Chemical-Mechanical Planarization of the Polymer Interlayer Dielectrics (English)
- New search for: Murarka, S. P.
- New search for: Materials Research Society
- New search for: Murarka, S. P.
- New search for: Chiang, C.
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In:
Low-dielectric constant materials for microelectronics applications
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277-290
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1998
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ISBN:
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ISSN:
- Conference paper / Print
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Title:Chemical-Mechanical Planarization of the Polymer Interlayer Dielectrics
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Contributors:
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Conference:Symposium; 4th, Low-dielectric constant materials for microelectronics applications ; 1998 ; San Francisco; CA
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Published in:MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS ; 511 ; 277-290
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Publisher:
- New search for: Materials Research Society
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Place of publication:Warrendale, Pa.
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Publication date:1998-01-01
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Size:14 pages
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Remarks:Held as part of the 1998 MRS Spring meeting
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ISBN:
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ISSN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
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Overview of Process Integration Issues for Low-K DielectricsHavemann, R. H. / Jain, M. K. / List, R. S. / Ralston, A. R. / Materials Research Society et al. | 1998
- 15
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Fundamental Aspects of Polymer MetallizationFaupel, F. / Strunskus, T. / Kiene, M. / Thran, A. / Materials Research Society et al. | 1998
- 27
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Liquid-Phase Deposition of Low-K Organic Silicon-Oxide FilmsUsami, K. / Sugahara, S. / Sumimura, K. / Matsumura, M. / Materials Research Society et al. | 1998
- 33
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Properties Development During Curing of Low Dielectric-Constant Spin-On GlassesCook, R. F. / Liniger, E. G. / Klaus, D. P. / Simonyi, E. E. / Materials Research Society et al. | 1998
- 39
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Experimental and Theoretical Study of Structure-Dielectric Property Relationships for PolysilsesquioxanesSung Mog Kim / Yoon, D. Y. / Nguyen, C. V. / Han, J. / Materials Research Society et al. | 1998
- 49
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Electron Beam Processing for Spin-On Polymers and its Applications to Back-End-of-Line (BEOL) IntegrationYang, J. J. / Gill, J. / Kennedy, J. / Wang, S.-Q. / Materials Research Society et al. | 1998
- 57
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Newly Developed Low-K and Low-Stress Fluorinated Silicon Oxide Utilizing Temperature-Difference Liquid-Phase Deposition TechnologyYeh, C.-F. / Lee, Y.-C. / Lee, S.-C. / Materials Research Society et al. | 1998
- 63
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Low-Dielectric Constant SiO(F,C) Films for ULSI Interconnections Prepared by CF~4 Plasma Ion ImplantationZhou, Y. / Qin, S. / Chan, C. / Chu, P. K. / Materials Research Society et al. | 1998
- 69
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Templating Nanopores into Poly(Methylsilsesquioxane): New Low-Dielectric Coatings Suitable for Microelectronic ApplicationsRemenar, J. F. / Hawker, C. J. / Hedrick, J. L. / Sung Mog Kim / Materials Research Society et al. | 1998
- 75
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Pulsed Plasma Enhanced Chemical Vapor Deposition from CH~2F~2, C~2H~2F~4, and CHClF~2Labelle, C. B. / Lau, K. K. S. / Gleason, K. K. / Materials Research Society et al. | 1998
- 87
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Phase Separation Behaviors of Polyimide BlendsRyu, C. H. / Bae, Y. C. / Materials Research Society et al. | 1998
- 93
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Pulsed Plasma Synthesis of Low-Dielectric Constant MaterialsHan, L. M. / Timmons, R. B. / Lee, W. W. / Materials Research Society et al. | 1998
- 99
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Fabrication and Characterization of Spin-On Silica Xerogel FilmsNitta, S. / Jain, A. / Pisupatti, V. / Gill, W. N. / Materials Research Society et al. | 1998
- 105
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Nanoporous Silica for Low-K DielectricsRamos, T. / Rhoderick, K. / Roth, R. / Brungardt, L. / Materials Research Society et al. | 1998
- 111
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Porous Silica: A Potential Material for Low-Dielectric Constant ApplicationsBirdsell, E. D. / Gerhardt, R. A. / Materials Research Society et al. | 1998
- 117
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Dielectric Properties of Glass Capillary ArraysHuber, T. E. / Silber, L. / Boccuzzi, F. / Materials Research Society et al. | 1998
- 125
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Ion Beam Techniques for Low-K Materials CharacterizationBakhru, H. / Kumar, A. / Kaplan, T. / Delarosa, M. / Materials Research Society et al. | 1998
- 133
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Adhesion Energy Measurements of Multilayer Low-K Dielectric Materials for ULSI ApplicationsShaffer, E. O. / Mills, M. E. / Hawn, D. / Van Gestel, M. / Materials Research Society et al. | 1998
- 139
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Optical Birefringence to Determine Morphological Changes in Low-K Thin Film CVD PolymersSenkevich, J. J. / Simkovic, V. / Desu, S. B. / Materials Research Society et al. | 1998
- 145
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Dielectric Anisotropy of Organic Interlayer Dielectrics Confined in SubmicronCho, T. H. / Ryan, E. T. / Ho, P. S. / Materials Research Society et al. | 1998
- 151
