Patterning assessment using 0.33NA EUV single mask for next generation DRAM manufacturing (English)
- New search for: Lee, Jeonghoon
- New search for: Halder, Sandip
- New search for: Pham, Van Tuong
- New search for: Fallica, Roberto
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- New search for: Sah, Kaushik
- New search for: Suh, Hyo Seon
- New search for: Blanco, Victor
- New search for: Gillijns, Werner
- New search for: Cross, Andrew
- New search for: Lee, Jeonghoon
- New search for: Halder, Sandip
- New search for: Pham, Van Tuong
- New search for: Fallica, Roberto
- New search for: Heo, Seonggil
- New search for: Sah, Kaushik
- New search for: Suh, Hyo Seon
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In:
DTCO and Computational Patterning II
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124950S-124950S-11
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2023
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ISBN:
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ISSN:
- Conference paper / Print
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Title:Patterning assessment using 0.33NA EUV single mask for next generation DRAM manufacturing
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Contributors:Lee, Jeonghoon ( author ) / Halder, Sandip ( author ) / Pham, Van Tuong ( author ) / Fallica, Roberto ( author ) / Heo, Seonggil ( author ) / Sah, Kaushik ( author ) / Suh, Hyo Seon ( author ) / Blanco, Victor ( author ) / Gillijns, Werner ( author ) / Cross, Andrew ( author )
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Conference:DTCO and Computational Patterning II
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Published in:DTCO and Computational Patterning II ; 124950S-124950S-11Proceedings of SPIE, the International Society for Optical Engineering ; 12495 ; 124950S-124950S-11
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Publisher:
- New search for: SPIE
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Publication date:2023-01-01
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Size:124950S-124950S-11
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ISBN:
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ISSN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
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Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 124950A
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Application of resolution enhancement techniques at high NA EUV for next generation DRAM patterningArmeanu, Ana-Maria / Malankin, Evgeny / Lafferty, Neal / Wei, Chih-I / Kempsell Sears, Monica / Fenger, Germain / Zhang, Xima / Gillijns, Werner / Trivkovic, Darko / Kim, Ryoung-han et al. | 2023
- 124950B
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Evaluation of field stitching optimization for robust manufacturing with high-NA EUVLLevinson, Zachary / Dam, Thuc / Pfaeffli, Paul / Lee, C. Jay / Hoppe, Wolfgang / Klostermann, Ulrich / Lucas, Kevin et al. | 2023
- 124950C
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Probability model of bridging defects for random logic via in 3nm double patterning technology at 0.33 NASu, Xiaojing / Li, Jingjing / Fan, Taian / Wang, Jiashuo / Dong, Lisong / Su, Yajuan / Wei, Yayi et al. | 2023
- 124950D
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Direct print EUV patterning of tight pitch metal layers for Intel 18A process technology nodeVenkatesan, R. / Guven, C. / Bhawe, D. / Greenwood, A. R. / Zhang, Z. / Gupta, P. / Saksena, P. / Rodriguez, R. / Moumen, N. / Bains, B. et al. | 2023
- 124950K
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EUV full-chip curvilinear mask options for logic via and metal patterningLafferty, Neal / Saxena, Sagar / Mizuuchi, Keisuke / Ma, Yuansheng / Zhang, Xima / LaCour, Pat / Tritchkov, Alexander / Kmiec, Farah / Sturtevant, John et al. | 2023
- 124950L
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Next-generation logic design architecture for vertical-transport nanosheetsSenapati, B. / Do, J. / Young, A. / Dechene, D. J. / Song, S, / Park, Y. / Kong, J. / Lanzillo, N. / Zhang, C. / Fan, S. et al. | 2023
- 124950M
