[Advertisement]| 1998
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - ForewordBolouri, H. et al. | 1998
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Foreword: Microelectronics system integrationBolouri, Hamid / Laforge, Laurence E. et al. | 1998
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Review and summary of a silicon micromachined gas chromatography systemKolesar, Edward S. / Reston, Rocky R. et al. | 1998
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Review and Summary of a Silicon Micromachined Gas Chromatography SystemKolesar, E.S. et al. | 1998
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Microfluidic MEMS for semiconductor processingHenning, Albert K. / Fitch, John S. / Harris, James M. et al. | 1998
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Microfluidic MEMS for Semiconductor ProcessingHenning, A.K. et al. | 1998
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Architecture, defect tolerance, and buffer design for a new ATM switchJain, Vijay K. / Lin, Lei / Horiguchi, Susumu et al. | 1998
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Architecture, Defect Tolerance, and Buffer Design for a New ATM SwitchJain, V.K. et al. | 1998
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Programmable neural logicBohossian, Vasken / Hasler, Paul / Bruck, Jehoshua et al. | 1998
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Programmable Neural LogicBohossian, V. et al. | 1998
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Possibilities and Limitations of IDDQ Testing in Submicron CMOSFigueras, J. et al. | 1998
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Possibilities and limitations of IDDQ testing in submicron CMOSFigueras, Joan / Ferre, Antoni et al. | 1998
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CONTRIBUTIONS FROM THE 2ND IEEE INTERNATIONAL CONFERENCE ON INNOVATIVE SYSTEMS IN SILICON - Economics Modeling of Multichip Modules Testing StrategiesAbadir, M. et al. | 1998
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Economics modeling of multichip modules testing strategiesAbadir, Magdy et al. | 1998
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REGULAR PAPERS - Chip and Package Connections - Solder-Jetted Eutectic PbSn Bumps for Flip-ChipBaggerman, A.F.J. et al. | 1998
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Solder-jetted eutectic PbSn bumps for flip-chipBaggerman, Antal F. J. / Schwarzbach, Daniel et al. | 1998
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REGULAR PAPERS - Chip and Package Connections - Polymeric Conductive Pastes as Solder Replacement for Flip-Chip AttachmentManer, K.U. et al. | 1998
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Polymeric conductive pastes as solder replacement for flip-chip attachmentManer, Kaoru U. / Ang, Simon S. / Schaper, Leonard W. et al. | 1998
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Interface reaction between Ag-Pd conductor and Pd-Sn solderMoriya, Yoichi / Yamade, Yoshiaki / Shinya, Ryuji et al. | 1998
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REGULAR PAPERS - Chip and Package Connections - Interface Reaction between Ag-Pd Conductor and Pd-Sn SolderMoriya, Y. et al. | 1998
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Aging effects on shear fatigue life and shear strength of soldered thick film jointsLi, G. Y. / Chan, Y. C. et al. | 1998
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REGULAR PAPERS - Chip and Package Connections - Aging Effects on Shear Fatigue Life and Shear Strength of Soldered Thick Film JointsLi, G.Y. et al. | 1998
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REGULAR PAPERS - Advanced Packaging Structures - Numerical Stress Analysis of Resin Cracking in LSI Plastic Packages under Temperature Cyclic Loading -- Part III: Material Properties and Package GeometriesSaitoh, T. et al. | 1998
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Numerical stress analysis of resin cracking in LSI plastic packages under temperature cyclic loading — Part III: Material properties and package geometriesSaitoh, Takehiro / Matsuyama, Hidehito / Toya, Masayuki et al. | 1998
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REGULAR PAPERS - Advanced Packaging Structures - Effective Material Properties and Thermal Stress Analysis of Epoxy Molding Compound in Electronic PackagingShin, D.K. et al. | 1998
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Effective material properties and thermal stress analysis of epoxy molding compound in electronic packagingShin, Dong Kil / Lee, Jung Ju et al. | 1998
