Implementing High Performance Graphics Subsystems with Complex IC Technology (English)
- New search for: Beal, S. W.
- New search for: Avery, G.
- New search for: Brown, S.
- New search for: Wiggin, A.
- New search for: International Microelectronics and Packaging Society
- New search for: International Society for Hybrid Microelectronics
- New search for: Beal, S. W.
- New search for: Avery, G.
- New search for: Brown, S.
- New search for: Wiggin, A.
- New search for: International Microelectronics and Packaging Society
- New search for: International Society for Hybrid Microelectronics
In:
Microelectronics
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500-505
;
1997
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ISBN:
- Conference paper / Print
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Title:Implementing High Performance Graphics Subsystems with Complex IC Technology
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Contributors:Beal, S. W. ( author ) / Avery, G. ( author ) / Brown, S. ( author ) / Wiggin, A. ( author ) / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics
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Conference:International symposium, Microelectronics ; 1997 ; Philadelphia; PA
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Published in:Microelectronics ; 500-505
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Publisher:
- New search for: IMAPS
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Place of publication:ISHM
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Publication date:1997-01-01
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Size:6 pages
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Remarks:See also 8238.774 vol 20 no 11 1997 for report and programme. See also 6823.100 vol 3235 1997 for proceedings
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 001
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Surface Micromachined Solenoid Inductors for High Frequency ApplicationsKim, Y.-J. / Allen, M. G. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 007
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Coupling Between Adjacent Finite Ground Coplanar (FGC) WaveguidesPonchak, G. E. / Tentzeris, E. / Katehi, L. P. B. / International Microelectronics and Packaging Society et al. | 1997
- 011
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RF-Characterization of Landless Via Structures in MCM-L TechnologyThiel, A. / Habiger, C. / Troster, G. / Jacob, T. / International Microelectronics and Packaging Society et al. | 1997
- 017
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The Multilayer Ceramic Integrated Circuits (MCIC) Technology: Opportunities and ChallengesWilcox, D. L. / Huang, R.-F. / Anderson, D. / International Microelectronics and Packaging Society et al. | 1997
- 024
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Solid State RF/Microwave Technology for Wireless ApplicationsEdwards, T. / Williams, D. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 029
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System Integration for High Frequency ApplicationsWolf, J. / Reichl, H. / Ehrmann, O. / Buschick, K. / International Microelectronics and Packaging Society et al. | 1997
- 037
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Integrating Multiple Dielectric Constants in Ceramic ModulesDanner, P. A. / International Microelectronics and Packaging Society et al. | 1997
- 042
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Design of Experiments Used to Optimize Wirebonding and Plasma Cleaning for HybridsOpp, S. R. / Thacker, T. R. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 048
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Performance of Buried Resistors in Green Tape[TM]951Thust, H. / Drue, K.-H. / Thelemann, T. / Polzer, E. / International Microelectronics and Packaging Society et al. | 1997
- 054
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Large Area Processing (LAP): Performance Studies on Extrusion CoatingWells, G. T. / Gibson, G. / Newquist, C. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 060
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Low-K Dielectric for High Frequency MicrocircuitsNabatian, D. J. / He, F. / Kellerman, D. / International Microelectronics and Packaging Society et al. | 1997
- 065
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Highly Reliable and Lead (Pb) Free Thick Film Resistor Paste System for Low Thermal Expansion LTCC ApplicationFukaya, M. / Matsuo, T. / Nishigaki, S. / Higuchi, C. / International Microelectronics and Packaging Society et al. | 1997
- 072
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Thermal Impedance and Stress in a Power Package Due to Variations in Layer ThicknessHopkins, D. C. / Pitarresi, J. M. / Karker, J. A. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 078
