ULTRA WIDE FREQUENCY BAND CERAMIC PACKAGE AND ASSEMBLY TECHNOLOGY (English)
- New search for: Tsukiyama, Y.
- New search for: Shiobara, M.
- New search for: Hashimoto, M.
- New search for: Osakada, A.
- New search for: International Microelectronics and Packaging Society
- New search for: International Society for Optical Engineering
- New search for: Tsukiyama, Y.
- New search for: Shiobara, M.
- New search for: Hashimoto, M.
- New search for: Osakada, A.
- New search for: International Microelectronics and Packaging Society
- New search for: International Society for Optical Engineering
In:
Ceramic interconnect technology; 2003 IMAPS conference and exhibition on ceramic interconnect technology the next generation
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043-046
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2003
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ISBN:
- Conference paper / Print
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Title:ULTRA WIDE FREQUENCY BAND CERAMIC PACKAGE AND ASSEMBLY TECHNOLOGY
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Contributors:Tsukiyama, Y. ( author ) / Shiobara, M. ( author ) / Hashimoto, M. ( author ) / Osakada, A. ( author ) / International Microelectronics and Packaging Society / International Society for Optical Engineering
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Conference:Conference, Ceramic interconnect technology; 2003 IMAPS conference and exhibition on ceramic interconnect technology the next generation ; 2003 ; Denver, CO
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Published in:PROCEEDINGS- SPIE THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING ; 5231 ; 043-046
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Publisher:
- New search for: IMAPS
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Publication date:2003-01-01
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Size:4 pages
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 001
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DUAL MODE SWITCH DUPLEXER MODULES PACKAGED IN LTCC WITH 3D FEMNishikawa, T. / Mandai, H. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 007
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DEVELOPMENT OF MINIATURE BLUETOOTH MODULE FOR MANUFACTURABILITY USING A SYSTEM-IN-PACKAGE APPROACHCervin-Lawry, A. / Ali, K. / Bernacki, T. / Binapal, S. / Miortescu, C. / Patel, A. / Woo, P. / Woodward, L. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 012
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DESIGN CONSIDERATIONS FOR HYBRID LTCC-RF-FILTERSMuller, J. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 018
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LTCC BASED SLOW WAVE FILTERS FOR WIRELESS AND HANDHELD PRODUCTSMagableh, F. / Wang, V. / Elshabini, A. / Barlow, F. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 023
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INTERCONNECTION RELIABILITY STUDIES OF SOME CERAMIC COMPONENTS AND THE INTRODUCTION OF THE RESULTS INTO MTBF CALCULATIONSSalmela, O. / Andersson, K. / Sarkka, J. / Tammenmaa, M. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 029
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THERMOMECHANICAL RESPONSES AND RELIABILITY OF LTCC SOLDER ATTACHMENTS FOR WIRELESS APPLICATIONSFu, C.-Y. / Vo, P. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 035
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SIDE-FILL UNDERFILL FOR RF SAW PACKAGINGChang, M. / Lu, B. / Wu, K. / Fukui, T. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 039
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OVERMOLDED LTCC RF MODULESYang, J. / Darveaux, R. / Federigan, A. / Arellano, T. / Kim, S. B. / Khim, J. Y. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 043
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ULTRA WIDE FREQUENCY BAND CERAMIC PACKAGE AND ASSEMBLY TECHNOLOGYTsukiyama, Y. / Shiobara, M. / Hashimoto, M. / Osakada, A. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 047
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BROADBAND ELECTRICAL DESIGN AND MODELING OF PACKAGES INTEGRATED IN LTCC-SUBSTRATENisznansky, M. / Ziegler, C. / Schmidt, L.-P. / Hocke, R. / Wohlgemuth, O. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 053
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TELECOM MEMS PACKAGING IN CERAMICSRamsey, D. A. / Basavanhally, N. R. / Low, Y. L. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 058
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SCREEN PRINTED FEATURE SIZE CAPABILITIESHughes, D. C. / Ernster, S. E. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 063
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A HIGH DENSITY FLIP-CHIP INTERCONNECT TECHNOLOGY ON MULTILAYER CERAMIC SUBSTRATES FOR AUTOMOTIVE CONTROLLER APPLICATIONSBerlin, C. W. / Sarma, D. H. R. / Sozansky, W. A. / Zimmerman, D. W. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 069
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CONTINUED STUDY IN POWER MODULE SUBSTRATES FOR AUTOMOTIVE HARSH ENVIRONMENTSEasler, K. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 073
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PACKAGING AND INTERCONNECT FOR RF AND MICROWAVECollander, P. / Passiopoulos, G. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 079
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DESIGN AND MANUFACTURING OF INTEGRATED MODULES FOR WIRELESS AND RF APPLICATIONS USING MULTI-MIX® MICROTECHNOLOGY AND GREEN TAPE™ LTCC MATERIALSLogothetis, J. J. / Amey, D. I. / Mobley, T. P. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 085
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LTCC TECHNOLOGY FOR HIGH PERFORMANCE LOW POWER BASE STATION APPLICATIONSPassiopoulos, G. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 091
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CERAMIC TRIPLE-MODE DELAY FILTER FOR CELLULAR BASE STATION APPLICATIONSWang, W. / Wilber, W. / Engst, W. / Espina, R. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 095
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THE MEASUREMENT AND PRACTICAL SIGNIFICANCE OF COMPLEX PERMITTIVITY AT MM-WAVE FREQUENCIESFree, C. / Tian, Z. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 101
