Accelerated Oxidation of Hydrogen Silsesquioxane Thin Films Facilitated by an Organosilicone Resin Additive (English)
- New search for: Harkness, B. R.
- New search for: Boisvert, R.
- New search for: Deng, Q.
- New search for: Zhong, B.
- New search for: Sun, J.
- New search for: Gidley, D.
- New search for: Materials Research Society
- New search for: Harkness, B. R.
- New search for: Boisvert, R.
- New search for: Deng, Q.
- New search for: Zhong, B.
- New search for: Sun, J.
- New search for: Gidley, D.
- New search for: McKerrow, Andrew J
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In:
Materials, technology and reliability for advanced interconnects and low-K dielectrics
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279-284
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2003
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ISBN:
- Conference paper / Print
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Title:Accelerated Oxidation of Hydrogen Silsesquioxane Thin Films Facilitated by an Organosilicone Resin Additive
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Contributors:Harkness, B. R. ( author ) / Boisvert, R. ( author ) / Deng, Q. ( author ) / Zhong, B. ( author ) / Sun, J. ( author ) / Gidley, D. ( author ) / McKerrow, Andrew J / Materials Research Society
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Conference:Symposium E, Materials, technology and reliability for advanced interconnects and low-K dielectrics
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Published in:MATERIALS RESEARCH SOCIETY SYMPOSIUM PROCEEDINGS ; 766 ; 279-284
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Publisher:
- New search for: MRS
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Publication date:2003-01-01
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Size:6 pages
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Remarks:Held as part of the 2003 MRS Spring meeting
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
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3D System Integration TechnologiesRamm, P. / Klumpp, A. / Merkel, R. / Weber, J. / Wieland, R. / Ostmann, A. / Wolf, J. / Materials Research Society et al. | 2003
- 15
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Air Bridge Technology: A Comparison of Novel Interconnect Materials and Integration Schemes for Beyond 45 nmFoster, K. / Waeterloos, J. / Frye, D. / Froelicher, S. / Mills, M. / Materials Research Society et al. | 2003
- 21
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Wafer Thinning for Monolithic 3D IntegrationJindal, A. / Lu, J.-Q. / Kwon, Y. / Rajagopalan, G. / McMahon, J. J. / Zeng, A. Y. / Flesher, H. K. / Cale, T. S. / Gutmann, R. J. / Materials Research Society et al. | 2003
- 27
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Dielectric Glue Wafer Bonding for 3D ICsKwon, Y. / Jindal, A. / McMahon, J. J. / Lu, J.-Q. / Gutmann, R. J. / Cale, T. S. / Materials Research Society et al. | 2003
- 33
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AlCu Pattern Generation on 3D Structured Wafer Using Multi Level Exposure Method on Electrodeposited Polymer MaterialSharma, V. / Suriadi, A. B. / Berauer, F. / Mittelstadt, L. S. / Materials Research Society et al. | 2003
- 39
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Sequential Process Modeling for Determining Process-Induced Thermal Stress in Advanced Cu/Low-k InterconnectsYang, K. / Waeterloos, J. J. / Im, J.-H. / Mills, M. E. / Materials Research Society et al. | 2003
- 47
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Some Aspects of the Materials Science of Low-k IntegrationMcGahay, V. / Materials Research Society et al. | 2003
- 59
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Silicides for the 65 nm Technology NodeBesser, P. R. / Chan, S. / Paton, E. / Kammler, T. / Brown, D. / King, P. / Pressley, L. / Materials Research Society et al. | 2003
- 71
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Dual Damascene Process for Fat Wires in Copper/FSG TechnologyGambino, J. / Stamper, T. / Trombley, H. / Luce, S. / Allen, F. / Weinstein, C. / Reuter, B. / Dunbar, M. / Samek, V. / McLaughlin, P. et al. | 2003
- 77
