SiC BJT Driver Applied to a 2 kW Inverter: Performances and Limitations (English)
- New search for: Tournier, D.
- New search for: Bevilacqua, P.
- New search for: Brosselard, P.
- New search for: Planson, D.
- New search for: Allard, B.
- New search for: Tournier, D.
- New search for: Bevilacqua, P.
- New search for: Brosselard, P.
- New search for: Planson, D.
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In:
International conference on integrated power electronics systems; CIPS 2010
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119-124
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2010
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ISBN:
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ISSN:
- Conference paper / Print
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Title:SiC BJT Driver Applied to a 2 kW Inverter: Performances and Limitations
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Contributors:Tournier, D. ( author ) / Bevilacqua, P. ( author ) / Brosselard, P. ( author ) / Planson, D. ( author ) / Allard, B. ( author ) / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics
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Conference:6th, International conference on integrated power electronics systems; CIPS 2010 ; 2010 ; Nuremberg, Germany
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Published in:ETG FACHBERICHT ; 10 ; 119-124
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Publisher:
- New search for: VDE
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Place of publication:Nuremberg, Germany
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Publication date:2010-01-01
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Size:6 pages
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Remarks:Also held on CD-ROM. Held in Cage
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ISBN:
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ISSN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Performance trends and limitations of power electronic systemsKolar, J. W. / Biela, J. / Waffler, S. / Friedli, T. / Badstuebner, U. et al. | 2010
- 1
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Normally-On SiC JFETs in power converters: Gate driver and safe operationBergogne, Dominique / Risaletto, Damien / Dubois, Fabien / Hammoud, Asif / Morel, Hervé / Bevilacqua, Pascal / Allard, Bruno / Berry, Olivier / Meibody-Tabar, Farid / Raël, Stéphane et al. | 2010
- 1
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PEEC-models for EMC filter layout optimizationDe Oliveira, T / Guichon, J / Schanen, J / Gerbaud, L et al. | 2010
- 1
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Fast extraction of dynamic thermal impedance for multi-chip power modulesEvans, P / Johnson, C M et al. | 2010
- 1
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Application of phase change materials for low duty cycle high peak load power suppliesStupar, A / Drofenik, U / Kolar, J W et al. | 2010
- 1
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1200V 6A SiC BJTs with very low VCESAT and fast switchingLindgren, A / Domeij, M et al. | 2010
- 1
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Power semiconductor joining through sintering of silver nanoparticles: Evaluation of influence of parameters time, temperature and pressure on density, strength and reliabilityKnoerr, M / Schletz, A et al. | 2010
- 1
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MOS-Gated GTO: A new functionally integrated device suitable for high voltage power applicationsRonsisvalle, C / Enea, V / Abbate, C / Busatto, G / Sanseverino, A et al. | 2010
- 1
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Normally-off AlGaN/GaN HFET with p-type GaN gate and AlGaN bufferHilt, O / Knauer, A / Brunner, F / Bahat-Treidel, E / Würfl, J et al. | 2010
- 1
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Preliminary study for the integrated design of an electro-mechanical wing de-icing systemAbdesselam, F / Boissy, L / Castellazzi, A / Wijekoon, T / Wheeler, P / Johnson, M et al. | 2010
- 1
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Design of a multi-cell, DCM PFC rectifier for a 1mm thick, 200W off-line power supply — The power sheetMarxgut, C / Biela, J / Kolar, J W et al. | 2010
- 1
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Modular concept for power electronics in electric carsWondrak, W / Dehbi, A / Willikens, A et al. | 2010
- 1
-
Fault tolerant drives for aerospace applicationsAtkinson, G J / Bennett, J W / Mecrow, B C / Atkinson, D J / Jack, A G / Pickert, V et al. | 2010
- 1