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Design-technology co-optimization overview of CFET architectureMirabelli, G. / Schuddinck, P. / Liu, H.-H. / Yang, S. / Zografos, O. / Salahuddin, S. M. / Weckx, P. / Hiblot, G. / Hellings, G. / Ryckaert, J. et al. | 2023
- 124950P
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High accuracy OPC modeling for new EUV low-K1 mask technology optionsSakr, Enas / DeLancey, Rob / Hoppe, Wolfgang / Levinson, Zac / Iwanow, Robert / Chen, Ryan / Yang, Delian / Lucas, Kevin et al. | 2023
- 124950Q
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Modeling accuracy and TAT improvements for next generation mask error correctionZepka, Alex / Latinwo, Folarin / Chen, Ryan / Chen, Jack et al. | 2023
- 124950R
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Computational lithography solutions to support EUV high-NA patterningZhao, Rongkuo / Zhou, Fan / Tang, Jialei / Lu, Jeff / Liu, Yunbo / Sun, Dezheng / Tien, Ming-Chun / Hsu, Stephen / Gupta, Rachit / Zhang, Youping et al. | 2023
- 124950S
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Patterning assessment using 0.33NA EUV single mask for next generation DRAM manufacturingLee, Jeonghoon / Halder, Sandip / Pham, Van Tuong / Fallica, Roberto / Heo, Seonggil / Sah, Kaushik / Suh, Hyo Seon / Blanco, Victor / Gillijns, Werner / Cross, Andrew et al. | 2023
- 124950T
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IC layouts patterns topological profiling using directional geometrical kernelsFathi Hamed, Ahmed Hamed / El-Sewefy, Omar / Khalaf, Sara / Hegazy, Hazem / Dessouky, Mohamed / Salem, Ashraf et al. | 2023
- 124950U
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Methodology development to benchmark power delivery designs in advanced technology nodesLanzillo, N. A. / Chu, A. / Vega, R. / Perez, N. / Clevenger, L. / Dechene, D. et al. | 2023
- 124950V
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Design for manufacturability (DFM) in-design fixing for improving manufacturability aware scoring (MAS)Reyes Ruiz, Ariel De Jesus / Wang, Lynn T. N. / Batarseh, Fadi / Schroeder, Uwe Paul et al. | 2023
- 124950W
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Electrical analysis of a stochastically simulated 2 nm node electrical test structureMelvin, Lawrence S. / Demmerle, Wolfgang / Siebert, Joachim / Stopford, Phil / Zavadskiy, Sergey / Hentschke, Renato / Ramkumar, Krishna / Berthiaume, Sylvain / Kandel, Yudhishthir / Hoppe, Wolfgang et al. | 2023
- 124950X
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Scalable hierarchy extraction of repeating structures to enhance full chip mask synthesisZhu, Jun / Wang, Lin / Falch, Brad / Dam, Thuc / Wang, Yongdong / Panaite, Petrisor / Ji, Mingchao / Li, Yuan Yuan / Su, Ming et al. | 2023
- 124950Y
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System-level evaluation of 3D power delivery network at 2nm nodeSisto, Giuliano / Chen, Rongmei / Milojevic, Dragomir / Zografos, Odysseas / Weckx, Pieter / Hellings, Geert / Ryckaert, Julien et al. | 2023
- 124950Z
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DTCO of sequential and monolithic CFET SRAMLiu, Hsiao-Hsuan / Salahuddin, Shairfe M. / Chan, Boon Teik / Schuddinck, Pieter / Xiang, Yang / Weckx, Pieter / Hellings, Geert / Catthoor, Francky et al. | 2023
- 124951A
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Machine learning applications on 3nm node technology and designs for improving block-level PPAShin, Hosoon / Ban, Yongchan / Kil, Jaebok / Hwang, Heecheol / Cho, Kyoungin / Sim, Sangmin / Lee, Bonghyun / Shin, Insub / Kim, Heeyeon / Jang, Chaeyoung et al. | 2023
- 124951B
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Automatic generation of representative and diversified pattern samples from a full chip layoutZhu, Jun / Falch, Brad / Braam, Kyle / Panaite, Petrisor / Su, Ming / Lee, C. Jay et al. | 2023
- 124951C
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Quantifying process sensitivities for EUV and high-NA using machine learning based analyticsOak, Apoorva / Kim, Ryan Ryoung-Han / Hwang, Soobin et al. | 2023
- 124951D
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Frequency-informed deep-learning denoising method supporting sub-nm metrology for high NA EUV lithographyKim, Minjung / Cerbu, Dorin / Dogru, Selim / Sastry, Kumara / Lorusso, Gian / Zidan, Mohamed / Saib, Mohamed / Severi, Joren / De Simone, Danilo / Singh, Vivek et al. | 2023