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Adhesion Enhancement for Multiple Level Cu/SiLK™ IntegrationChen, X. T. / Lu, D. / Tan, Y. T. / Chen, Y. W. / Foo, P. D. / Materials Research Society et al. | 2003
- 83
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Assessment of Reliability of Cap Layers Used in Cu-Black Diamond™ InterconnectsKrishnamoorthy, A. / Huang, N. Y. / Chong, S.-Y. / Materials Research Society et al. | 2003
- 89
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A Study of Atomic Layer Deposition and Reactive Plasma Compatibility With Mesoporous Organosilicate Glass FilmsRyan, E. T. / Freeman, M. / Svedberg, L. / Lee, J. J. / Guenther, T. / Connor, J. / Yu, K. / Sun, J. / Gidley, D. W. / Materials Research Society et al. | 2003
- 97
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Impact of Low-k Dielectrics on Electromigration Reliability for Cu InterconnectsHo, P. S. / Lee, K.-D. / Ogawa, E. T. / Yoon, S. / Lu, X. / Materials Research Society et al. | 2003
- 107
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Quantitative Characterization of Dislocation Structure Coupled With Electromigration in a Passivated Al (0.5 wt% Cu) InterconnectsBarabash, R. I. / Tamura, N. / Valek, B. C. / Spolenak, R. / Bravman, J. C. / Ice, G. E. / Patel, J. R. / Materials Research Society et al. | 2003
- 115
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Properties and Barrier Material Interactions of Electroless Copper Used for Seed EnhancementWitt, C. / Pfeifer, K. / Materials Research Society et al. | 2003
- 121
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Experimental Characterization of the Reliability of Multi-Terminal Dual-Damascene Copper Interconnect TreesGan, C. L. / Thompson, C. V. / Pey, K. L. / Choi, W. K. / Chang, C. W. / Guo, Q. / Materials Research Society et al. | 2003
- 127
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Electromigration Study of Cu Dual-Damascene Interconnects with a CVD MSQ Low-k DielectricLu, X. / Lee, K.-D. / Yoon, S. / Matsuhashi, H. / Lu, M. / Zhang, K. / Ho, P. S. / Materials Research Society et al. | 2003
- 133
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Electromigration of Lower and Upper Cu Lines in Dual-Damascene Cu InterconnectsKrishnamoorthy, A. / Qiang, G. / Vairagar, A. V. / Mhaisalkar, S. / Materials Research Society et al. | 2003
- 139
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Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum InterconnectsZhang, G. / Tan, C. M. / Gan, Z. H. / Prasad, K. / Zhang, D. H. / Materials Research Society et al. | 2003
- 145
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Near-Threshold Electromigration of Damascene Copper on TiN BarrierMeyer, W. K. / Solanki, R. / Evans, D. / Materials Research Society et al. | 2003
- 153
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Interfacial Relationships in Microelectronic DevicesLane, M. / Rosenberg, R. / Materials Research Society et al. | 2003
- 165
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Indentation Fracture Toughness Measurements of Low Dielectric Constant MaterialsMorris, D. J. / Cook, R. F. / Materials Research Society et al. | 2003
- 171
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Environmental Effects on Subcritical Delamination of Dielectric and Metal Films From Organosilicate Glass (OSG) Thin FilmsLin, Y. / Vlassak, J. J. / Tsui, T. Y. / McKerrow, A. J. / Materials Research Society et al. | 2003
- 177
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Using Multi-Dimensional Contact Mechanics Experiments to Measure Poisson's Ratio of Porous Low-k FilmsLucas, B. N. / Hay, J. C. / Oliver, W. C. / Materials Research Society et al. | 2003
- 183
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Quantitative Measurements of Subcritical Debonding of Cu Films From Glass SubstratesPang, M. / Baker, S. P. / Materials Research Society et al. | 2003
- 191
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Advanced Characterization of Ultra-Low-k Periodic Porous Silica Films-Pore Size Distribution, Pore-Diameter Anisotropy, and Size and Macroscopic Isotropy of Domain StructureHata, N. / Negoro, C. / Takada, S. / Yamada, K. / Oku, Y. / Kikkawa, T. / Materials Research Society et al. | 2003
- 197
