Electrodeposition from Tin-Iron Alloy Plating Baths Containing Ferric Ion (Unknown)
- New search for: Sonoda, T.
- New search for: Ando, N.
- New search for: Fujihira, Y.
- New search for: Sonoda, T.
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In:
JOURNAL- SURFACE FINISHING SOCIETY OF JAPAN
;
59
;
701-702
;
2008
-
ISSN:
- Article (Journal) / Print
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Title:Electrodeposition from Tin-Iron Alloy Plating Baths Containing Ferric Ion
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Contributors:
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Published in:JOURNAL- SURFACE FINISHING SOCIETY OF JAPAN ; 59 ; 701-702
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Publisher:
- New search for: SURFACE FINISHING SOC JAPAN
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Publication date:2008-01-01
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Size:2 pages
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ISSN:
-
Type of media:Article (Journal)
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Type of material:Print
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Language:Unknown
- New search for: 684.1043
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Classification:
DDC: 684.1043 -
Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 59
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
-
Manufacturing ProficiencyIshikawa, Y. et al. | 2008
- 2
-
Why do We Need a Highly Efficient Hydrogen Separation Membrane Technology, Now?Kamasaki, S. et al. | 2008
- 6
-
Thermally Stable Inorganic Membranes for Hydrogen Separation and Their Performance Enhancement by Surface FinishingUemiya, S. et al. | 2008
- 13
-
Hydrogen Separation Membrane Supported on Porous Metal TubeMatsumura, Y. et al. | 2008
- 18
-
Development of Hydrogen Separation Module with Structured Catalyst for Use in Membrane ReformerTsuneki, T. / Shirasaki, Y. / Kurokawa, H. / Yasuda, I. / Shimamori, T. / Shigaki, H. / Tanaka, H. / Mitsuya, K. et al. | 2008
- 23
-
Palladium-Based Membrane on Porous Ceramic Support for Hydrogen SeparationNoda, K.-i. et al. | 2008
- 28
-
Preparation of Hydrogen Permselective Membranes by a CVD MethodNomura, M. et al. | 2008
- 33
-
Foams Stabilized with MicroparticlesFujii, S. / Murakami, R. et al. | 2008
- 39
-
Kyoto Prefectural Technology Center for Small and Medium EnterprisesNakamura, T. et al. | 2008
- 43
-
Yoshitama Seito Co., LtdKiyokawa, H. et al. | 2008
- 47
-
Surface Modification of Polyimide Using UV Light and Formation of Circuit PatternsInoue, K. / Matsui, K. / Watanabe, M. / Honma, H. et al. | 2008
- 51
-
Thick Platinum Layer Deposition on Ceramics by Electroless- and Electro-platingKikuchi, T. / Watanabe, T. / Sakairi, M. / Takahashi, H. / Maruko, T. et al. | 2008
- 57
-
Controlling the Marching Velocities of Capillary Meniscus in the Channel of the Chemical Chip by Surface Energy ControlFukumoto, T. / Ogawa, K. et al. | 2008
- 63
-
Ni-SiC Composite Plating Using SiC Particles Obtained by Silane-Coupling Treating and Ni Electroless Pre-plating on SiC ParticlesAsai, Y. / Kobayakawa, K. / Sato, N. / Sato, Y. et al. | 2008
- 83
-
Design and Surface TreatmentNuriya, H. et al. | 2008
- 84
-
Overview of Etching Process for Fabricating MicrostructuresShikida, M. et al. | 2008
- 88
-
Behavior and Control Factor of Etching Process by an Aqueous Solution -Focusing on a Wet Etching of CopperMatsumoto, K. et al. | 2008
- 92
-
MEMS Structure Etching by the Low Surface Tension SolutionSakima, H. et al. | 2008
- 98
-
Micro Fabrication Technique Using Deep Dry Etching ProcessOhara, J. / Kano, K. / Takeuchi, Y. et al. | 2008
- 104
