Cross Sectioning Materials for TEM Analysis Using the Tripod Polisher (English)
- New search for: Benedict, J. P.
- New search for: Anderson, R. M.
- New search for: Klepeis, S. J.
- New search for: International Metallographic Society
- New search for: Benedict, J. P.
- New search for: Anderson, R. M.
- New search for: Klepeis, S. J.
- New search for: Stevens, D. W.
- New search for: International Metallographic Society
In:
International Metallographic Society: Advances and applications in the metallography and characterization of materials and microelectronic components
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277-284
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1996
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ISBN:
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ISSN:
- Conference paper / Print
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Title:Cross Sectioning Materials for TEM Analysis Using the Tripod Polisher
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Contributors:Benedict, J. P. ( author ) / Anderson, R. M. ( author ) / Klepeis, S. J. ( author ) / Stevens, D. W. / International Metallographic Society
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Conference:Annual technical meeting; 28th, International Metallographic Society: Advances and applications in the metallography and characterization of materials and microelectronic components ; 1995 ; Albuquerque; NM
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Published in:MICROSTRUCTURAL SCIENCE ; 23 ; 277-284
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Publisher:
- New search for: ASM International
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Place of publication:Columbus, Ohio , International Metallographic Society , Materials Park, Ohio
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Publication date:1996-01-01
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Size:8 pages
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ISBN:
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ISSN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
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Tailored Microstructures of Silicon Nitride CeramicsPetzow, G. E. / International Metallographic Society et al. | 1996
- 15
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Metallography of Transformation Cycles in SolidsHornbogen, E. / International Metallographic Society et al. | 1996
- 29
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Crystallization Kinetics of Fe-B-Si-Based Metallic Glasses with Single Additions of C, Co and CrCaceres, P. G. / Habib, K. / International Metallographic Society et al. | 1996
- 35
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Failures of Planar Solder Joints in Photovoltaic Solar-Cell AssembliesRichman, R. H. / International Metallographic Society et al. | 1996
- 41
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Metallographic Characterization of the Adhesion of Diamond-Like CoatingsRichman, R. H. / Maasberg, J. A. / Brown, I. G. / Anders, S. / International Metallographic Society et al. | 1996
- 49
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Stress Corrosion Behavior of Aluminum Alloys 2195 and 2219Frefer, A. / Bobeck, G. E. / Place, T. A. / Bailey, J. F. / International Metallographic Society et al. | 1996
- 57
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Fatigue of Al-Li Alloy 8090 in Hydrogenous AtmospheresHillard, O. H. / Bobeck, G. E. / Place, T. A. / International Metallographic Society et al. | 1996
- 65
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Microstructural Analysis of Lead-Free Solder on Ag/Pd and Ag/Pt-Based MetallizationsKern, J. A. / Weiser, M. W. / Drewien, C. A. / International Metallographic Society et al. | 1996
- 73
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Optimization of Critical Current Density for BSCCO(2223) Opit Tapes by Increasing Contact Length between the Core and SheathProrok, B. C. / Eror, N. G. / Balachandran, U. / Lelovic, M. / International Metallographic Society et al. | 1996
- 79
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Metallurgical Cross-Sectioning of Microelectronic Packages for Optical Inspection and Electron Beam AnalysisBurgoyne, R. J. / International Metallographic Society et al. | 1996
- 89
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Method to Evaluate Damage Induced by Dicing and Laser Cutting of Silicon WafersEbbutt, R. / Danyluk, S. / Weisshaus, I. / International Metallographic Society et al. | 1996
- 95
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Degradation of Tin-Lead Solder Joints via Interaction with 2-Ethyl-Hexaonic AcidJones, M. R. / Pennington, R. J. / Selover, S. J. / International Metallographic Society et al. | 1996
- 99
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Focused Ion Beam in Failure Analysis of Microelectronic DevicesLiu, L. / Wang, P. / International Metallographic Society et al. | 1996
- 103
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Meeting the Microsectioning Challenges Imposed by Printed Wiring Board Fine Hole TechnologyNelson, J. A. / International Metallographic Society et al. | 1996
- 109
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Inspection of Chemically Roughened Copper Surfaces Using Optical Interferometry and Scanning Electron Microscopy: Establishing a Correlation between Surface Morphology and SolderabilityStevenson, J. O. / Hosking, F. M. / Gullinger, T. R. / Yost, F. G. / International Metallographic Society et al. | 1996
- 119
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Experimental Investigation on Structures of Mushy Zone during Solidification of Cast IronChen, Q. / Langer, E. W. / Hansen, P. N. / International Metallographic Society et al. | 1996
- 125
