MCM-D Manufacturing for the 21st Century: The Facility, The Product, The Cost (English)
- New search for: Dieffenbach, J. R.
- New search for: Adams, B. B.
- New search for: Dieffenbach, J. R.
- New search for: Adams, B. B.
In:
Multichip modules
;
339-344
;
1996
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ISBN:
- Conference paper / Print
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Title:MCM-D Manufacturing for the 21st Century: The Facility, The Product, The Cost
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Contributors:Dieffenbach, J. R. ( author ) / Adams, B. B. ( author )
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Conference:International conference; 5th, Multichip modules ; 1996 ; Denver; CO
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Published in:Multichip modules ; 339-344
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Publisher:
- New search for: ISHM - The Microelectronics Society
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Publication date:1996-01-01
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Size:6 pages
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Remarks:Also known as ICEMCM '96; See also 6823.1 vol 2794 1996 for same papers
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 001
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A Pentium[R] Processor Based L/D MCM Test Vehicle: A Subsystem for Portable ApplicationsCherukuri, N. / Liao, J.-M. / Denuit, R. V. / Kawano, K. et al. | 1996
- 006
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Casting Light on Recent Advancements in Laser Based MCM-L ProcessingTessier, T. G. / Aday, J. G. et al. | 1996
- 015
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Comparing Costs for Various PWB Build-Up TechnologiesHolden, H. et al. | 1996
- 022
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Development and Characterization of a Few-Chip Module Housing a DC-DC Power SupplyHashemi, H. / Walshak, D. / Mehrotra, P. et al. | 1996
- 028
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A Low Cost Multichip Module Using Flex Substrate and Ball Grid ArrayArnn, D. A. / Parkerson, J. P. / Schaper, L. W. / Ang, S. S. et al. | 1996
- 033
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Design Trade-Offs of MCM-C vs. Ball Grid Array on Printed Wiring BoardHorowitz, S. J. / Amey, D. I. / Page, J. P. / Ladd, S. K. et al. | 1996
- 039
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Stressing the Need for Improve Pricing Metrics for MCM-D and MCM-D on C ProductsBerger, D. G. / Clearfield, H. M. / O'Donnell, W. J. / Miller, W. R. et al. | 1996
- 039
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Stressing the Need for Improved Pricing Metrics for MCM-D and MCM-D on C ProductsBerger, D. G. / Clearfield, H. M. / O'Donnell, W. J. / Miller, W. R. et al. | 1996
- 045
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Thermal Management Approach for a Scalable, MCM-Based SystemBartilson, B. / Hokanson, K. E. et al. | 1996
- 052
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Hermetic Thick Film Multichip ModulesKeusseyan, R. L. / Sawhill, H. / Horowitz, S. / Horne, G. et al. | 1996
- 058
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Testing Probe for Multichip Modules with High-Speed VLSIsKasukabe, S. / Mizuuchi, Y. / Numata, K. et al. | 1996
- 063
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Line Impedance Control in MCM-Cs with Meshed Ground-/Power PlanesMuller, J. / Badstubner, O. / Thust, H. / Exner, M. et al. | 1996
- 069
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MCM-D/C Applications for a High Performance ModulePerfecto, E. D. / McEntee, K. / Lidestri, K. / Longworth, H. et al. | 1996
- 075
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Twinstar - Dual Pentium[R] Processor ModuleSkinner, M. P. / Garrou, P. E. / Castillo, D. / Cummings, S. et al. | 1996
- 082
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Advanced MCM-Ds Break the I/O Bottleneck with Embedded Area-Array Integrated CircuitsGravrok, R. / Scheid, D. / Ficke, J. T. / VanGoor, K. A. et al. | 1996
- 088
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A Hermetic Thin Film Sealing Technology for MCM-DMcHerron, D. / Toy, H. / Cammarano, A. et al. | 1996
- 088
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A Hermetic Thin Films Sealing Technology for MCM-DMcHerron, D. / Toy, H. / Cammarano, A. et al. | 1996
- 094
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Thermally Stable Thin Film Tantalum Pentoxide CapacitorPeters, M. G. / Lee, M. G. / Takahashi, Y. / Beilin, S. et al. | 1996
- 100
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Design and Fabrication of a High Speed Multichip ModulePeltier, J. / Hansford, W. / Emerling, M. / Parrish, P. et al. | 1996
- 108
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A 480-MFLOP MCM Based on the SHARC DSP Chip, Breaks the MCM Cost BarrierScannell, R. K. et al. | 1996
- 108
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A 480-MFLOP MCM Based on the Sharp DSP Chip, Breaks the MCM Cost BarrierScannell, R. K. et al. | 1996
- 113
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High-Bandwidth Low-Latency 3D Memory ModuleFicke, J. / Gravrok, R. J. / Hokanson, K. E. / Berry, C. J. et al. | 1996
- 119
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The Modular Design and Realization of a 35 GHz Phase Shifter ReceiverOppermann, M. / Feurer, E. / Holl, B. / Schroth, J. et al. | 1996
- 125