-
New Etchants for High Speed Anisotropic Etching of SiliconSotoaka, R. et al. | 2008
- 107
-
Physical Etching by the Wet BlastingOgata, M. et al. | 2008
- 111
-
COF Tape for Large-scale LCD with Active Development of Fine Pitch Wiring FormationChinda, A. et al. | 2008
- 117
-
Chiba Industrial Technology Research InstituteFukushima, K. et al. | 2008
- 120
-
Reports of the 116th Meeting on the Surface Finishing Society of Japan| 2008
- 126
-
Effects of Additives in the Bath on the Formation of Chemical Conversion Coatings Using Tungstate As a Substitute for Chromate and Composition Analyses of the CoatingsKawafune, I. / Yoshikawa, S. et al. | 2008
- 133
-
Physical Properties of Deposits Obtaining from Boric Acid Free Sulfamate Ni BathNakamaru, Y. / Wakuda, Y. / Tashiro, K. / Watanabe, M. / Honma, H. et al. | 2008
- 138
-
Research on Behavior of an Electro-plating Additive in Electro-Plated Films by TOF-SIMSTakahashi, S. / Goto, M. / Fujita, K. / Kanada, Y. et al. | 2008
- 145
-
Electrochemical STM Observation of SPS and MPS Monolayers as Additives for Cu Electrodeposition on Au(111) ElectrodeKaneko, S. / Yoshioka, K. / Kobayakawa, K. / Sato, Y. et al. | 2008
- 153
-
Surface Finishing - As One of Dreamy TechnologiesSakamoto, Y. et al. | 2008
- 155
-
Recent Progress in the Research and Development of Microcrystalline Thin Film Solar Cells and Protecting Films for Transparent Conductive OxideOgawa, S. / Nonomura, S. et al. | 2008
- 161
-
CIGS and Oxide Compound Solar Cells and the Importance of ElectrodepositionIzaki, M. / Shinagawa, T. et al. | 2008
- 167
-
Dye-Sensitized Solar Cell and Surface TreatmentArakawa, H. et al. | 2008
- 172
-
Dye-sensitized Solar Cell - High Performance and Large Area ModuleKitamura, T. / Matsui, H. / Okada, K. et al. | 2008
- 177
-
Organic Thin-Film Solar Cells as Next Generation Solar CellYoshikawa, S. et al. | 2008
- 185
-
Surface Properties on High-Speed Tool Steel Implanted with Methane PlasmaMitsuo, A. / Kawaguchi, M. / Aoki, S. / Morikawa, K. / Suzuki, H. et al. | 2008
- 190
-
Benzotriazole Containing Microcapsule Composite Copper CoatingShitanda, I. / Sato, G. / Itagaki, M. / Watanabe, K. et al. | 2008
- 195
-
Dissolution of Copper by an Acidic Electrolyzed Water of Dilute Sodium Sulfate Solution and its AffectorsTakenouchi, T. / Wakabayashi, S.-i. et al. | 2008
- 200
-
A Single Cyclic Potential-Residual Strain Curve in Film Electroplated from Zinc-Cobalt Sulfate BathTsuru, Y. / Foulkes, F.R. et al. | 2008
- 203
-
Qualitative Analysis of Hydrogen Concentration in DLC Films by Raman SpectroscopyMiura, K.-i. / Nakamura, M. et al. | 2008
- 209
-
The Smallest Branch-Merits and DemeritsKurokawa, K. et al. | 2008
- 210
-
Research Trends of Tin Whiskers and Current under Standing of the MechanismSuganuma, K. et al. | 2008
- 218
-
Approach for External Stress Type Whisker MitigationMoriuchi, H. et al. | 2008
- 223
-
Test Method and Mechanism Analysis for Tin Whisker Growth by Mechanical StressKiga, T. / Asai, T. / Mizuguchi, Y. / Murakami, Y. / Tanaka, S. / Tomiya, S. et al. | 2008
- 228
-
The Consideration of Whisker Growth Mechanism on Lead Free SolderingTanabe, K. / Toshima, H. / Toyoda, Y. et al. | 2008
- 232
-
About the Characteristic and Whisker of Pre-coated Aluminum Sheet for SolderKawano, S. / Tomomori, T. et al. | 2008
- 237
-
Structural Analysis of Whisker on Lead-free PlateOhgaki, M. et al. | 2008
- 242
-
Yamaguchi Prefectural Industrial Technology InstituteYamada, T. / Ishida, K. et al. | 2008
- 245
-
Sunburn and SuntanIshida, T. et al. | 2008
- 247
-
Analysis of Corrosion Process of Hot-Dip Zinc-Coated Steel Sheets in Simulated Acid Rain Solution with in-situ Raman SpectroscopyNakamura, N. / Tanaka, Y. / Kanesaki, R. / Sobue, K. / Imai, H. et al. | 2008