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Characterization of Nanoporous Low-k Thin Films by Contrast Match SANSHedden, R. C. / Bauer, B. J. / Lee, H.-J. / Materials Research Society et al. | 2003
- 203
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Determination of Pore Size Distributions in Nano-Porous Thin Films From Small Angle ScatteringBauer, B. J. / Hedden, R. C. / Lee, H.-J. / Soles, C. L. / Liu, D.-W. / Materials Research Society et al. | 2003
- 209
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Development and Application of On-Wafer Small Angle X-ray Scattering for the Quantification of Pore Morphology in Low-k Porous SiLK™ Semiconductor DielectricsLandes, B. / Kern, B. / Stokich, T. / Niu, J. / Yontz, D. / Radler, M. / Mohler, C. / Ouellette, K. / Lucero, S. / Hahnfeld, J. et al. | 2003
- 217
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Evaluation of Copper Ion Drift in Low-Dielectric-Constant Interlayer Films by Transient Capacitance SpectroscopyYoshino, T. / Hata, N. / Kikkawa, T. / Materials Research Society et al. | 2003
- 223
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Spectrum of Defect States in Porous Organic Low-k Dielectric Films, Annealed in Argon and NitrogenLigatchev, V. / Wong, T. K. S. / Goh, T. K. / Rusli / Yu, S. / Materials Research Society et al. | 2003
- 229
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Solvent Diffusion in Porous Low-k Dielectric FilmsShamiryan, D. / Maex, K. / Materials Research Society et al. | 2003
- 235
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The Study of Modified Layers in SiCOH Dielectrics Using Spectroscopic EllipsometryWorsley, M. A. / Bent, S. F. / Gates, S. M. / Kumar, K. / Dalton, T. / Hedrick, J. C. / Materials Research Society et al. | 2003
- 241
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Structure and Properties of Polysilsesquioxanes and Copolymers for Ultra-Low Dielectric FilmsYoon, D. Y. / Ro, H. W. / Park, E. S. / Lee, J.-K. / Kim, H.-J. / Char, K. / Rhee, H.-W. / Kwon, D. / Gidley, D. W. / Materials Research Society et al. | 2003
- 253
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Organofluorosilicate Glass (OFSG): A Dense Low-k Dielectric With Superior Materials PropertiesO Neill, M. L. / Cheng, Y. L. / Lukas, A. S. / Wang, Y. L. / Karwacki, E. J. / Feng, M. S. / Vrtis, R. N. / Vincent, J. L. / Peterson, B. K. / Bitner, M. D. et al. | 2003
- 259
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Plasma Enhanced Chemical Vapor Deposition of Porous Organosilicate Glass ILD Films With kVrtis, R. N. / O Neill, M. L. / Vincent, J. L. / Lukas, A. S. / Peterson, B. K. / Bitner, M. D. / Karwacki, E. J. / Materials Research Society et al. | 2003
- 265
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Development of Porous SiLK™ Semiconductor Dielectric Resin for the 65 nm and 45 nm NodesStrittmatter, R. J. / Hahnfeld, J. L. / Silvis, H. C. / Stokich, T. M. / Perry, J. D. / Ouellette, K. B. / Niu, Q. J. / Godschalx, J. P. / Kalantar, T. H. / Mubarekyan, E. et al. | 2003
- 273
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Mechanical Properties of Organosilicon Thin Films Deposited From Cyclic and Acyclic Precursors Using Water as an OxidantBurkey, D. D. / Gleason, K. K. / Materials Research Society et al. | 2003
- 279
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Accelerated Oxidation of Hydrogen Silsesquioxane Thin Films Facilitated by an Organosilicone Resin AdditiveHarkness, B. R. / Boisvert, R. / Deng, Q. / Zhong, B. / Sun, J. / Gidley, D. / Materials Research Society et al. | 2003
- 285
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New Nano-Porous Composite Films of Silsesquioxane Polymer and Silicalite-1 for Low Dielectric ApplicationsSu, R. Q. / Zadrozna, G. / Muller, T. E. / Lercher, J. A. / Materials Research Society et al. | 2003
- 291
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Creating Nanoporosity by Selective Extraction of Porogens Using Supercritical Carbon Dioxide/Cosolvent ProcessesLahlouh, B. / Rajagopalan, T. / Lubguban, J. A. / Biswas, N. / Gangopadhyay, S. / Sun, J. / Huang, D. / Simon, S. L. / Kim, H. C. / Volksen, W. et al. | 2003
- 297
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Supercritical Carbon Dioxide-Based Fluids Used as a Recovery Tool for Low-k MaterialsOrozco-Teran, R. A. / Gorman, B. P. / Zhang, Z. / Mueller, D. W. / Reidy, R. F. / Materials Research Society et al. | 2003