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Power Electronics Combines with MCM Technology to Create Multi-Chip Power ModulesPorter, E. / Ang, S. / Burgers, K. / Glover, M. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 084
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Miniaturization of Power Supplies with Emphasis on Integrated Passive ComponentsHoagland, R. W. / Barlow, F. / Elshabini-Riad, A. / International Microelectronics and Packaging Society et al. | 1997
- 090
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Advanced Copper-Refractory Metal Matrix Composites for Packaging Heat Sink ApplicationsJech, D. E. / Sepulveda, J. L. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 097
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Introduction of 250V and 600V GaAs Power Rectifiers for High Performance Power Supply ApplicationsSalih, A. S. M. / Hadizad, P. / Shumate, J. / Ommen, J. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 102
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High Density Power Modules: A Packaging StrategyLostetter, A. / Webster, J. / Hoagland, R. / Barlow, F. D. / International Microelectronics and Packaging Society et al. | 1997
- 108
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Ball Grid Array: Double Side and Reduced Pitch Advanced Assembly ProcessesMilkovich, C. / International Microelectronics and Packaging Society et al. | 1997
- 109
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A Review and Prediction of Chip Scale Solder Joint ReliabilityGhaffarian, R. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 111
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Practical Design Issues to Bump and FlipBogdanski, J. / Leal, J. / Yang, H. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 116
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Low Cost Chip-Scale BGA Packaging for Portable and Other Miniature Product ApplicationsSolberg, V. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 122
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CBGA for AMD's Flip Chip Microprocessor ApplicationMaster, R. N. / Dolbear, T. / Cole, M. / Martin, G. / International Microelectronics and Packaging Society et al. | 1997
- 124
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Reliability Evaluation of Underfill in Flip Chip Organic BGA PackagesBanks, D. / Pofahl, R. / Sylvester, M. / International Microelectronics and Packaging Society et al. | 1997
- 126
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Electro-optic Probing: A Laser-Based Solution for Noninvasive High-Speed Testing of Multichip ModulesMechtel, D. M. / Charles, H. K. / Francomacaro, A. S. / International Microelectronics and Packaging Society et al. | 1997
- 131
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A Unique Package Design for Digital Micromirror Devices[TM]Klonis, H. / International Microelectronics and Packaging Society et al. | 1997
- 138
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Development of Seamless High Off-Chip ConnectivityDibbs, M. / Garrou, P. / Chau, C. C. / So, Y. / International Microelectronics and Packaging Society et al. | 1997
- 144
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Jet Vapor Deposition: A New, Low Cost Metallization ProcessZhang, J.-Z. / Golz, J. W. / Gorski, M. / Schmitt, J. J. / International Microelectronics and Packaging Society et al. | 1997
- 150
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Large Area Processing: Meniscus Coating of Thin Film Polymer Dielectric & PhotoresistGarrou, P. / Martin, B. / Rehg, T. / Heistand, R. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 157
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Development of Multi-Chip Modules with Integrated Thin Film Passive ElementsKim, N. P. / Coates, K. L. / Kunze, G. G. / Chien, C.-P. / International Microelectronics and Packaging Society et al. | 1997
- 164
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Development of Tapeless Lead-On-Chip (LOC) Packaging Process with l-Line Photosensitive PolyimideAmagai, M. / Saitoh, T. / Ohsumi, M. / Kawasaki, E. / International Microelectronics and Packaging Society et al. | 1997
- 164
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Development oF Tapeless Lead-On-Chip (LOC) Packaging Process with I-Line Photosensitive PolyimideAmagai, M. / Saitoh, T. / Ohsumi, M. / Kawasaki, E. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 170
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Damage-free All-dry Via Etch Resist and Residue Removal ProcessesChaudhary, N. / Guerra, R. / Cole, B. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 174
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Process Control of Material Deposition by Meniscus Coating for Low-Cost MCM PrototypingKrauss, A. / Kamen, E. / Chng, C. / The, A. / International Microelectronics and Packaging Society et al. | 1997
- 180
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Epoxy Package Materials and Condition for In-Line Molding and Curing SystemHwang, C.-S. / Kim, S.-E. / Lee, C.-W. / Choi, W.-G. / International Microelectronics and Packaging Society et al. | 1997
