Natural Disasters and Business Disruption: How Can Electronics Companies Evaluate and Mitigate Their Risk? (English)
- New search for: Stone, H.
- New search for: Stone, H.
In:
Surface Mount Technology Association
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981-986
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2011
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ISBN:
- Conference paper / Print
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Title:Natural Disasters and Business Disruption: How Can Electronics Companies Evaluate and Mitigate Their Risk?
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Contributors:Stone, H. ( author )
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Conference:Conference, Surface Mount Technology Association ; 2011 ; Fort Worth, TX
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Published in:Surface Mount Technology Association ; 981-986SMTA INTERNATIONAL -PROCEEDINGS- ; 2011 ; 2 ; 981-986
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Publisher:
- New search for: Curran
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Place of publication:New York
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Publication date:2011-01-01
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Size:6 pages
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Remarks:Includes bibliographical references and index
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Embedded Components on the Way to IndustrializationStahr, H. / Beesley, M. et al. | 2011
- 9
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The Effect of Physical Dimensions of an Embedded Planar Capacitor on ReliabilityAlam, M.A. / Azarian, M. / Pecht, M.G. et al. | 2011
- 15
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Embedding Components: Design and Process Implementation PrinciplesSolberg, V. et al. | 2011
- 21
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Modular System Packaging by Embedding: Technologies, Applications and PerspectivesBoettcher, L. / Ostmann, A. / Manessis, D. / Karaszkiewicz, S. / Loeher, T. et al. | 2011
- 28
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Printed Electronics Using Ink Jet TechnologyHayes, D. et al. | 2011
- 29
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Printed Electronics and NanomaterialsRae, A. et al. | 2011
- 33
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Solder Paste Jetting: A Broadband SolutionMohanty, R. et al. | 2011
- 39
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Illumination Grade LED's: Technology Overview and Application to PCB ManufacturingBonne, R. et al. | 2011
- 44
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Low Voiding Reliable Solder Interconnects for LED Packages on Metal Core PCBsTormey, E. / Raut, R. / Bent, W. / Pandher, R. / Singh, B. / Bhatkal, R. / Kolbe, J. et al. | 2011
- 50
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Packaging Technologies for OLED Displays and Lighting ProductsSpindler, J. / Govindarajan, V.S. / Newman, D. / Rajeswaran, G. et al. | 2011
- 58
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Reliability of Lead-Free LGA's and BGA's: Effects of Solder Joint Size, Cyclic Strain and MicrostructureBarbini, D. / Meilunas, M. et al. | 2011
- 67
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Prognostication of Remaining Life and Prior Thermo-mechanical Damage in Field-Deployed ElectronicsLall, P. / Harsha, M. / Goebel, K. / Jones, J. et al. | 2011
- 83
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Electro-Migration and Material Transport in Solder JointsNowottnick, M. / Novikov, A. / Fix, A. et al. | 2011
- 87
-
Intermittent Connector Failures in Electronic AssembliesMunukutla, A. / Kurella, A. et al. | 2011