- 303
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Effects of Supercritical CO~2 Drying and Photoresist Strip on Low-k FilmsReidy, R. F. / Zhang, Z. / Orozco-Teran, R. A. / Gorman, B. P. / Mueller, D. W. / Materials Research Society et al. | 2003
- 309
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Nanoporous Silica Films Derived From Structural Controllable Poly(silsesquioxane) Oligomers by TemplatingLiu, W.-C. / Yu, Y.-Y. / Chen, W.-C. / Materials Research Society et al. | 2003
- 315
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The Characterization and Preparation of Porous Low Dielectric Films Using Various Cyclodextrins as Template MaterialsYim, J.-H. / Kim, J.-B. / Jeong, H.-D. / Lyu, Y.-Y. / Mah, S. K. / Hyeon-Lee, J. / Lee, K. H. / Chang, S. / Pu, L. S. / Hu, Y. F. et al. | 2003
- 321
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Optimized Materials Properties for Organosilicate Glasses Produced by Plasma-Enhanced Chemical Vapor DepositionO Neill, M. L. / Vrtis, R. N. / Vincent, J. L. / Lukas, A. S. / Karwacki, E. J. / Peterson, B. K. / Bitner, M. D. / Materials Research Society et al. | 2003
- 327
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Electrical, Mechanical, and Structural Properties of Fluoro-Containing Poly(silsesquioxanes) Based Porous Low-k Thin FilmsHyeon-Lee, J. / Rhee, J. / Kim, J. / Yim, J.-H. / Chang, S. / Materials Research Society et al. | 2003
- 333
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Plasma Hydrogenation-A New Method of Reducing the k Value of the Low-k Polyimide FilmKuo, Y. / Chung, T. / Nominanda, H. / Materials Research Society et al. | 2003
- 339
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Expanding Thermal Plasma for Low-k Dielectrics DepositionCreatore, M. / Barrell, Y. / Kessels, W. M. M. / van de Sanden, M. C. M. / Materials Research Society et al. | 2003
- 345
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Stress Stability of PECVD Silicon Nitride Films During Device FabricationHughey, M. P. / Cook, R. F. / Materials Research Society et al. | 2003
- 351
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Characterization of Boron Carbo-Nitride Films Deposited by Low Temperature Chemical Vapor DepositionEngbrecht, E. R. / Cilino, C. J. / Junker, K. H. / Sun, Y.-M. / White, J. M. / Ekerdt, J. G. / Materials Research Society et al. | 2003
- 357
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MIM Capacitors With HfO~2 and HfAlO~x for Si RF and Analog ApplicationsYu, X. / Zhu, C. / Hu, H. / Chin, A. / Li, M. F. / Cho, B. J. / Kwong, D.-L. / Foo, P. D. / Yu, M. B. / Materials Research Society et al. | 2003
- 363
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Material and Electrical Characterization of HfO~2 Films for MIM Capacitors ApplicationHu, H. / Zhu, C. / Lu, Y. F. / Wu, Y. H. / Liew, T. / Li, M. F. / Cho, B. J. / Choi, W. K. / Yakovlev, N. / Materials Research Society et al. | 2003
- 373
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Observation of Grain Growth in Cu Films by In Situ EBSD AnalysisField, D. P. / Nowell, M. M. / Kononenko, O. V. / Materials Research Society et al. | 2003
- 379
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Impact of Annealing on the Resistivity of Ultrafine Cu Damascene InterconnectsSteinlesberger, G. / Engelhardt, M. / Schindler, G. / Steinhogl, W. / Traving, M. / Honlein, W. / Bertagnolli, E. / Materials Research Society et al. | 2003
- 385
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AFM Studies of Deformation and Interfacial Sliding in Interconnect Structures in Microelectronic DevicesPark, C. / Dutta, I. / Peterson, K. A. / Vella, J. / Materials Research Society et al. | 2003
- 391
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Effect of Barrier Layers on the Texture and Microstructure of Copper FilmsMuppidi, T. / Field, D. P. / Sanchez, J. E. / Materials Research Society et al. | 2003
- 397
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Grain Boundary Characteristics and Stress-Induced Damage Morphologies in Sputtered and Electroplated Copper FilmsPark, H. / Hwang, S.-J. / Oh, K. H. / Joo, Y.-C. / Materials Research Society et al. | 2003
- 403