- 185
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An Evaluation of Thermoplastic Materials and Injection Molding as a Discrete Power Semiconductor Packaging AlternativeMays, L. / Hubenko, A. / International Microelectronics and Packaging Society et al. | 1997
- 191
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Second Generation Die and Substrate Attach Flexible Film AdhesiveChung, K. / International Microelectronics and Packaging Society et al. | 1997
- 197
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Plastic SMD Package Technology for AccelerometersStalnaker, W. M. / Spangler, L. / Fehr, G. / Fujimoto, G. / International Microelectronics and Packaging Society et al. | 1997
- 203
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Dual-Block Assembled Microelectronics Tactile SensorGandelli, A. / Lazzaroni, M. / Ottoboni, R. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 209
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Degradation of Sensitivity in Silicon Lateral Transistor Magnetic SensorsChu, H. S. / Guvench, M. G. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 215
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One-Part Fluorosilicone Gel Materials for Automotive Sensor ApplicationsAlvarez, K. / Maxson, M. T. / Norris, A. W. / Van Weft, B. / International Microelectronics and Packaging Society et al. | 1997
- 220
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Characterization of Thick Film Hydrogen SensorKwan, K. S. / Lumpp, J. K. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 226
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Thermal Characterization of Thin Polymer Films Using a Surface Acoustic Wave SensorMileham, R. D. / Sternhagen, J. D. / Galipeau, D. W. / International Microelectronics and Packaging Society et al. | 1997
- 232
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Advance Packaging Technology for the Mini Notebook ComputerHappoya, A. / Takahashi, K. / Igarashi, Y. / Nishimura, K. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 238
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A New Digital Cellular Phone Using Advanced High-density CIB Package TechnologyFujisaki, H. / Tanaka, Y. / Yoshimura, T. / International Microelectronics and Packaging Society et al. | 1997
- 244
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CSP (Chip Size Package) Technology for Mobile ApparatusesKosuga, K. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 250
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MCM-L/D for Mobile ComputerHirano, Y. / Fujii, A. / Tsunoi, K. / Baba, S. / International Microelectronics and Packaging Society et al. | 1997
- 256
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CSP Packaging and Mounting Technologies for Mobile ApparatusKimura, T. / Yamaji, Y. / Juso, H. / Ohara, Y. / International Microelectronics and Packaging Society et al. | 1997
- 262
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Bonding Heavy Al Wire to Thin Lead FramesArellano, V. / Williams, C. / International Microelectronics and Packaging Society et al. | 1997
- 267
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Auto Wedge Bonding to GaAs MMICsTai, T. / Delumpa, K. / International Microelectronics and Packaging Society et al. | 1997
- 272
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Integrated Solutions to Bonding BGA Packages: Capillary, Wire, and Machine ConsiderationsChristie, L. / Levine, L. / Eshelman, M. / International Microelectronics and Packaging Society et al. | 1997
- 278
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MCM-ALIVH Using SBB Flip-Chip Bonding TechniqueAmami, K. / Yuhaku, S. / Shiraishi, T. / Bessho, Y. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 284
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Initial Development Work on a High Throughput Low Cost Flip Chip on Board Assembly ProcessMcGovern, L. P. / Baldwin, D. F. / International Microelectronics and Packaging Society et al. | 1997
- 290
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Transient Thermal and Stress Analysis for TSOP DevicesFan, M. / Rose, G. / International Microelectronics and Packaging Society et al. | 1997
- 296
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A Step Forward in the Transient Thermal Characterization of PackagesSzekely, V. / Rencz, M. / Courtois, B. / International Microelectronics and Packaging Society et al. | 1997
- 302
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Composite Diamond Heat SpreaderNagai, M. / Yamamoto, Y. / Tanabe, K. / Kumazawa, Y. / International Microelectronics and Packaging Society et al. | 1997
- 307
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Substrate Embedded Heat Pipes Compatible With Ceramic Cofire ProcessingZampino, M. A. / Jones, W. K. / International Microelectronics and Packaging Society et al. | 1997