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A Set of Multichip Modules for High Speed Telecom ApplicationsLicciardi, L. / Peretti, M. / Pilati, L. / Ichai, J. J. et al. | 1996
- 131
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HAM: A Cost Effective, High Speed ATM Switching Matrix Using MCM-L and Bumpless TABJoly, J. / Lambert, D. / Plaza, P. et al. | 1996
- 137
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MCM Application: Automotive Case StudiesDall'Agnese, P. et al. | 1996
- 142
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Low Cost MCM-L for Vehicle Applications: Innerlayer Materials and ProcessFuner, R. E. / Sullivan, C. / Rust, R. D. / Witty, M. et al. | 1996
- 147
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Fault and Yield Modelling of MCMs for Automotive ApplicationsWilliamson, S. T. / Singh, A. D. / Nelson, V. P. et al. | 1996
- 147
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Fault and Yield Modeling of MCMs for Automotive ApplicationsWilliamson, S. T. / Singh, A. D. / Nelson, V. P. et al. | 1996
- 155
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Thermo-Mechanical Design of Flip Chips for Harsh EnvironmentsMichaelides, S. / Sitaraman, S. et al. | 1996
- 155
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Thermo-Mechnical Design of Flip Chips for Harsh EnvironmentsMichaelides, S. / Sitaraman, S. et al. | 1996
- 161
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Significance of Design Parameters on the Thermal Fatique Life of Plastic Ball Grid ArraysSyed, A. R. et al. | 1996
- 167
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Lid Deflection for MCMs in Airborne ApplicationHuey, K. / Hodges, C. R. / Benson, D. / Nguyen, S. et al. | 1996
- 173
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Environmentally Protected Chip On Board for Military and Aerospace ApplicationsPlite, G. J. et al. | 1996
- 179
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Pushing the State-of-the-Art in MCM-L Design: Ultra Dense, Low-Cost "Smart Gasket" ApplicationsLadd, S. et al. | 1996
- 183
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Clay Field Configurable Multi-Chip Module (FCMCM)Nguyen, L. / Garverick, T. / Field, C. et al. | 1996
- 187
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Summary of Results from the Known Good Devices ProgramMango, S. / Palmer, N. et al. | 1996
- 193
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Reliability Modeling of MCMs - RELTECH Lessons LearnedNewell, J. M. / Larson, T. W. / Gersch, G. R. / Stoklosa, M. et al. | 1996
- 199
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System Level Functional Test Generation Methodology for Multichip ModulesWenzel, J. / Foster, S. / Hui, C. S. / Green, M. et al. | 1996
- 205
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MCM Test Vectors from Logic SimulationFlint, A. et al. | 1996
- 210
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Lessons Learned from Two Complex MCM DesignsCampinell, B. / Mango, S. / Scire, J. et al. | 1996
- 216
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A Signal Noise Comparison of the Interconnected Mesh Power System (IMPS) with a Standard Four-Layer MCM TopologyGlober, M. D. / Parkerson, J. P. / Schaper, L. W. et al. | 1996
- 220
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Integrated SystemsBartelink, D. J. et al. | 1996
- 226
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MCM Market: New Applications in a Mature Industry?Jan Vardaman, E. / Crowley, R. T. et al. | 1996
- 230
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MCM Design Methodology for Portable Wireless Communication Systems DesignGoyal, R. / Tripathi, V. et al. | 1996
- 234
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Slimcase - An Ultra Thin Chip Size Integrated Circuit PackageBadihi, A. / Schlomovich, N. / De-La-Vega, M. / Karligano, N. et al. | 1996
- 239
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A Comparative Analysis of High Density PWB TechnologiesAday, J. G. / Tessier, T. G. / Crews, H. / Rasul, J. et al. | 1996
- 245
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A Silicon-on-Silicon MCM Base-Band Controller for a Spread-Spectrum RadioSimmons, W. D. / Johnson, M. G. / Han, B. J. / Frye, R. C. et al. | 1996
- 245
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A Silicon-on-Silicon MCM Base-Band Controller for a Spread-Sprectrum RadioSimmons, W. D. / Johnson, M. G. / Han, B. J. / Frye, R. C. et al. | 1996
- 250
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Novel Low-Cost Process Technologies for Application and Curing of Polyimide FilmsBagen, S. / Newquist, C. / Gibson, G. / Melgaard, H. et al. | 1996
- 257
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Chip Scale Packaging with High Reliability for MCM ApplicationsLoboda, M. / Camilletti, R. C. / Goodman, L. A. / White, G. L. et al. | 1996
- 263
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High Density Thin Film Flexible InterconnectorPeters, M. G. / Chou, W. / Lee, M. / Mansingh, V. et al. | 1996
- 269
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Low Cost Copper Plating MCM-D TechnologyFinardi, C. A. / Almeida, A. M. / Barnett, M. / Flacker, A. et al. | 1996
- 275
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Wafer Level Membrane Probe Testing of Area Array Die for Manufacturing High Performance MCMsBlossfield, K. / Brotman, A. / Gravrok, R. / VanGoor, K. et al. | 1996
- 281
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SRAM Known Good Die Test ExperienceMoberg, P. et al. | 1996