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Development of a highly compact and efficient solar inverter with Silicon Carbide transistorsWilhelm, C / Kranzer, D / Burger, B et al. | 2010
- 1
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Current status of prognostics techniques and application to power electronicsBailey, C / Chunyan Yin, / Hua Lu, / Musallam, M / Johnson, C M et al. | 2010
- 1
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Validation of a fast loss and temperature simulation method for power convertersBryant, A T / Parker-Allotey, N.-A / Swan, I R / Hamilton, D P / Mawby, P A / Ueta, T / Nisijima, T / Hamada, K et al. | 2010
- 1
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Mixed switched mode and linear Lithium Ion battery tester for high power and large bandwidthFischnaller, M / Melbert, J et al. | 2010
- 1
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Low temperature sinter technology die attachment for power electronic applicationsGöbl, C / Faltenbacher, J et al. | 2010
- 1
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First power cycling results of improved packaging technologies for hybrid electrical vehicle applicationsHensler, A / Lutz, J / Thoben, M / Guth, K et al. | 2010
- 1
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A novel built-in methodology for screening LDMOS transistors to achieve zero defects in the automotive environmentMalandruccolo, V / Ciappa, M / Rothleitner, H / Fichtner, W et al. | 2010
- 1
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Solar power invertersMallwitz, R / Engel, B et al. | 2010
- 1
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“Fast control technique for high frequency (5MHz) DC/DC integrated converter”del Viejo, M / Alou, P / Oliver, J A / García, O / Cobos, J A et al. | 2010
- 1
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Evaluation of insulation material in advanced high power IGBT modules with extended operation temperatureFeller, L / Hartmann, S / Schneider, D / Granata, D / Behzadi, B et al. | 2010
- 1
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Mechanical characterization of an Au-Ge solder alloy for high temperature electronic devicesMsolli, S / Dalverny, O / Alexis, J / Karama, M et al. | 2010
- 1
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Observation of chip solder degradation by electrical measurements during power cyclingHartmann, S / Bayer, M / Schneider, D / Feller, L et al. | 2010
- 1
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Interface degradation of Al heavy wire bonds on power semiconductors during active power cycling measured by the shear testGoehre, J / Schneider-Ramelow, M / Geißler, Ute / Lang, K et al. | 2010
- 1
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Evaluation of power density of a reduced switch count five-level three-phase PWM rectifier for aircraft applicationsItoh, J / Noge, Y et al. | 2010
- 1
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Evaluation of commercial SOI driver performances while operated in extreme conditions (150°C-200°C)Falahi, K E / Allard, B / Tournier, D / Bergogne, D et al. | 2010
- 1
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High temperature electronics for high power density DC-DC Converters and Motor DrivesDelatte, P / Dessard, V / Saib, A / Pequignot, N / Picún, G / Demeûs, L / Doucet, J-C / Krebs, T et al. | 2010
- 1
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Knowledge matrix for power electronics — The approach of the ZVEI working group ‘High Temperature and Power Electronics’Rittner, M / Roth, A et al. | 2010
- 1
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Active reduction of common mode current in power modulesSchanen, J.-L / De Oliveira, T / Guichon, J.-M / Mandray, S et al. | 2010
- 1
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Power circuit design for clean switchingBayerer, R / Domes, D et al. | 2010
- 1
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Innovative materials of automotive power packagingKy Lim Tan, / Vivet, L / Morelle, J M / Pierre, B / Bienve-Nu, Y / Kaabi, A et al. | 2010
- 1
-
Investigation and PEEC based simulation of radiated emissions produced by power electronic convertersDomurat-Linde, A / Hoene, E et al. | 2010
- 1
-
Integrated rectenna circuit for microwave power scavengingMerabet, B / Takhedmit, H / Allard, B / Cirio, L / Costa, F / Picon, O / Vollaire, C et al. | 2010
- 1
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Power module with solid state circuit breakers for fault-tolerant applicationsKriegel, K / Melkonyan, A / Galek, M / Rackles, J et al. | 2010
- 1
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SiC BJT driver applied to a 2 kW inverter: Performances and limitationsTournier, D / Bevilacqua, P / Brosselard, P / Planson, D / Allard, B et al. | 2010