- 314
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Development of Test Vehicles for Evaluating Plastic-Encapsulant Reliability and Improving Thermal Conductivity of Encapsulant MaterialsEnlow, L. R. / Swanson, D. W. / Naito, C. M. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 322
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A Very Compact Multilayer Folded Stripline FilterGipprich, J. / Stevens, D. / Wilson, C. / International Microelectronics and Packaging Society et al. | 1997
- 326
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Advanced T/R Module Packaging for Active Phased Array AntennasPiloto, A. / Strack, D. / Ferrell, G. / Parks, S. / International Microelectronics and Packaging Society et al. | 1997
- 332
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Advanced LTCC Ferrite Technology for Low Cost Phase Shifters in Emerging RF SystemsPiloto, A. / Partlow, D. / Painter, C. / Tolle, S. / International Microelectronics and Packaging Society et al. | 1997
- 338
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Microwave Performance Characterization of an Advanced Thick Film Materials SystemBarnwell, P. G. / Wood, J. / Free, C. / Li, D. / International Microelectronics and Packaging Society et al. | 1997
- 344
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Thick Film Temperature Variable AttenuatorsMarie, M. J. / Mazzochette, J. / Freingold, H. / Amstutz, P. / International Microelectronics and Packaging Society et al. | 1997
- 350
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Frequency Behavior of Ground Plane Via Interconnections in Multilayer LTCC-ModulesThelemann, T. / Thust, H. / International Microelectronics and Packaging Society et al. | 1997
- 356
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Submicron X7R Dielectric MaterialsLiu, X. / Randall, C. A. / Cheng, S. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 362
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Reliability Prediction of Multilayer Ceramic Capacitors Using an Improved Accelerated Life Test and Weibull Analysis TechniquePak, H. / Rawal, B. / International Microelectronics and Packaging Society et al. | 1997
- 368
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Thermochemistry of Electrodes in Electroceramic ApplicationsCann, D. / Randall, C. A. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 374
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Intermediate Thickness Films Formed By Electrophoretic DepositionVan Tassel, J. / Randall, C. A. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 380
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Cordierite Based Glass-Ceramic Thick Films on a Polycrystalline LiZn Ferrite SubstrateCho, Y. S. / Schulze, W. A. / Amarakoon, V. R. W. / International Microelectronics and Packaging Society et al. | 1997
- 385
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Effect of Mechanical Shock and Vibration on the Second-level Temperature Cycling Reliability of Ceramic Ball Grid Arrays with a Continuous Compressive Load AppliedDolbear, T. / Master, R. / Cole, M. / Martin, G. / International Microelectronics and Packaging Society et al. | 1997
- 390
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Interconnect Resistance Characteristics of Several Flip-Chip Bumping and Assembly TechniquesNicewarner, E. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 396
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Ball Grid Array Reliability Assessment for Aerospace ApplicationsGhaffarian, R. / Kim, N. P. / International Microelectronics and Packaging Society et al. | 1997
- 402
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Evaluation of Reliability of BGA Solder Joints through Twisting and BendingPerera, U. D. / International Microelectronics and Packaging Society et al. | 1997
- 408
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BGA Solder Bumping Options and ConcernsLee, N.-C. / Chiu, C. S. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 417
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Advanced Copper Column Based Solder Bump for Flip-Chip InterconnectionYamada, H. / Togasaki, T. / Tateyama, K. / Higuchi, K. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 423
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Accurate Time Domain Measurement and Probing of High Speed Digital Circuit BoardsGodshalk, E. / Lutz, R. / Tripathi, A. / Tripathi, V. / International Microelectronics and Packaging Society et al. | 1997
- 427
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Capacitance Characterization of Surface Mount Electronics PackagesWen, Y. / Tsai, C.-T. / International Microelectronics and Packaging Society et al. | 1997
- 433
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Creating Design Rules for Interconnect Substrates with a Field SolverBogatin, E. / International Microelectronics and Packaging Society et al. | 1997
- 437
