Contamination of Lead-Free Solders (English)
- New search for: Gickler, A.
- New search for: Willi, C.
- New search for: Loomans, M.
- New search for: Gickler, A.
- New search for: Willi, C.
- New search for: Loomans, M.
In:
SURFACE MOUNT TECHNOLOGY
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11
, 11
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44-49
;
1997
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ISSN:
- Article (Journal) / Print
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Title:Contamination of Lead-Free Solders
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Contributors:
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Published in:SURFACE MOUNT TECHNOLOGY ; 11, 11 ; 44-49
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Publisher:
- New search for: IHS PUBLISHING GROUP
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Publication date:1997-01-01
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Size:6 pages
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ISSN:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 620.44
- Further information on Dewey Decimal Classification
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Classification:
DDC: 620.44 -
Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 11, Issue 11
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 4
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Calendar of Events - November, December, January| 1997
- 7
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How to Contact SMT| 1997
- 16
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Speaking of SMT| 1997
- 16
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SMT Staff - Speaking of SMT| 1997
- 20
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Surface Mount Materials and ProductionHwang, Jennie S. et al. | 1997
- 22
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Surface Mount CleaningKenyon, William G. et al. | 1997
- 26
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Surface Mount ComponentsPrasad, Ray P. et al. | 1997
- 30
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Surface Mount ManufacturingHolden, Happy et al. | 1997
- 34
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News| 1997
- 36
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Dilbert| 1997
- 44
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Contamination of Lead-Free Solders - Most observers expect a "family" of solders to emerge to replace Sn63-Pb37, but at higher cost and melting temperatures, less tolerant processing and some equipment modifications. While offsets may include improved fatigue resistance, infringement of copper and lead poses problems.Gickler, Alan et al. | 1997
- 44
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Contamination of Lead-Free SoldersGickler, A. / Willi, C. / Loomans, M. et al. | 1997
- 50
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How Machine Design Affects Placement PrecisionBaker, S. et al. | 1997
- 50
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How Machine Design Affects Placement Precision - An understanding of the effects of architecture on parts handling can assist in the selection of appropriate equipment.Baker, Stuart et al. | 1997
- 56
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Taking Control of DispensingSirois, L. et al. | 1997
- 56
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Taking Control of Dispensing - It necessarily covers rheology, specific gravity and optimum temperature of the materials as well as the platform's ability to accurately deposit repeatable volumes.Sirois, Larry et al. | 1997
- 60
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Progress in CAD-to-CAM Data Interchange - Four reports from the field detail software vendors' efforts to Improve the accurate flow of information between design and fabrication-assembly tools.LeBRUN, James et al. | 1997
- 60
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Progress in CAD-to-CAM Data InterchangeLeBrun, J. / Helbling, D. / Furst, D. / Kadlec, M. et al. | 1997
- 64
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Three Not Five Years A Call for Action on Actual Depreciation - Why an acceleration reflects true conditions faced by PCB assemblers who now see the status quo as a serious competitive disadvantage.Rhodes, Christopher et al. | 1997
- 64
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Three - Not Five - Years A Call for Action on Actual DepreciationRhodes, C. et al. | 1997
- 66
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Component Selector Roundup| 1997
- 71
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CM Feature - BGAs and the Challenge of Quality ProductionBrathwaite, Nicholas et al. | 1997
- 80
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CM News| 1997
- 86
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New products - Feature products . Adhesives-epoxies . assembly equipment . cleaning materials-equipment . coating-dispensing equipment . connectors . hardware accessories . ID-labeling . Inspection equipment . pick-and-place . reflow soldering equipment . repair-rework . software| 1997
- 94
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ProductPlus Showcase| 1997
- 95
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Index of Advertisers| 1997
- 96
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Classified Advertising| 1997