Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects (English)
- New search for: Jung, S.-Y.
- New search for: Kim, B.-J.
- New search for: Lee, N.Y.
- New search for: Kim, B.-M.
- New search for: Yeom, S.J.
- New search for: Kwak, N.J.
- New search for: Jung, S.-Y.
- New search for: Kim, B.-J.
- New search for: Lee, N.Y.
- New search for: Kim, B.-M.
- New search for: Yeom, S.J.
- New search for: Kwak, N.J.
In:
Electronic materials; IUMRS-ICEM-2010
;
58-61
;
2012
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ISSN:
- Conference paper / Print
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Title:Bias polarity and frequency effects of Cu-induced dielectric breakdown in damascene Cu interconnects
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Contributors:Jung, S.-Y. ( author ) / Kim, B.-J. ( author ) / Lee, N.Y. ( author ) / Kim, B.-M. ( author ) / Yeom, S.J. ( author ) / Kwak, N.J. ( author )
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Conference:International conference, Electronic materials; IUMRS-ICEM-2010 ; 2010 ; Ilsan, Korea
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Published in:MICROELECTRONIC ENGINEERING ; 89 ; 58-61
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Publisher:
- New search for: Elsevier
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Publication date:2012-01-01
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Size:4 pages
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Remarks:ESTAR title
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ISSN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Keywords:
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Source:
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