- 1
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Direct bonded aluminum on aluminum nitride substrates via a transient liquid phase and its applicationKuromitsu, Y / Nagatomo, Y / Tonomura, H / Akiyama, K / Montesa, C M / Shibata, N / Ikuhara, Y et al. | 2010
- 1
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Thermo-mechanical stress analysis for a multilayer SMT manufacturing technologyJosifović, I / Popović-Gerber, J / Ferreira, J A et al. | 2010
- 1
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Design for fault tolerance and predictive failuresWolmarans, J J / Ferreira, J A / Polinder, H / Josifovic, I / Clarenbach, D et al. | 2010
- 1
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Power electronics system integration for electric and hybrid vehiclesMarz, M / Schletz, A / Eckardt, B / Egelkraut, S / Rauh, H et al. | 2010
- 1
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Thermal pre-dimensioning methodology based on thermal impedanceDubus, P / Leon, R / Le Guyader, D / Caves, L et al. | 2010
- 1
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Railway traction reliabilityMermet-Guyennet, Michel / Piton, M et al. | 2010
- 1
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A MATLAB based approach for electro-thermal design of power convertersCova, P / Bernardoni, M et al. | 2010
- 1
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Pure Low Temperature Joining Technique power module for automotive production needsSchulze, E / Mertens, C / Lindemann, A et al. | 2010
- 1
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Fast and accurate simulation of time-variant air-cooling systemsGradinger, Thomas / Yang Liu, et al. | 2010
- 1
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A formal approach to system integrationGutierrez-Alcaraz, J M / de Haan, S W H / Ferreira, J A et al. | 2010
- 1
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Power module with additional low inductive current pathFrisch, M / Ernö, T et al. | 2010
- 1
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Development of a mid-power core (35 kW) dedicated to inverters for aerospace applicationsDe Maglie, R / Osvald, G / Mashaly, A / Liebig, S / Engstler, J / Engler, A et al. | 2010
- 1
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A linear 10 kV power amplifier for piezo actuatorsHorn, T / Melbert, J et al. | 2010
- 1
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Importance of boundary conditions for optimizing the thermal dimensioning of PCB tracesCoppola, L / Agostini, B / Schmidt, R / Barcelos, R F et al. | 2010
- 17
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Keynote: Performance, Trends and Limitations of Power Electronics SystemsKolar, J.W. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
- 37
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Integrated Gate Driver Solutions (Invited paper)Herzer, R. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
- 47
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High Density System Integration for Medium Power Applications (Invited paper)Boroyevich, D. / Chen, Z. / Luo, F. / Ngo, K. / Ning, P. / Wang, R. / Zhang, D. / Wang, F. / Burgos, R. / Lai, R. et al. | 2010
- 79
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Railway Traction Reliability (Invited paper)Mermet-Guyennet, M. / Piton, M. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
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How Materials Behaviour affects Power Electronics ReliabilityPoech, Max H. et al. | 2010
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The Future of Wire Bonding is? Wire Bonding!Siepe, Dirk / Bayerer, Reinhold / Roth, Roman et al. | 2010
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Insulating IGBT Driver with PCB integrated capacitive coupling elementsZeltner, Stefan et al. | 2010
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Integrable Semiconductor Current Balancer for Paralleled Fluorescent LampsWeger, Robert et al. | 2010
- 155
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Mechanical Characterisation of an Au-Ge Solder Alloy for High Temperature Electronic DevicesMsolli, S. / Dalverny, O. / Alexis, J. / Karama, M. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
- 161
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Evaluation of Commercial SOI Driver Performances while Operated in Extreme Conditions (150 ^oC - 200 ^oC)El Falahi, K. / Allard, B. / Tournier, D. / Bergogne, D. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
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Inductive Parasitics in Power Semiconductor Modules subject to Multi-Objective OptimisationFörster, Stefan / Lindemann, Andreas et al. | 2010
