PCD pad conditioners for low pressure chemical mechanical planarisation of semiconductors (English)
- New search for: Sung, J.C.
- New search for: Tsai, M.-Y.
- New search for: Aoki, M.
- New search for: Chou, C.-S.
- New search for: Sung, M.
- New search for: Sung, J.C.
- New search for: Tsai, M.-Y.
- New search for: Aoki, M.
- New search for: Chou, C.-S.
- New search for: Sung, M.
- New search for: Wu, Y.
- New search for: Ko, S.
- New search for: Tso, P.-L.
In:
MICRO/NANOPRECISION ABRASIVE MACHINING
3/4
;
327-355
;
2008
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ISSN:
- Article (Journal) / Print
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Title:PCD pad conditioners for low pressure chemical mechanical planarisation of semiconductors
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Contributors:Sung, J.C. ( author ) / Tsai, M.-Y. ( author ) / Aoki, M. ( author ) / Chou, C.-S. ( author ) / Sung, M. ( author ) / Wu, Y. / Ko, S. / Tso, P.-L.
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Published in:MICRO/NANOPRECISION ABRASIVE MACHINING , 3/4 ; 327-355INTERNATIONAL JOURNAL OF ABRASIVE TECHNOLOGY ; 1, 3/4 ; 327-355
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Publisher:
- New search for: INDERSCIENCE
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Publication date:2008-01-01
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Size:29 pages
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ISSN:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 621.92
- Further information on Dewey Decimal Classification
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Classification:
DDC: 621.92 -
Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 1, Issue 3/4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 241
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Experimental study on the cooling effects of cryogenic pneumatic mist jet impinging cooling methodAn, Q.L. / Fu, Y.C. / Xu, J.H. et al. | 2008
- 251
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A two-dimensional material removal model in magnetorheological finishingChen, F.J. / Yin, S.H. / Ohmori, H. / Lin, W.M. et al. | 2008
- 265
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Study on mirror surface grinding of die steel by using ultrasonically assisted diamond toolsHara, K. / Isobe, H. / Kyusojin, A. / Okada, M. et al. | 2008
- 274
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Development of X-ray mirrors manufacturing process with ELID-grinding and polishing methodsLin, W. / Morita, S. / Uehara, Y. / Ohmori, H. et al. | 2008
- 287
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Simultaneous double side grinding of silicon wafers: a mathematical study on grinding marksLi, Z.C. / Pei, Z.J. / Fisher, G.R. et al. | 2008
- 302
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A new float-polishing technique with large clearance utilising magnetic compound fluidShimada, K. / Matsuo, Y. / Yamamoto, K. / Wu, Y. et al. | 2008
- 316
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Molecular dynamics simulation of effect of grinding wheel stiffness on nanogrinding processShimizu, J. / Zhou, L. / Eda, H. et al. | 2008
- 327
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PCD pad conditioners for low pressure chemical mechanical planarisation of semiconductorsSung, J.C. / Tsai, M.-Y. / Aoki, M. / Chou, C.-S. / Sung, M. et al. | 2008
- 356
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Elastic deformations of grinding wheels by means of proposed grinding wheel modelYamada, T. / Lee, H.-S. et al. | 2008