- 124951F
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Optical proximity correction with the conditional Wasserstein GANYuan, Pengpeng / Xu, Peng / Wei, Yayi et al. | 2023
- 124951G
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Design for manufacturability (DFM) physical verification using machine learningWang, Lynn T. N. / Johnsen, Klaus-Peter / Tanev, Ivan / Batarseh, Fadi / Su, Chang / Rezaeifakhr, Pouya / Schroeder, Uwe Paul et al. | 2023
- 124951H
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Etch model calibration and usage in OPC flow for curvilinear layoutsSungauer, Elodie / Depre, Laurent / La Greca, Raphael et al. | 2023
- 124951J
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Evaluation of CNN for fast EUV lithography simulation using iN3 logic mask patternsTanabe, Hiroyoshi / Jinguji, Akira / Takahashi, Atsushi et al. | 2023
- 124951K
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Cost analysis of device options and scaling boosters below the A14 technology nodeMirabelli, G. / Vandooren, A. / Roda Neve, C. / Gonzalez, V. V. / Mertens, H. / Farokhnejad, A. / Schuddinck, P. / Murdoch, G. / Salahuddin, S. M. / Zografos, O. et al. | 2023
- 124951L
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Improving FEM wafer review efficiency by introducing different pattern grouping modesGan, Yuan / Yan, Changlian / Zhang, Rongjia / Ding, Ming / Han, Chunying / Jiang, Junhai / Yu, Zongchang et al. | 2023
- 124951M
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Lithography hotspot detection based on residual networkLin, Mu / Zeng, Fanwenqing / Shen, Yijiang / Wei, Yayi et al. | 2023
- 124951N
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Constructing layout hierarchy for high-efficiency OPC flowLin, Tsung-Wei / Lin, Hung-Yu / Chiang, Mang-Shiun / Yeh, Shi-Cheng / Sweis, Jason / Hurat, Philippe / Wu, Tung-Yu / Wu, Chun-Sheng / Huang, Chao-Yi / Lai, Ya-Chieh et al. | 2023
- 124951O
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CPU time prediction using machine learning for post-tapeout flow runsSalah, Maram / Hamed Fathi Hamed, Ahmed / Kim, Stephen / Gilgenkrantz, Pascal / Han, Wooil / Ramsis, Roberto / Jantzen, Ken et al. | 2023
- 124951P
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GPU-accelerated matrix cover algorithm for multiple patterning layout decompositionChen, Guojin / Yang, Haoyu / Yu, Bei et al. | 2023
- 124951Q
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Co-optimization of optical and resist models in the OPC modeling process using in-house genetic algorithmPan, Yinuo / Wang, Yingfang / Chen, Norman / Kim, Keeho / Parent, Eric et al. | 2023
- 124951R
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Hybrid deep learning OPC framework with generative adversarial networkCao, Qingchen / Xu, Peng / Wei, Juan / Liu, Ruihua / Li, Fu / Fan, Jingjing / Yu, Chunlong / Li, Zhifeng / Shi, Jiangliu / Wei, Yayi et al. | 2023
- 124951S
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Fast and accurate machine learning assisted mask optimizationShin, Moojoon / Lee, Sooyong / Kim, Joonsung / Yang, Seung-Hune / Hwang, Heedon et al. | 2023
- 124951T
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Design rule manual and DRC code qualification flows empowered by high coverage synthetic layouts generationKabeel, Aliaa / Kim, Sutae / Park, Young Gook / Kim, Donggyun / Kwan, Joe / Rizk, Sarah / Madkour, Kareem / Shafee, Marwa / Kim, Jinhee et al. | 2023
- 124951U
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Productivity enhancement study: yield, cost, and turn-around-time modeling for EUV and high NA EUVTsai, Yi-Pei / Chang, Yi-Han / Wang, Jane / Trivkovic, Darko / Ronse, Kurt / Kim, Ryoung-Han et al. | 2023
- 124951V
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Design-aware virtual metrology and process recipe recommendationGreeneltch, Nathan G. / Yin, Haizhou / Torres, J. Andres / Tao, Melody / Lubin, Steven M. / Jayaram, Srividya / Kissiov, Ivan / Niehoff, Martin / Wolf, Marcus / Jungmann, Paul et al. | 2023
- 124951W
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A geometric model for active contours in inverse lithographyShen, Yijiang / Wei, Yayi et al. | 2023