- 201
-
Thermoelectric Cooling for Power Density Maximisation of Power Electronics ConvertersBiela, J. / Kolar, J.W. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
- 201
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Thermoelectric cooling for power density maximisation of power electronic convertersBiela, J. / Kolar, J.W. et al. | 2010
- 207
-
Design of a Multi-Cell, DCM PFC-Rectifier for a 1mm Thick, 200W Off-Line Power SupplyMarxgut, C. / Biela, J. / Kolar, J.W. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
-
System based optimization of the chip size and the thermal path for Si and SiC semiconductorsKöneke, Thies / Merkert, Arvid / Mertens, Axel et al. | 2010
- 221
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System based Optimisation of the Chip Size and the Thermal Path for Si and SiC SemiconductorsKoneke, T. / Merkert, A. / Mertens, A. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
- 227
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Power Electronics System Integration for Electric and Hybrid Vehicles (Invited paper)Marz, M. / Schletz, A. / Eckardt, B. / Egelkraut, S. / Rauh, H. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
- 237
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Solar Power Inverters (Invited paper)Mallwitz, R. / Engel, B. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
- 245
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Fault Tolerant Drives for Aerospace Applications (Invited paper)Atkinson, G.J. / Bennet, J.W. / Mecrow, B.C. / Atkinson, D.J. / Jack, A.G. / Pickert, V. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
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Dynamic Paralleling Problems in IGBT Module Construction and ApplicationSchlapbach, Ulrich et al. | 2010
- 261
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Non Destructive SOA Testing of Power Modules (Invited paper)Busatto, G. / Abbate, C. / Iannuzzo, F. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
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Three-stage DC-DC converter solutions for SMPS applications in comparisonSchwalbe, Ulf / Scherf, Marko / Reimann, Tobias et al. | 2010
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Sintering technology used for interconnection of large areas: potential and limitation for power modulesLicht, Thomas / Speckels, Roland / Thoben, Markus et al. | 2010
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Novel Silver Contact Paste Lead Free Solution for Die AttachSchmitt, Wolfgang et al. | 2010
- 389
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Current Status of Pronostics Techniques and Application to Power Electronics (Invited paper)Bailey, C. / Yin, C. / Liu, H. / Musallam, M. / Johnson, C.M. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
- 425
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Investigation and PEEC Based Simulation of Radiated Emissions Produced by Power Electric ConvertersDomurat-Linde, A. / Hoene, E. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
-
Vaporizable Dielectric Fluid Cooling for IGBT Power SemiconductorsSaums, David L. et al. | 2010
- 445
-
New Semiconductor Technologies Challenge Package and System Setup (Invited paper)Miller, G. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
- 451
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Future Role of Power Electronics (Invited paper)Omura, I. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
- 461
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Keynote: Is it the End of the Road for Silicon in Power Conversion?Lidow, A. / VDE; Association for Electrical, Electronic & Information Technologies; European Center for Power Electronics et al. | 2010
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Is it the End of the Road for Silicon in Power Conversion?Lidow, Alex et al. | 2010
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Evaluation of commercial SOI driver performances while operated in extreme conditions (150deg C-200deg C)Falahi, K. El / Allard, B. / Tournier, D. / Bergogne, D. et al. | 2010
-
New Semiconductor Technologies challenge Package and System SetupsMiller, Gerhard et al. | 2010
-
High-Density System Integration for Medium Power ApplicationsBoroyevich, Dushan / Chen, Zheng / Luo, Fang / Ngo, Khai / Ning, Puqi / Wang, Ruxi / Zhang, Di / Wang, Fred / Burgos, Rolando / Lai, Rixin et al. | 2010
-
Future Role of Power ElectronicsOmura, Ichiro et al. | 2010
-
Integrated gate driver circuit solutionsHerzer, R. et al. | 2010
-
Non Destructive SOA Testing of Power ModulesBusatto, G. / Abbate, C. / Iannuzzo, F. et al. | 2010