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Study of the Thermal Properties of Polymeric Dielectric Materials by Photothermal TechniqueHu, C. / Ogawa, E. T. / Hay, M. F. / Ho, P. S. / Materials Research Society et al. | 1998
- 157
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Characterization of Spin-On Glasses by MicroindentationSimonyi, E. E. / Lee, K.-W. / Cook, R. F. / Liniger, E. G. / Materials Research Society et al. | 1998
- 165
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Dielectric Behavior and Phonon Damping in Low-Dielectric Constant Perovskite MaterialsKatiyar, R. S. / Siny, I. / Guo, R. / Bhalla, A. S. / Materials Research Society et al. | 1998
- 171
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Stress-Corrosion Cracking of Spin-On Glass Thin FilmsCook, R. F. / Liniger, E. G. / Materials Research Society et al. | 1998
- 177
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A Novel Method to Determine the Mechanical Properties of Ultra-Thin FilmsWhite, C. C. / Wu, W. L. / Materials Research Society et al. | 1998
- 183
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Novel Technique for Measuring Through-Plane Thermo-Mechanical Properties of Thin Polymer FilmsPatel, K. S. / Bidstrup-Allen, S. A. / Kohl, P. A. / Hodge, T. C. / Materials Research Society et al. | 1998
- 191
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Characterization of PECVD Fluorinated Silicon Oxides and Stabilization of Interaction with MetalsKim, S. E. / Steinbruechel, C. / Kumar, A. / Bakhru, H. / Materials Research Society et al. | 1998
- 199
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Low-Dielectric Constant Materials Integration ChallengesRay, G. W. / Materials Research Society et al. | 1998
- 213
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Porous Silica Xerogel Processing and Integration for ULSI ApplicationsJin, C. / List, S. / Zielinski, E. / Materials Research Society et al. | 1998
- 223
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Integration Issues for Diamond-Like Carbon in a Copper Damascene Process FlowGrill, A. / Jahnes, C. / Patel, V. / Ott, J. / Materials Research Society et al. | 1998
- 233
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Thermal Stability and Structural Evolution of Low-K Fluorinated Amorphous Carbon During Thermal AnnealingYang, H. / Tweet, D. J. / Ma, Y. / Nguyen, T. / Materials Research Society et al. | 1998
- 241
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Process Integration Issues for Interlevel Dielectric Materials for Sub-Quarter Micron Silicon Integrated CircuitsParihar, V. / Singh, R. / Materials Research Society et al. | 1998
- 247
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Plasma Etching of Organic Low-Dielectric-Constant Polymers: Comparative AnalysisBaklanov, M. R. / Vanhaelemeersch, S. / Alaerts, C. / Maex, K. / Materials Research Society et al. | 1998
- 253
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Plasma Etching of Hydrogen-SilsesquioxaneLiu, Y. / McMillan, C. / Dall, F. / Materials Research Society et al. | 1998
- 259
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Integration Studies of Plasma Deposited Fluorinated Amorphous CarbonMountsier, T. W. / Samuels, J. A. / Swope, R. S. / Materials Research Society et al. | 1998
- 265
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High-Density Plasma Etching of Low-Dielectric Constant MaterialsStandaert, T. E. F. M. / Matsuo, P. J. / Allen, S. D. / Oehrlein, G. S. / Materials Research Society et al. | 1998
- 277
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Chemical-Mechanical Planarization of the Polymer Interlayer DielectricsMurarka, S. P. / Materials Research Society et al. | 1998
- 291
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Copper Damascene Using Low-Dielectric Constant Fluorinated Amorphous Carbon InterlayerMatsubara, Y. / Endo, K. / Iguchi, M. / Ito, N. / Materials Research Society et al. | 1998
- 297
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Polymerization of C-Si Films on Metal Substrates: Potential Adhesion/Diffusion Barriers for MicroelectronicsChen, L. / Kelber, J. A. / Materials Research Society et al. | 1998
- 305
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Reliability and Copper Interconnections with Low-Dielectric Constant MaterialsHu, C.-K. / Materials Research Society et al. | 1998
- 317
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Electrical Reliability of Cu and Low-K Dielectric IntegrationWong, S. S. / Loke, A. L. S. / Wetzel, J. T. / Townsend, P. H. / Materials Research Society et al. | 1998
- 329
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Polymer/Metal Interfaces in Interconnect Structures: Moisture Diffusion and Stress Corrosion EffectsMa, Q. / Tran, Q. / Pan, C. / Fujimoto, H. / Materials Research Society et al. | 1998
- 341
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Aluminum Wiring Reliability of Fluorinated Amorphous Carbon InterlayerIguchi, M. / Matsubara, Y. / Ito, S. / Endo, K. / Materials Research Society et al. | 1998
- 347
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Reliability of Cu/WN Thin Films Deposited on Low-Dielectric Constant SiOF ILDLee, S. / Dong Joon Kim / Yang, S.-H. / Park, J. / Materials Research Society et al. | 1998
- 353
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Electromigration Study of Al/Low-K Dielectric Line StructuresWang, P.-H. / Pellerin, J. G. / Fox, R. J. / Ho, P. S. / Materials Research Society et al. | 1998
- 359
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Influence of Moisture-Uptake on Mechanical Properties of Polymers Used in MicroelectronicsBuchhold, R. / Nakladal, A. / Gerlach, G. / Sahre, K. / Materials Research Society et al. | 1998
- 365
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Time-Dependent Reliability of the Interface Between A-C:F and Inorganic DielectricsEndo, K. / Shinoda, K. / Tatsumi, T. / Matsubara, Y. / Materials Research Society et al. | 1998
- 371
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Stability of Silicon-Oxygen-Fluorine and Carbon-Fluorine Low-K Dielectrics with Respect to Attack by WaterYang, H. / Lucovsky, G. / Materials Research Society et al. | 1998
- 377
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Adhesion Study in Aluminum/Polyimide SystemYoo, S. H. / Heo, S. J. / Kim, Y.-H. / Han, B. J. / Materials Research Society et al. | 1998