- 94
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Stability of Aluminum Thin Films on Flexible Substrate Under Thermal and Isothermal ConditionsHamasha, M. / Alzoubi, K. / Dhakal, T. / Qasaimeh, A. / Lu, S. / Westgate, C.R. / Van Hart, D. et al. | 2011
- 100
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Rework Challenges and Solutions for Solder Joints Under Constant Mechanical Load from Gold Plated EMC SpringsZhang, W. / Pu, P.K. / Peng, S. / Chen, A. / Liu, H. / Cai, T. et al. | 2011
- 109
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Health Monitoring of Lead Free Electronics Under Mechanical Shock and Vibration with Particle Filter Based Resistance SpectroscopyLall, P. / Lowe, R. / Goebel, K. et al. | 2011
- 123
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Reliability Testing of Leading Edge Components for Handheld Portable DevicesChow, J. / McCormick, H. / Brush, R. / Hamilton, C. / Suthakaran, S. / Berry, M. et al. | 2011
- 129
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Reliability of Mixed Alloy Ball Grid Arrays Under Thermal Fatigue and Drop Shock TestPandher, R. / Pachamuthu, A. et al. | 2011
- 137
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Effects of Aging on the Secondary Intermetallic Layer (Cu~3Sn~1) for SAC 305 SolderFitzgerald, K. / Marshall, J. / Ryno, T. / Kelley, A. / Voyles, C. et al. | 2011
- 147
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Surface Mount Attachment Life Testing of a RF Circulator Component Assembled with Pb-free or SnPb SolderCoyle, R. / Kotlowitz, R. / Read, P. / Popowich, R. / Fleming, D. / Quigley, R. / O Neill, R. et al. | 2011
- 158
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NASA-DoD Pb-Free Electronics Rework Project: Effect of 1X and 2X Eutectic Solder Rework on Vibration ReliabilityTucker, J.P. / Handwerker, C.A. / Russell, W. / Pedigo, A.E. / Ganster, A. / Snugovsky, P. / Bragg, J. / Bagheri, Z. / Romansky, M. et al. | 2011
- 187
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NASA/DoD Lead-Free Electronics Project: -20 C to +80 C Thermal Cycle TestWoodrow, T. et al. | 2011
- 210
-
NASA-DoD Lead-Free Electronics Project - Joint Test ReportKessel, K. et al. | 2011
- 340
-
Lead-Free Solder Assembly Implementation for a Mid-Range Power Systems ServerPu, P.K. / Lewis, T. / Cole, M. / Hoffmeyer, M. / Shaughnessey, J. / Finck, T. / Stevens, M. / Fischer, K. / Doman, J. et al. | 2011
- 348
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Lead-Free Vapor Phase Assembly Compatible Materials for a High Performance SMT Daughter Card ConnectorKelly, M. / Yu, Y. / Healey, J. / Ma, W. / Lopergolo, E. / Zhang, J. / Diepenbrock, J. / Lewis, T. / Khanna, V. / Kellmann, R. et al. | 2011
- 456
-
Package-on-Package (PoP) Assembly Challenges and Solutions for Low-Volume Engineering Prototype and Test ApplicationsDressler, D. / Li, M. / Mullen, D. et al. | 2011
- 463
-
SMT Process Characterization for Package on Package Interposer (PoPI)Amir, D. / Walwadkar, S. et al. | 2011
- 471
-
0.4mm PoP Assembly Development and ReliabilitySchwarz, M. / Choi, A. / Fay, O. / Shah, M. et al. | 2011
- 477
-
Material Selection and Parameter Optimization for Reliable TMV PoP AssemblyRoggeman, B. / Vicari, D. / Smith, L. / Syed, A. et al. | 2011
- 483
-
Evaluation of Reliability and Stack-Up Height on Next Generation 0.5mm Pitch PoPSchwarz, M. / Choi, A. / Fay, O. et al. | 2011
- 491
-
0.3mm Pitch CSP Process Development and Printed Circuit Board (PCB) DesignSjoberg, J. / Lee, J. / Aranda, R. / Geiger, D. et al. | 2011
- 498
-
Testing Intermetallic Fragility on ENIG Upon Addition of Limitless CuAnselm, M. / Roggeman, B. et al. | 2011
- 506
-