- 281
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SRMA Known Good Die Test ExperienceMoberg, P. et al. | 1996
- 287
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A Pragmatic Look at Wafer Level Burn-In: The Wafer-Level Known Good Die ConsortiumFlynn, W. G. / Gilg, L. et al. | 1996
- 293
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Known Good Die Program Implementation Case Study: Intel SmartDie[TM] ProductsAvalos, J. / Agahdel, F. et al. | 1996
- 299
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Extension of the Chip-Flex Technology to Known Good DieBurdick, W. E. / Fillion, R. et al. | 1996
- 299
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Extension of the Chip-on-Flex Technology to Known Good DieBurdick, W. E. / Fillion, R. et al. | 1996
- 305
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Using Tape and Reel for High Volume Packaging of Bare DieBird, G. et al. | 1996
- 310
-
Using Topological Die Mapping with Electrical Fault Detection to Improve Yield in Known Good Die MCMsArnold, R. / Prevedel, D. et al. | 1996
- 310
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Using Topological Die Mapping with Electrical Fault Detection to Improve Process Yield in Known Good Die MCMsArnold, R. / Prevedel, D. et al. | 1996
- 317
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Thermo-Mechanical Analysis and Fatique Life Prediction of MCM-D InterconnectsLarson, T. W. / Newell, J. M. / Cornford, S. L. et al. | 1996
- 323
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Refining MCM Thermal Simulation Models with Test VehiclesBennett, D. / DeMuth, B. T. / Pines, B. E. et al. | 1996
- 329
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Modeling Interconnect Coupling Between Analog, Digital and RF Layout Components for MCM DesignsTripathi, V. / Seo, Y. / Tripathi, A. / Lutz, R. D. et al. | 1996
- 333
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Performance Comparison of Discrete and Buried CapacitorsSen, B. K. / Liou, J.-Y. / Adachi, H. / Wheeler, R. et al. | 1996
- 339
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MCM-D Manufacturing for the 21st Century: The Facility, The Product, The CostDieffenbach, J. R. / Adams, B. B. et al. | 1996
- 345
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Low-Cost Flip Chip ConsortiumNguyen, L. et al. | 1996
- 351
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Demonstration of a Chip Scale, Chip-on-Flex TechnologyFillion, R. A. / Wojnarowski, R. / Saia, R. / Kuk, D. et al. | 1996
- 352
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Design Trade-Offs of MCM-C versus. Ball Grid Array on Printed Wiring BoardHorowitz, S. / Amey, D. / Page, J. / Ladd, S. et al. | 1996
- 357
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Wire Button Contact Retainer Board for 3-D Interconnected MCM'sAckerman, R. E. / Schaefer, D. A. et al. | 1996
- 362
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Reverse Beam-Lead Interconnections for Ultra High-Speed Multichip ApplicationsNohr, W.-D. / Hanke, G. et al. | 1996
- 369
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A Fine-Pitch Leadless Chip Assembly Technology with the Built-Up PCBTanaka, K. / Bonkohara, M. / Dohya, A. / Shimada, T. et al. | 1996
- 375
-
Jedi (J-90) System Upgrade: A Case Study of the Memory Bar ModuleGlass, C. / Nelson, D. F. / Rao, V. B. et al. | 1996
- 380
-
New Olefinic Interlevel Dielectric Materials for Multi-Chip ModulesKohl, P. / Bidstrup-Allen, S. A. / Grove, N. R. / Schick, R. A. et al. | 1996
- 385
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A Low Cost Near-Hermetic Multichip Module Based on Liquid Crystal Polymer DielectricsNoll, T. E. / Jayaraj, K. / Farrell, B. / Larmouth, R. S. et al. | 1996
- 391
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On the Effective Intergration of Resistors and Capacitors into a MCM-Si DesignLernout, J. / Van Calster, A. / Schols, G. et al. | 1996
- 392
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CLAy Field Configurable Multichip ModuleNguyen, L. / Garverick, T. / Field, C. et al. | 1996
- 397
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Ultrasonic Bonding Tools for Fine Pitch, High Reliability InterconnectDemmin, J. C. et al. | 1996
- 398
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The Transformation of Multichip Module Logic Simulation Results into Test Vectors Suitable for Application on Automatic Test EquipmentFlint, A. et al. | 1996
- 403
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A Novel Aluminum on Quartz Mask for Excimer Laser Projection AblationPatel, R. S. / Speidell, J. / Cordes, S. et al. | 1996
- 409
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Stress-Free Thermoplastic Adhesives for High Reliability Microelectronics ApplicationsMonti, C. T. / Chung, K. et al. | 1996
- 462
-
A Fine Pitch, Lead-Less Chip Assembly Technology on the Built-Up PCBTanaka, K. / Bonkohara, M. / Dohya, A. / Shimada, T. et al. | 1996
- 475
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High Frequency Performance Comparison of MCM-C MaterialsMuller, J. / Thust, H. / Schwanke, D. et al. | 1996
- 483
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Passive Components in Electronic Applications: Requirements and Prospects for IntegrationFrye, R. C. et al. | 1996
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A New Low Cost - High Performance MCM Substrate TechnologyNeftin, S. / Mirsky, U. et al. | 1996