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BROADBAND PERMITTIVITY AND LOSS TANGENT MEASUREMENTS USING A SPLIT-CYLINDER RESONATORJanezic, M. D. / Baker-Jarvis, J. / Kuester, E. F. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 107
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FOUR-PORT ON-WAFER MEASUREMENTS OF COUPLED TRANSMISSION LINES ON LTCCZiegler, C. / Nisznansky, M. / Schmidt, L.-P. / Hocke, R. / Wohlgemuth, O. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 113
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USING DEFECT INFORMATION TO MANAGE LTCC YIELD AND MANUFACTURING COSTSArnold, B. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 118
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FACTORS AFFECTING CHARACTERISTICS OF THICK FILM VOLTAGE TUNABLE DIELECTRIC MATERIALSTang, X. / Ellis, M. E. / Duvall, F. / Treadway, B. / Underhill, E. / Chiu, L. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 122
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DIELECTRIC MATERIAL AND WAVEGUIDE DEVELOPMENT FOR LOW TEMPERATURE CO-FIRED CERAMICSLanagan, M. T. / Wang, C. / Rajab, S.-K. / Randall, C. / Kim, H.-T. / Chen, H.-C. / Fuh, K.-F. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 126
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CONSTRAINED-SINTERED MATERIAL SYSTEMS FOR INTERCONNECTS AND PACKAGESNeedes, C. R. / Wang, C. B. / Hang, K. W. / Barker, M. F. / Amey, D. I. / Smith, M. A. / Souders, K. E. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 132
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DEVELOPMENT OF INTEGRATED HIGH VALUE RESISTORS ON NOVEL SUBSTRATESTuttle, B. A. / Williams, D. P. / Olson, W. R. / Clem, P. G. / King, B. / Renn, M. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 137
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COMPACT STACKED TANDEM COUPLER IN LTCCLee, M. J. / Gipprich, J. W. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 142
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DESIGN OF COMPACT MULTI-LEVEL VIA-LESS BANDPASS FILTERS WITH HIGHER HARMONIC SUPPRESSIONGururajan, K. / Settaluri, R. K. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 148
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MINIATURIZED HIGH PERFORMANCE LOW-PASS AND BANDSTOP FILTERS FOR WIRELESS APPLICATIONSPeddibhotla, H. / Settaluri, R. K. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 154
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DESIGN OF MINIATURISED RF FILTERS IN LTCCAl-Taei, S. / Passiopoulos, G. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 160
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CHARACTERIZATION AND CONTROL OF LOW TEMPERATURE CO-FIRE CERAMIC (LTCC) SINTERINGDiAntonio, C. B. / Bencoe, D. N. / Ewsuk, K. G. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 165
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TRENDS IN LTCC PROCESSINGAnderson, D. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 171
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THE CO-SINTERING OF LTCC MATERIALSGarino, T. J. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 177
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A MODEL SYSTEM FOR INTERFACIAL REACTIONS IN LTCC MATERIALSCook, L. P. / Wong-Ng, W. / Schenck, P. / Vaudin, M. / Suh, J. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 183
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MANUFACTURABILITY AND RELIABILITY OF TRIMMED BURIED RESISTORS IN LTCCEhrhardt, W. / Thust, H. / Muller, J. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 189
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DIELECTRIC AND MAGNETIC MATERIALS FOR INTEGRATED PASSIVESFeingold, A. H. / Heinz, M. / Wahlers, R. L. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 195
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HIGH K LTCC SYSTEM FOR HIGH FREQUENCY APPLICATIONSCho, Y. S. / Hang, K. W. / Wang, C. B. / Souders, K. E. / Majumdar, D. / Amey, D. / Needes, C. R. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 200
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PERFORMANCE OF LOW-OHMIC CO-FIRED BURIED RESISTORS IN A6S TAPEMoroz, M. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 205
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EMBEDDED HEAT EXCHANGER IN LTCC SUBSTRATEAdluru, H. / Zampino, M. A. / Liu, Y. / Jones, W. K. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 211
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LTCC BASED MEMS IMPINGEMENT COOLERSSaxena, K. / Wang, G. / Ang, S. / Elshabini, A. / Barlow, F. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 217
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MICROFLUIDICS FOR THERMAL MANAGEMENT: APPLICATIONS, FABRICATION, AND DEMONSTRATION IN LTCCSmith, B. / Pleskach, M. / Gamlen, C. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 223
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NOVEL STRUCTURES IN CERAMIC INTERCONNECT TECHNOLOGYPeterson, K. / Rohde, S. / Turner, T. / Stokes, R. / Casias, A. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 229
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CERAMIC PACKAGING FOR MEMS-BASED MICROSYSTEMSCuster, J. S. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 235
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JOINING SMALL COMPONENTS WITH REACTIVE MULTILAYER FOILSWeihs, T. P. / Knio, O. M. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 240
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ION MOBILITY SPECTROMETER FABRICATED IN LTCCPlumlee, D. G. / Hartman, J. / Moll, A. J. / Tam, M. / Dwivedi, P. / Hill, H. H. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 246
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POLYMER-DERIVED CERAMIC MEMS: SCIENCE AND TECHNOLOGYLiew, L. A. / Raj, R. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003
- 252
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MICRODISCHARGE ARRAYS IN CERAMICS AND SEMICONDUCTORS MULTILAYER STRUCTURES: PHOTONIC DEVICES FOR EMISSION AND DETECTIONEden, J. G. / International Microelectronics and Packaging Society / International Society for Optical Engineering et al. | 2003