Processing Strategies and Reliability of 3D Wafer Level CSPsXie, F. / Li, Z. / Baldwin, D.F. / Houston, P.N. / Lewis, B.J. et al. | 2011
- 513
-
A Novel Low Temperature Fast Flow and Fast Cure Reworkable UnderfillLiu, M. / Yin, W. et al. | 2011
- 518
-
Quick Assessment of the Minimum Peak Reflow Temperature Required in Low-Ag Solder AssemblyKondos, P.A. / Milunas, M. / Borgesen, P. et al. | 2011
- 526
-
Comparing Electronic Component Package Materials and Substrate Vendors for Solder-Joint Reliability ImprovementsKoschmieder, T. / Rayos, J. / Carpenter, B. / Wesierman, G. et al. | 2011
- 535
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Damage Mechanisms and Acceleration Factors for No-Pb LGA, TSOP and QFN Type Assemblies in Thermal CyclingWentlent, L. / Arfuei, B. / Borgesen, P. / Meilunas, M. / Yin, L. et al. | 2011
- 545
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Processing Strategies and Reliability of 0.4mm Pitch CSPsLewis, B.J. / Baldwin, D.F. / Houston, P.N. / Xie, F. et al. | 2011
- 551
-
Implementing TSV for 3D Semiconductor PackagingSolberg, V. et al. | 2011
- 557
-
Flip Chip Assembly Process Optimization and Material Selection Through Validated SimulationsZhang, R. / Katkar, R. / Haynh, M. / Mirkarimi, L. et al. | 2011
- 562
-
Assembly and Reliability of Preform Underfilmed BGAs in Drop Test and Thermal CyclingMawer, A. / Koschmieder, T. / Galles, P. / Anding, R. / Skevofilax, G. / Lippe, T. et al. | 2011
- 570
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Assembly Process Influence on Mechanical Test Performance of 0.4mm Pitch CSP and LGA ComponentsSchake, J. / Roggeman, B. et al. | 2011
- 576
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Drop Test Performance of BGA Assembly Using SAC105Ti Solder SpheresLiu, W. / Lee, N.-C. / Bagheri, S. / Snugovsky, P. / Bragg, J. / Brush, R. / Harper, B. et al. | 2011
- 581
-
Characterization of Void Growth in BGA Solder Balls Through Two SMT Reflow Soldering CyclesDonaldson, A. / Aspandiar, R. et al. | 2011
- 590
-
Impact of SMT Process Parameters to Control BGA Process Voids During Board AssemblyNie, L. / Donaldson, A. / Aravamudhan, S. / Aspandiar, R. et al. | 2011
- 597
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The Last Will and Testament of the BGA VoidHillman, D. / Adams, D. / Pearson, T. / Williams, B. / Petrick, B. / Wilcoxon, R. / Collins, R. / Bernard, D. / Travis, J. / Krastev, E. et al. | 2011
- 612
-
Evaluation of Stencil Foil Materials, Suppliers and CoatingsShea, C. / Whittier, R. et al. | 2011
- 621
-
The Development of a 0.3mm Pitch CSP Assembly Process Using Standard MaterialsAshmore, C. / Whitmore, M. et al. | 2011
- 627
-
Effect of Stencil Technology on Ultra Fine Pitch PrintingRamkumar, S.M. / Mohanty, R. et al. | 2011
- 633
-
Understanding Head-in-Pillow Defects - The Role of Thermal Stability in PastePandher, R. / Raut, R. / Liberatore, M. et al. | 2011
- 640
-
Projection Moire vs. Shadow Moire for Warpage Measurement and Failure Analysis of Advanced PackagesThomas, J. et al. | 2011
- 643
-
Defining Package Warpage Criteria to Mitigate Head and Pillow DefectsGill, P.S. / Chin, Y.T. et al. | 2011
- 649
-
BGA Rework Challenges of High Thermal Mass, Large PCBA'sSampathkumar, M. / Aravindakshan, G. / Jean, D. / Lee, D. et al. | 2011
- 657
-
Reworking of Pin Through Hole Components Using `Hot Air' Paste in Hole ProcessSubbarayan, G. / Anderson, L. / Raut, R. et al. | 2011
- 665
-
An Innovative Rework Solution To Assembled IC ComponentsLiu, M. / Yin, W. / Walz, M.J. et al. | 2011
- 669
-
A Case Study on Process Improvements for Vapor Phase Rework on High Thermal Mass SMT ConnectorTrivedi, R. / Standing, B. et al. | 2011
- 678
-
In-process Reduction/Mitigation of Tin Whiskers by Condensing Vapor ReflowPrimavera, A.A. et al. | 2011