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Evaluating Thermal Packaging Concepts Using Thermal ImpedanceRiemer, D. E. / International Microelectronics and Packaging Society et al. | 1997
- 443
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Transient Thermal Modeling of Modular RF Power AmplifiersHuston, K. D. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 449
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Heat Sink Numerical Simulation With Icepak Using Compact Heat Sink Modeling TechniquesMarongiu, M. / Kusha, B. / Warwe, A. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 455
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Development of a C4-BGA Assembly Process - Innovations in C4 Flux and Underfill MaterialsPendse, R. D. / Courtis, M. / Serrano, B. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 462
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Voiding in BGA at Solder Bumping StageChiu, C. S. / Lee, N.-C. / Randle, K. / Parrish, C. / International Microelectronics and Packaging Society et al. | 1997
- 472
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Implementing High Density, Cu/BCB Thin Film Interconnect on Glass Substrates for a Portable Telecom ApplicationDeshpande, U. / Chazen, D. / Skinner, M. / Theide, H. / International Microelectronics and Packaging Society et al. | 1997
- 476
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Chip On Glass (COG) Technology and Its ReliabilityKim, S.-I. / Kang, S. / International Microelectronics and Packaging Society et al. | 1997
- 482
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Cooling Assessment and Distribution of Heat Dissipation of a Cavity Down Plastic Ball Grid Array Package - NuBGALau, J. H. / Chen, T. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 494
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Batch-Fabricated Microjet Coolers for Electronic ComponentsLagorce, L. K. / Kercher, D. / English, J. / Brand, O. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 500
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Implementing High Performance Graphics Subsystems with Complex IC TechnologyBeal, S. W. / Avery, G. / Brown, S. / Wiggin, A. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 506
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Highly Reliable Carrier for CSP Using Low Temperature Cofired CeramicsUnno, H. / Ishikawa, H. / Kudo, Y. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 512
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A Lead Free, Mixed Metals Low Temperature Cofire Ceramic Materials SystemO'Neill, M. P. / Modes, C. / International Microelectronics and Packaging Society et al. | 1997
- 517
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High Density Gold Thick Film TechnologyKeusseyan, R. I. / Speck, B. / Chaplinsky, J. / Amey, D. / International Microelectronics and Packaging Society et al. | 1997
- 522
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Thick Film Conductors for 175C Operation in Automotive ElectronicsNabatian, D. J. / Shahbazi, S. / Brown, O. / Schaller, S. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 529
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Ceramic Ball Grid Array Resistor NetworksBloom, T. R. / International Microelectronics and Packaging Society et al. | 1997
- 534
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Evaluating Popcorn Resistance of Memory Devices in SMT Assembly Processes and Upscreening and High-Temperature Storage Evaluation of Plastic Encapsulated Microcircuits (PEMs)Enlow, L. R. / Swanson, D. W. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 542
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A Simple Method for Optimizing Screen Print ParametersAhmad, S. / Jiang, T. / Moden, W. / International Microelectronics and Packaging Society et al. | 1997
- 546
-
MCM-L Moisture Removal DOE: A Novel Approach to Low Cost Hermetic PackagingBoone, A. P. / International Microelectronics and Packaging Society et al. | 1997
- 551
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Technology Insertion and Process Improvements - A Case StudySpreckels, C. / Green, T. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 557
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Statistical Modeling of Interfacial Damage of Nonhermetically Sealed Electronic Devices: Development and Application of the Methodology for Statistical Observations and AnalysisPark, J. / Harlow, D. G. / Nied, H. F. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 563
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A Computer Simulation for Capacity OptimizationWiesendanger, C. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 568
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Combining Laser Direct Pattern Transfer with Conventional Wet Chemical Etching: A New Approach for Fine-Line MCM-L PrototypingHarsanyi, G. / Illyefalvi-Vitez, Z. / Pinkola, J. / Toth, E. / International Microelectronics and Packaging Society et al. | 1997