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High-Frequency Heterodyne Force Microscopy Investigations of Copper InterconnectsZheng, Y. / Geer, R. / Materials Research Society et al. | 2003
- 409
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A Novel Technique to Re-Construct 3D Void in Passivated Metal InterconnectsTan, C. M. / Gan, Z. / Zhang, G. / Prasad, K. / Zhang, D. H. / Materials Research Society et al. | 2003
- 415
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Characterization of Electroplated Copper Films With Laser-Generated Surface Acoustic WavesMaznev, A. A. / Gostein, M. / Brongersma, S. H. / Materials Research Society et al. | 2003
- 421
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Detection of Voids in Tungsten Interconnect Vias Using Laser-Induced Surface Acoustic WavesTower, J. / Gostein, M. / Otsubo, K. / Kawasaki, A. / Materials Research Society et al. | 2003
- 427
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Copper Oxidation Studied by In Situ Raman SpectroscopySchennach, R. / Gupper, A. / Materials Research Society et al. | 2003
- 433
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The Integration of Plasma Enhanced Atomic Layer Deposition (PEALD) of Tantalum-Based Thin Films for Copper Diffusion Barrier ApplicationsCheng, D. / Eisenbraun, E. T. / Materials Research Society et al. | 2003
- 439
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Characterization of CVD Ti~xC~yN~z Films Deposited as Diffusion Barriers for Cu on Low-k Dielectrics MethylsilsequiazaneGau, W. C. / Liu, P. T. / Chang, T. C. / Chen, L. J. / Materials Research Society et al. | 2003
- 445
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Characterization of Atomic Layer Deposited WN~xC~y Thin Film as a Diffusion Barrier for Copper MetallizationKim, S.-H. / Oh, S. S. / Kim, H.-M. / Kang, D.-H. / Kim, K.-B. / Li, W.-M. / Haukka, S. / Tuominen, M. / Materials Research Society et al. | 2003
- 453
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Enhancement of Copper Wetting via Surfactant-Based Post-Treatment of Ultra-Thin Atomic Layer Deposited Tantalum Nitride Linersvan der Straten, O. / Zhu, Y. / Dunn, K. / Kaloyeros, A. / Materials Research Society et al. | 2003
- 459
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Vapor Treatment of Copper Surface Using Organic AcidsIshikawa, K. / Yagishita, T. / Nakamura, M. / Materials Research Society et al. | 2003
- 465
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Anisotropic Plasma Chemical Vapor Deposition of Copper Films in TrenchesTakenaka, K. / Onishi, M. / Takenshita, M. / Kinoshita, T. / Koga, K. / Shiratani, M. / Watanabe, Y. / Materials Research Society et al. | 2003
- 471
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Effect of Plasma Pre-Treatment on Dewetting Properties of CVD Cu on CVD W~2N Barrier LayerCheng, D. / Nuesca, G. / Eisenbraun, E. / Materials Research Society et al. | 2003
- 477
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The Correlation of Adhesion Strength With Barrier Structure in Cu MetallizationSekiguchi, A. / Koike, J. / Ueoka, K. / Ye, J. / Okamura, H. / Otsuka, N. / Ogawa, S. / Maruyama, K. / Materials Research Society et al. | 2003
- 483
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The Formation of Low Temperature Cu~3Si in Ag(Cu)/Si Structure Upon Annealing and Its Effects on Adhesion and ResistivityHong, S. / Lee, S. / Ko, Y. / Lee, J. / Materials Research Society et al. | 2003
- 491
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Deposition and Characteristics of Tantalum Nitride Films by Plasma Assisted Atomic Layer Deposition as Cu Diffusion BarrierNa, K.-I. / Park, S.-J. / Jeong, W.-C. / Kim, S.-H. / Boo, S.-E. / Bae, N.-J. / Lee, J.-H. / Materials Research Society et al. | 2003
- 497
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Enhanced Adhesion of Cu Film on a Low-k Material by Using Ti Glue Layer, B Dopant and N~2 Plasma TreatmentKo, Y. K. / Lee, S. / Yang, H. J. / Shim, C. / Jung, D. / Lee, J. G. / Materials Research Society et al. | 2003
- 503
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Reduced Time for Uniform Etching of Cu Power Planes During FIB EditingMakarov, V. V. / Thompson, W. B. / Lundquist, T. R. / Materials Research Society et al. | 2003