- 686
-
Compatibility of Cleaning Agents with Nano-Coated StencilsLober, D. / Bixenman, M. et al. | 2011
- 693
-
Reliability and Cleanability of Solder Paste Residue: Vapor Phase vs. ConvectionGuene, E. / Verdier, M. / Laugt, A.-M. / Ducoulombier, A. et al. | 2011
- 702
-
Thinking Inside the Bag on CleanlinessCamden, E. et al. | 2011
- 703
-
Japanese Green Technologies for SMTSawairi, D. / Ogihara, M. et al. | 2011
- 709
-
Reducing Environmental Impact of Cleaning Electronic Assemblies: A Case StudyStach, S. et al. | 2011
- 716
-
Is Cleaning Critical to PoP Assemblies?Wack, H. / Tosun, U. / Patel, J. et al. | 2011
- 722
-
Photovoltaic Industry Overview and Comparison of Global Business ModelsHolzmann, M. et al. | 2011
- 723
-
Lead-Free Solders for Use in Solar Module ManufacturingMey, C. / Cao, A. / Perovic, D.D. et al. | 2011
- 736
-
Screens and Electroformed Accuscreens for Solar Printing ApplicationsColeman, W. et al. | 2011
- 742
-
Voiding Control at QFN AssemblyHerron, D. / Liu, Y. / Lee, N.-C. et al. | 2011
- 751
-
Lead-Free Paste Characterization (Wetting & Voiding) vs. ReliabilityTrodler, J. / Albrecht, H.-J. et al. | 2011
- 755
-
Choosing a Low Cost Alternative to SAC Alloys for PCB Assembly: Preliminary WorkSandy, B. / Lasky, R. et al. | 2011
- 760
-
The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb Free SoldersSweatman, K. / Nishimura, T. / Read, J. / Nogita, K. et al. | 2011
- 766
-
A Unique Low-Ag Alloy Solder Paste for High-Reliability SMT ApplicationsShimamura, M. / Ohnishi, T. / Nonaka, T. / Ishibashi, S. / Okuno, T. / Akita, S. / Daily, D. et al. | 2011
- 774
-
High Temperature Lead-Free Solder Joints Via Mixed Powder SystemZhang, H.W. / Lee, N.-C. et al. | 2011
- 781
-
Developing a Pb-Free Solder Through Micro-AlloyingChada, S. / Currie, M. / Toleno, B. / Steen, H. / Boyle, R. et al. | 2011
- 788
-
An Investigation Into Low Silver Lead-Free Alloy Solder Paste for Electronics Manufacturing ApplicationsBath, J. / Itoh, M. / Clark, G. / Mori, K. / Takahashi, H. / Yokota, K. / Garcia, R. et al. | 2011
- 798
-
How Detailed Design Guidelines Can Improve Soldering Quality and Reduce Costs in Selective Through-hole Soldering ProcessesSchlessmann, H. / Ott, C. et al. | 2011
- 803
-
Are Selective Soldering Fluxes Reliable?Diepstraten, G. et al. | 2011
- 811
-
Achieving Excellent Vertical Hole on Thermally Challenging Boards Using Selective SolderingShoaf, T. / Clure, J. / Jean, D. et al. | 2011
- 817
-
The Effect of Design Parameters on PTH Barrel Fill in High Complexity AssemblySongninluck, J. / Fangkangwanwong, J. / Ng, T.H. / McMahon, J. et al. | 2011
- 823
-
Lead-Free Wave Soldering Project: Performance of Lead-Free Through-Hole Electrical InterconnectsBarbini, D. / Jean, D. / Longgood, S. / Howell, K. / Miremadi, J. et al. | 2011
- 831
-
Design for Manufacturability of PTH Solder Fill in Thick Board with OSP FinishChang, S. / Wang, R. / Xiang, Y. / Wang, P. et al. | 2011
- 839
-
Achieving the Excellent SCM: Diary of a Practitioner Wearing the EMS and OEM ShoesLadhar, H. et al. | 2011
- 843
-
How to Calculate the True Cost of Global Electronics OutsourcingMiscoll, E.H. et al. | 2011
- 845
-
Practical Business Approach to Obsolescence Mitigation and the Changing Supply Chain LandscapeCarrigan, J. et al. | 2011
- 847
-
How to Protect Your Program Profit Plan in the Reality of ObsolescencePappas, L. et al. | 2011
- 849
-
Supply Chain Management Through Cost ModelingPalesko, A. / Palesko, C. et al. | 2011
- 853
-
Improving Supply Chain Performance Using Business Intelligence and Specialized Software Tools ProactivelyKohli, H. / Mathur, N. / Patil, A. et al. | 2011
- 863
-
Dynamic Production PlanningGorajia, J. et al. | 2011
- 869
-