- 124951X
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Physical design level PPA evaluation of buried power rail at 2nm nodeSisto, Giuliano / Zografos, Odysseas / Weckx, Pieter / Hellings, Geert / Ryckaert, Julien et al. | 2023
- 124951Y
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Lithography hotspot correction on post-OPC layout using generative adversarial networksCiou, Weilun / Hu, Tony / Cheng, Fz / Tsai, Y. Y. / Hsuan, Terry / Yang, Elvis / Yang, T. H. / Chen, K. C. et al. | 2023
- 124951Z
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Fast and accurate prediction of process variation band with custom kernels extracted from convolutional networksCho, Gangmin / Kim, Taeyoung / Shin, Youngsoo et al. | 2023
- 1249501
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Front Matter: Volume 12495| 2023
- 1249503
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Full chip inverse lithography technology mask synthesis for advanced memory manufacturingDigaum, Jennefir / Chiang, Gary / Wang, Lin / Braam, Kyle / Gerold, Dave / Wang, Yongdong / Dam, Thuc et al. | 2023
- 1249504
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Structured assist features in inverse lithographyGranik, Yuri / Wang, Philip et al. | 2023
- 1249505
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Curvilinear mask handling in OPC flowChen, Yung-Yu / Chang, Kai-Hsiang / Cheng, Wen-Li / Tang, Yu-Po et al. | 2023
- 1249506
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Curvilinear data representation and its impact on file size and lithographic performanceHu, Jiuning / Lyons, Adam / Spence, Chris / Wampler, Kurt / Mohsen, Mahmoud / Lu, Yen-Wen / Gupta, Rachit / Zhang, Youping / Howell, Rafael / Ye, Jun et al. | 2023
- 1249508
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Improving OPC modeling accuracy with rigorous and compact modeling deformation effects in photoresistsLatinwo, Folarin / Kuechler, Bernd / DeLancey, Rob / Hong, Hyesook / Yang, Delian et al. | 2023
- 1249509
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Computational evaluation of critical logical metal layers of pitch 20-24nm and the aberration sensitivity in high NA EUV single patterningGao, Weimin / Chen, Chun-Kuang / Zimmermann, Joerg et al. | 2023
- 1249511
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Minimizing die fracture in three-dimensional IC advanced packaging wafer thinning process by inserting polyimide patternsBravo, Jaime / Morey-Chaisemartin, Philippe / Chang, Lifu / Beisser, Eric / Brault, Frederic / Zusman, Joshua et al. | 2023
- 1249515
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A holistic approach to zero defect products when wafer fab does not output zero defectsTraynor, Stephen R. / Yanez, Jesse et al. | 2023
- 1249517
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Design for inspection methodology for fast in-line eBeam defect detectionStrojwas, Andrzej J. / Brozek, Tomasz / Ciplickas, Dennis / De, Indranil et al. | 2023
- 1249518
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Unsupervised ML classification driven process model coverage checkSong, SeungWon / Jeong, Seokyoon / Park, Sangwoo / Choi, Jungkee / Choi, WoonHyuk / Chung, No-young / Jeong, Seongtae / Jiang, Fan / Cao, Liang / Hong, Le et al. | 2023
- 1249519
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Machine learning architecture evaluation for fast and accurate weak point detectionLee, Yi / Schroeder, Uwe Paul / Rezaeifakhr, Pouya / Wang, Lynn / Villarreal, David et al. | 2023
- 1249520
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Layout pattern risk assessment in advanced technology node: methodology for pattern clustering and classificationJeon, Jae-Beom / Kim, Su-Min / Oh, Se-Il / Jung, Dai-Hyun / Kwon, Hyuck-Joon / Yoo, Chang-Sik / Lee, Joo-Young et al. | 2023
- 1249524
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Optical proximity correction with PID control through reinforcement learningKim, Taeyoung / Cho, Gangmin / Shin, Youngsoo et al. | 2023
- 1249525
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Thick-mask model based on multi-channel U-Net for EUV lithographyYu, Chengzhen / Ma, Xu et al. | 2023