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REGULAR PAPERS - Advanced Packaging Structures - Linear Fracture Mechanics Analysis on Growth of Interfacial Delamination in LSI Plastic Packages under Temperature Cyclic LoadingSaitoh, T. et al. | 1998
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Linear fracture mechanics analysis on growth of interfacial delamination in lsi plastic packages under temperature cyclic loadingSaitoh, Takehiro / Matsuyama, Hidehito / Toya, Masayuki et al. | 1998
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REGULAR PAPERS - Electrical Modeling and Performance - A Low-Cost Technique for Reducing the Simultaneous Switching Noise in Sub-Board Packaging ConfigurationsKoike, S. et al. | 1998
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A low-cost technique for reducing the simultaneous switching noise in sub-board packaging configurationsKoike, Shinji / Kaizu, Katsumi et al. | 1998
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Effects of floating planes in three-dimensional packaging structures on simultaneous switching noiseVakanas, Loizos / Hasan, Samil / Cangellaris, Andreas et al. | 1998
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REGULAR PAPERS - Electrical Modeling and Performance - Effects of Floating Planes in Three-Dimensional Packaging Structures on Simultaneous Switching NoiseVakanas, L. et al. | 1998
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REGULAR PAPERS - Electrical Modeling and Performance - Dielectric Constant and Loss Tangent Measurement Using a Stripline FixtureYue, H. et al. | 1998
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Dielectric constant and loss tangent measurement using a stripline fixtureYue, Heping / Virga, Kathleen L. / Prince, John L. et al. | 1998
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An 8-bit 2-gigasample/second A/D converter multichip module for digital receiver demonstration on Navy AN/APS-145 E2-C airborne early warning aircraft radarThompson, Rick L. / Degerstrom, Michael J. / Walters, Wayne L. et al. | 1998
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REGULAR PAPERS - Packaging and Interconnects - An 8-Bit 2-Gigasample-Second A-D Converter Multichip Module for Digital Receiver Demonstration on Navy AN-APS-145 E2-C Airborne Early Warning Aircraft RadarThompson, R.L. et al. | 1998
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Microstrip-to-microstrip interconnects with adhesive bonded ribbons for micro- and millimeterwave applicationsPohlmann, Wolfgang / Jacob, Arne F. / Schafer, Helmut et al. | 1998
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REGULAR PAPERS - Packaging and Interconnects - Microstrip-to-Microstrip Interconnects with Adhesive Bonded Ribbons for Micro- and Millimeterwave ApplicationsPohlmann, W. et al. | 1998
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Multidimensional VCSEL-array push/pull module fabricated using the self-alignment mounting techniqueKosaka, Hideo / Kajita, Mikihiro / Sugimoto, Yoshimasa et al. | 1998
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REGULAR PAPERS - Optoelectronic Packaging - Multidimensional VCSEL-Array Push-Pull Module Fabricated Using the Self-Alignment Mounting TechniqueKosaka, H. et al. | 1998
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ANNOUNCEMENTS - Editor-in-Chief s StatementKrusius, J.A. et al. | 1998
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Editor's statementKrusius, J. Peter et al. | 1998
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ANNOUNCEMENTS - Foreword -- Contributions from the 6th Topical Meeting on Electrical Performance of Electronic PackagingDeutsch, A. et al. | 1998
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Foreword contributions from the sixth topical meeting on electrical performance of electronic packagingDeutsch, Alina / Prince, John L. et al. | 1998
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ANNOUNCEMENTS - Correction -- 1997 List of ReviewersKrusius, J.P. et al. | 1998
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Correction to “1997 list of reviewers”Krusius, J. Peter et al. | 1998
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1998 INDEX| 1998
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[Front cover]Bolouri, H. / Laforge, L.E. et al. | 1998
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Inside front coverKolesar, E.S. / Reston, R.R. et al. | 1998
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[Back inside cover]| 1998
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[Back cover]| 1998