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Recrystallization Phenomena in 304 Stainless Steel Deformed at Liquid Nitrogen Temperature and Its Effect on SensitizationMaldonada, J. G. / Murr, L. E. / Fisher, W. W. / International Metallographic Society et al. | 1996
- 131
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Materials Selection Chart of High-Chromium Cast IronsPero-Sanz, J. A. / Verdeja, J. I. / Asensio, J. / International Metallographic Society et al. | 1996
- 135
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A New Relationship between Charpy Impact Energy and Fracture ToughnessPutatunda, S. K. / Atodaria, D. R. / Schaefer, J. / International Metallographic Society et al. | 1996
- 141
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Effect of Cathodic Hydrogen Charging on Structural Changes in Ferritic Stainless SteelsSzummer, A. / Lublinska, K. / Jezierska, E. / International Metallographic Society et al. | 1996
- 151
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Failure Analysis of a Steam Reformer TubeCaceres, P. G. / Habib, K. / International Metallographic Society et al. | 1996
- 157
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Microstructure Evolution in Steel Boiler Tubes: A Search for Failure Modes and Deformation MechanismsDe Alba, J. / Niou, C.-S. / Murr, L. E. / Diehl, P. / International Metallographic Society et al. | 1996
- 165
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Case Studies of High Temperature FailuresFurtado, H. C. / Le May, I. / International Metallographic Society et al. | 1996
- 169
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Types of Weld HAZ Grain Boundary Liquation in Advanced Austenitic AlloysLundlin, C. D. / Qiao, C. Y. P. / International Metallographic Society et al. | 1996
- 179
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An All-Round Hard Composite Disc for Fine Grinding of Materialographic SpecimensGeels, K. / Bjerregaard, L. / Damgaard, M. / International Metallographic Society et al. | 1996
- 185
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New Metallographic Preparation Techniques for Tantalum and Tantalum AlloysKelly, A. M. / Bingert, S. R. / Reiswig, R. D. / International Metallographic Society et al. | 1996
- 197
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Effect of Surface Preparation on High Temperature Oxidation of Ni-Cr-Be and Co-Cr AlloysMueller, H. J. / International Metallographic Society et al. | 1996
- 207
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Microstructural Characterization Methodologies for Ni/Ni(OH)~2 Powders for Battery ApplicationsShehata, M. T. / Carpenter, G. J. C. / International Metallographic Society et al. | 1996
- 215
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Preparation of Specimens for Use in Fabricating Bicrystals by UHV Diffusion BondingWien, W. L. / Campbell, G. H. / King, W. E. / International Metallographic Society et al. | 1996
- 221
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Advanced Materials Preparation and Basic Image Analysis Techniques for P/M MaterialsZipperian, D. C. / Diaz, D. J. / International Metallographic Society et al. | 1996
- 229
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Exploitation of the Optical Microscope: An Insight into the Optical Technique of PolarizationBousfield, B. / International Metallographic Society et al. | 1996
- 237
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Compromise in Hardenability by Chemical Segregation and Grain Refinement towards the Pearlite Banding in Nb Bearing SteelsGurrero, R. / Asensio, J. / Verdeja, J. I. / Pero-Sanz, J. A. / International Metallographic Society et al. | 1996
- 243
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Metallography at the Met Lab-the First Fifty YearsLee, R. H. / International Metallographic Society et al. | 1996
- 251
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Microstructure and Abrasion Resistance of Fe-TiC-M~7C~3 CompositeDogan, O. N. / Hawk, J. A. / International Metallographic Society et al. | 1996
- 259
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A Study and Comparison of Microstructures in Ta and Ta-W Starting Liners and a Pure Ta Explosively Formed PenetratorPappu, S. / Niou, C.-S. / Kennedy, C. / Murr, L. E. / International Metallographic Society et al. | 1996
- 267
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Comparison of Crater Cross-Section Microstructures in Copper Targets for Aluminum Projectiles Impacting at Different VelocitiesRivas, J. M. / Quinones, S. A. / Garcia, E. P. / Murr, L. E. / International Metallographic Society et al. | 1996
- 277
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Cross Sectioning Materials for TEM Analysis Using the Tripod PolisherBenedict, J. P. / Anderson, R. M. / Klepeis, S. J. / International Metallographic Society et al. | 1996
- 285
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Transmission Electron Microscopy Sample Preparation and Analysis of Semiconductor DevicesGignac, L. M. / Cunningham, B. / Palmer, L. F. / Miller, J. A. / International Metallographic Society et al. | 1996
- 291
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Difficulties and Solutions in Cross-Sectioning Microelectronic MaterialsHolt, S. D. / International Metallographic Society et al. | 1996
- 297
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Metallographic Techniques for Electronic Packaging ApplicationsRicker, M. W. / International Metallographic Society et al. | 1996
- 305
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Precision Cross-Sectioning and Sample Preparation Techniques in Support of SEM Analysis of Semiconductor DevicesTrudeau, F. G. / International Metallographic Society et al. | 1996
- 311
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A Summary of the Types of Failure Analyses Infrequently Encountered in the Maintenance of a High Volume, Surface Mount Technology (SMT) Production LineYasko, R. N. / International Metallographic Society et al. | 1996