Extending process flexibility for single-wafer wet etch (English)
- New search for: Fuentes, R.
- New search for: Fuentes, R.
In:
SOLID STATE TECHNOLOGY
;
50
, 7
;
56-63
;
2007
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ISSN:
- Article (Journal) / Print
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Title:Extending process flexibility for single-wafer wet etch
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Contributors:Fuentes, R. ( author )
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Published in:SOLID STATE TECHNOLOGY ; 50, 7 ; 56-63
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Publisher:
- New search for: SOLID STATE TECHNOLOGY
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Publication date:2007-01-01
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Size:8 pages
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ISSN:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 621.381
- Further information on Dewey Decimal Classification
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Classification:
DDC: 621.381 -
Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 50, Issue 7
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 8
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Web Exclusives - Being there: The key to supplying fabs in Asia - Chipmakers are expanding operations into Asia to satisfy the growing local demand for semiconductor devices. Entegris has a blueprint for Western equipment suppliers seeking to serve these Asian fabs.LoPiccolo, Phil et al. | 2007
- 8
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Web Exclusives - Chip Forensics - Samsung's NAND Flash evolution - In this month's column, Chipworks analyst Dick James examines and compares a series of increasingly dense NAND Flash memory chips from Samsung to see what the company has done to solve specific pressing challenges.| 2007
- 8
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Web Exclusives - Ed's Threads - Ed's Threads is a weekly e-column of SST Senior Technical Editor Ed Korczynski's musings on semiconductor manufacturing technology and business. TO read Ed's Threads| 2007
- 16
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Editorial - Wanted: Better ways to reward CEOsHaavind, Bob et al. | 2007
- 16
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Wanted: Better ways to reward CEOsHaavind, B. et al. | 2007
- 20
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World News| 2007
- 24
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Tech News| 2007
- 34
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Emerging Technologies - High interest in low-end printable electronics - Integrating CMOS-like patterning methods with conventional printing techniques may provide the solution to improving the price-performance of many emerging applications.Derbyshire, Katherine et al. | 2007
- 34
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High interest in low-end printable electronicsDerbyshire, K. et al. | 2007
- 42
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Process monitoring methodology using in-line parametric testNishitsuru, K. / Kawamata, N. et al. | 2007
- 42
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TAP - Process monitoring methodology using in-line parametric test - A new probe card using micromachining-MEMS technology is designed to take direct electrical measurements on product wafers quickly and nondestructively.Nishitsuru, Kazunori et al. | 2007
- 46
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Hydrogen bromide cylinder gas ppb-level water vapor measurementYao, J. / Olsen, E. / Raynor, M. W. / Leonarduzzi, G. D. et al. | 2007
- 46
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Gases-Gas Handling - Hydrogen bromide cylinder gas ppb-level water vapor measurement - Compensating for cylinder temperature changes and optimizing sampling time enables cavity ring-down spectroscopy to accurately detect ppb of water vapor in HBr gas.Yao, J. et al. | 2007
- 56
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Extending process flexibility for single-wafer wet etchFuentes, R. et al. | 2007
- 56
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Etch - Extending process flexibility for single-wafer wet etch - Scanning a wafer through a linear meniscus of replenished chemicals decouples uniformity from chemistry in wet etching applications, providing greater flexibility in working with novel chemistry sets and sequential etchesFuentes, Ricardo et al. | 2007
- 64
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FPDs - Cutting LCD costs with alternative inkjet printing - LCD panelmakers have reached their limit in shaving panel costs by targeting price cuts for individual components and are thus focusing more on methods and technologies to trim costs in the manufacturing processHeo, Irene et al. | 2007
- 64
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Cutting LCD costs with alternative inkjet printingHeo, I. et al. | 2007
- 71
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Precision requirements for advanced HP logic implantationGossmann, H.-J. / Redinbo, G. / Erokhin, Y. / Romig, T. / Elshot, K. / Xu, J. / McComb, J. et al. | 2007
- 71
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IMPLANT - Precision requirements for advanced HP logic implantation - Small changes in the as-implanted profile from the desired one have a disproportionate impact on device characteristics at 32nm half-pitch and beyond. Thus, implant precision is key to achieving desired yield levels.Gossmann, Hans-Joachim et al. | 2007
- 79
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A carbon-restoring silylation process for low-k dielectric repairBhanap, A. / Korolev, B. / Nitta, S. / Purushothaman, S. / Bonilla, G. / Ryan, E. T. et al. | 2007
- 79
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MATERIALS - A carbon-restoring silylation process for low-k dielectric repair - Both plasma and wet processes can damage porous low-k films, but a post-damage treatment with the right material can restore optimal k values.Bhanap, A. et al. | 2007
- 89
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CONTAMINATION CONTROL-EHS - Controlling contaminants with enhanced gas leak detection - To detect very low levels of gases, i.e., below the typical permissible exposure limits of open-area gas sensors, a gas leak detection system was developed and tested in 200mm and 300mm fabs.Li, Shou-Nan et al. | 2007
- 89
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Controlling contaminants with enhanced gas leak detectionLi, S.-N. / Leu, G.-H. / Yen, S.-Y. / Chiou, S.-F. / Yu, S.-J. / Hsu, C.-F. et al. | 2007
- 95
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MATERIALS - Tackling power-performance trade-offs with silicon channel engineering - Increasing performance and reducing leakage as transistor design moves beyond 32nm half-pitch will require using quantum mechanical simulation tools to engineer the electronics properties of the channel -- A previously untouchable core of transistor design.Mears, R.J. et al. | 2007
- 95
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Tackling power/performance trade-offs with silicon channel engineeringMears, R. J. et al. | 2007
- 99
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Photoresist production using automated in-line viscosity controlChang, W. S. / Monovoukas, C. / Tanaka, M. / Fronczak, N. / Ignatowicz, M. et al. | 2007
- 99
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RESISTS - Photoresist production using automated in-line viscosity control - An automated viscosity feedback control system makes possible the correlation and prediction of film thickness with viscosity values during photoresist production.Chang, Woo Sok et al. | 2007
- 107
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SEMICON(R) West 2007 - Featured Products| 2007
- 108
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SEMICON(R) West 2007 - Product News| 2007
- 112
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Product News| 2007
- 115
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Ad Index| 2007
- 116
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It's harder to refute the benefits of DFMHunter, A. M. et al. | 2007
- 116
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Industry Forum - It's harder to refute the benefits of DFM - DFM is proving to be an essential tool for performance and cost-sensitive companies as process geometries shrinkHunter, Ana Molnar et al. | 2007