PCB Dynamic Co-Planarity at Elevated TemperaturesDavignon, J. / Chiavone, K. / Pan, J. / Henzi, J. / Mendez, D. / Kulterman, R. et al. | 2011
- 879
-
New Challenges for Higher Aspect Ratio: Filling Through Holes and Blind Micro Vias with Copper by Reverse Pulse PlatingRoelfs, B. / Dambrowsky, N. / Erben, C. / Kenny, S. et al. | 2011
- 885
-
Benchmarking and Qualifying Printed Circuit Board Fabricators for Semiconductor Device Test BoardsMack, W.J. et al. | 2011
- 894
-
Analysis of Corrosion Films in Printed Circuit Board AssembliesKurella, A. / Pathangey, B. / Ciarkowski, T. / Wang, Z. et al. | 2011
- 895
-
Silver Nitric-An Innovative Process Indicator for Oxidation of PCB with OSP Surface Finish (Part 2: Time to Discoloration)Hou, E. / Chung, D.F. / Wang, P. et al. | 2011
- 901
-
Correlation of SIR Halide/Halogen and Copper Mirror TestsPalma, N. / Lasky, R. et al. | 2011
- 905
-
Quality, Reliability and Metallurgy of ENEPIG Board Finish and Tin-Lead Solder JointsWolverton, M. et al. | 2011
- 911
-
Electroless Pure Palladium Deposition on Copper as a Cu Wire Bondable Surface FinishOezkoek, M. / Kilian, A. / Roberts, H. et al. | 2011
- 916
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A Study of Surface Finishes for IC Substrates and Wire Bond ApplicationsLong, E. / Toscano, L. et al. | 2011
- 921
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ENTEK OM: An OSP Alternative High Performance Final FinishKenny, J. / Wengenroth, K. / Fudala, J. / Rischka, M. / Yau, Y.H. et al. | 2011
- 926
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Comparison of Several PCB Final Finishes in a Mixed Flowing Gas Test EnvironmentVeale, R. / Trainor, J. et al. | 2011
- 932
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Inhibition of Creep Corrosion Using Plasma Deposited Fluoropolymer CoatingBrooks, A. / Woollard, S. / Hennighan, G. / von Werne, T. et al. | 2011
- 938
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The Implications of Recent Technology Advances for X-Ray Inspection in ElectronicsBernard, D. / Bryant, K. et al. | 2011
- 948
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Process Control Inspection of Surface Mounted Components Using Acoustic Micro Imaging-A ReviewSemmens, J.E. et al. | 2011
- 955
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Method of Determining Solder Paste Inspection Tolerance SettingsChen, J. / Rajoo, R.S.V. / Zhao, M. / Wen, W. / Xu, G. / Ning, A. / Xie, M. / Zhao, A.Q. / Qian, W.B. / Feng, Z. et al. | 2011
- 970
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EU RoHS Recast - Are You Ready?Crotty, K. / EcoTech, A. et al. | 2011
- 972
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EU RoHS Exemptions, Technology and Trends Since PromulgationAdams, J. / Cole, M. / Fletcher, M.B. / Galyon, G. / Grosskopf, C. / Quick, J. / Lau, S. et al. | 2011
- 981
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Natural Disasters and Business Disruption: How Can Electronics Companies Evaluate and Mitigate Their Risk?Stone, H. et al. | 2011
- 987
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QFN Process Control Via 2D and 3D CT X-ray Inspection TechniquesBastin, V. / Krastev, E. et al. | 2011
- 993
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Divithin Heat Spreader Attach Process for Thermally Constrained Embedded MarketsLloyd, S. / Kochanowski, M. / Walwadkar, S. / Ewy, E. et al. | 2011
- 1001
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Using SPI to Improve Print YieldsShea, C. / Zubrick, M. / Whittier, R. et al. | 2011
- 1006
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The Relevance of Long Duration TLP Stress on System Level ESD DesignBoselli, G. / Salman, A. / Brodsky, J. / Kunz, H. et al. | 2011