- 574
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A New Small CTE System from COPNA Resin/E-glass FabricsNawa, K. / Ohkita, M. / International Microelectronics and Packaging Society et al. | 1997
- 579
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Preliminary In-Process Stress Analysis of Flip-Chip Assemblies During UnderfillPalaniappan, P. / Baldwin, D. F. / International Microelectronics and Packaging Society et al. | 1997
- 586
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Reduced Oxide Soldering Activation (ROSA): Enabling Technology for Soldering of Flip Chip AssembliesHillman, D. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 592
-
Fully integrated Passives Modulus for Filter Applications Using Low Temperature ProcessesPark, J. Y. / Bhattacharya, S. / Allen, M. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 592
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Fully Integrated Passives Modules for Filter Applications Using Low Temperature ProcessesPark, J. Y. / Bhattacharya, S. / Allen, M. / International Microelectronics and Packaging Society et al. | 1997
- 598
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Economic Analysis of Jet Deposition Through Technical Cost ModelingTrogolo, J. M. / Wzorek, J. / Bhatkal, R. M. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 604
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Reliability Model for Micro-Miniature Electronic PackagesDougherty, D. / Fusaro, J. / Culbertson, D. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 612
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The Effect of Diamond Scribe Short Removal on the Mechanical Integrity of Alumina SubstatesPerdieu, L. H. / Tuohig, W. D. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 618
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Corrosion and Corrosion Control for Metallized MCMs and Hybrid CircuitsBaudrand, D. W. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 623
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Robustness of Deformed Ceramic Column Grid Array ColumnsMae Ingalls, E. / Jozwiak, J. I. / International Microelectronics and Packaging Society et al. | 1997
- 628
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Guidelines for Implementing Statistical Process Control in Printed Circuit Board ManufacturingDogdu, S. / Santos, D. / Dougherty, T. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 634
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Effect of Design Parameters on Overstress Characterization of Thick Film Resistors for Lightning Surge ProtectionVasudevan, S. / International Microelectronics and Packaging Society et al. | 1997
- 641
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Improved Adhesion of Thick Film Conductor Paste to Alumina SubstratesMetke, N. W. / Taylor, B. / Gall, T. / International Microelectronics and Packaging Society et al. | 1997
- 648
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Structural Fuzzy-Logic Polymer Thick Film SensorsCiez, M. / Wojewodzki, T. / Gondek, J. / International Microelectronics and Packaging Society et al. | 1997
- 653
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Determining the Thermal Conductivity of Thermal Vias in Tape DielectricsKrum, A. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 659
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Realization of LTCC-Multilayer with Special Cavity ApplicationsBauer, R. / Luniak, M. / Rebenklau, L. / Wolter, K.-J. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 665
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Development of a Hybrid Microcircuit Test Vehicle for Surface Mount ApplicationsHernandez, C. L. / Hosking, F. M. / Vianco, P. T. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 671
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An Analysis of Precision, Fly-Through Solder Jet Printing for DCA ComponentsMuntz, E. P. / Orme, M. E. / Pham-Van-Diep, G. C. / Godin, R. / International Microelectronics and Packaging Society et al. | 1997
- 681
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Solder Jet Technology UpdateWallace, D. B. / Hayes, D. J. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 685
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A Cofired Bump Bonding Technique for Chip-Scale-Package Fabrication Using Zero X-Y Shrinkage Low Temperature Cofired Ceramic SubstrateItagaki, M. / Hase, N. / Yuhaku, S. / Bessho, Y. / International Microelectronics and Packaging Society et al. | 1997
- 691
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Solder Joint Reliability of a Low Cost Chip Size Package - NuCSPLau, J. H. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997
- 697
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Small Thick Film Solder Pad IntegrityErickson, M. / Mason, R. C. / Bolton, P. J. / International Microelectronics and Packaging Society / International Society for Hybrid Microelectronics et al. | 1997