- 251
-
Chemical Stability of Chromium Oxide Films Formed by MOCVD in Subcritical and Supercritical WaterWatanabe, K. / Fujiwara, K. / Domae, M. / Katsumura, Y. et al. | 2008
- 257
-
XPS Studies of the Al Alloy Surface with Zincate TreatmentMorikawa, T. / Nakade, T. / Yokoi, M. et al. | 2008
- 265
-
On the Surface Modification for Wettability of the VGCF to Molten Magnesium AlloySato, T. / Kato, A. / Arai, K. / Takizawa, H. / Arai, S. et al. | 2008
- 268
-
Analysis of Crystal Structure of Electrodeposited Copper in Copper Sulfate Bath Containing SPSYamaguchi, H. / Yamashita, T. et al. | 2008
- 281
-
Anticipated Role of Surface Technologies in Today's WorldKawaguchi, J. et al. | 2008
- 282
-
The Present and the Future State of Plating on PlasticsEnomoto, H. / Murata, T. et al. | 2008
- 288
-
Process or Plating on Plastics by Permanganate EtchingYoshikane, Y. / Nagao, T. / Yoshikawa, J. / Okumura, H. et al. | 2008
- 294
-
Adhesion Mechanism of Plating on Surface Reformed Resin by UV IrradiationSugimoto, M. / Honma, H. et al. | 2008
- 299
-
Sixivalent Chromate-Free Resin Plating-A Molecular Adhesion Method-Mori, K. / Abe, S. et al. | 2008
- 305
-
The Trend of Plating on Plastics for Automobile PartsBessho, T. et al. | 2008
- 310
-
Modifying Injection Molding and Electroless Plating Technologies Using Supercritical Carbon DioxideYusa, A. / Nomura, Y. / Ano, T. et al. | 2008
- 315
-
Development of Chromic Acid Free Etching Technology for Metal Plating on Polyamide-ABS ResinTai, T. / Gu, W. / Omae, H. et al. | 2008
- 319
-
3R of Chemicals for Plating Process and Recycle Method for Plating on Plastics PartsNoda, Y. et al. | 2008
- 324
-
The Velocity of Light and SoundIshihara, M. et al. | 2008
- 326
-
Hydrogen Absorption into Anodized Niobium Electrodes during Cathodic PolarizationNagahara, K. / Kikuchi, T. / Fushimi, K. / Sakairi, M. / Takahashi, H. / Izumi, T. et al. | 2008
- 333
-
Surface Patterning of Al Thin Film Using Photolithography and AnodizationKatsumata, N. / Ishida, M. / Saito, O. et al. | 2008
- 340
-
Hydroxyapatite-loaded Thick Anodized Titanium FilmKudo, K. / Iwasaki, M. / Ito, S. et al. | 2008
- 343
-
Electrodeposition of Ni-P Composite Films Using Watts Base Bath Containing Phosphorous ParticlesSuzuki, Y. / Arai, S. / Shohji, I. / Kobayashi, E. et al. | 2008
- 346
-
Low-Temperature Synthesis of Carbon Nanocoils Using Cu-Ni Alloy Film as Catalyst with Controlling Fiber DiameterIshikawa, Y. et al. | 2008
- 353
-
A Course of Engineering EducationYashiro, H. et al. | 2008
- 355
-
Application of Electrochemical Nanotechnology to Bio and Medical FieldsOsaka, T. / Sasano, J. / Matsunaga, M. / Iida, H. et al. | 2008
- 363
-
Towards the Next Generation of Implantable Biomedical Devices Using Diamond-Like Carbon CoatingsYoshimoto, Y. / Nagashima, S. / Suzuki, T. / Hasebe, T. et al. | 2008
- 371
-
Dynamic Substrates Based on In-situ BiolithographyKaji, H. / Kawashima, T. / Sekine, S. / Nishizawa, M. et al. | 2008
- 377
-
Application of Bio-Nano Magnetic Beads to Medical CareMatsunaga, T. / Yoshino, T. et al. | 2008
- 382
-
The Development of Medical Devices Using MEMS TechnologyObata, T. et al. | 2008
- 387
-
Temperature-Responsive Intelligent Surfaces and Their Application to BioseparationNagase, K. / Okano, T. et al. | 2008
- 392
-
Sake vs. ShochuChinda, A. et al. | 2008
- 395
-
Pitting Corrosion Resistance of Aluminum-Magnesium Alloy Processed with Continuous Rotation Evolutional ControlNakano, H. / Son, I.-J. / Ohara, H. / Oue, S. / Nakamura, K. / Fukushima, H. et al. | 2008
- 401
-
Low Friction Property of DLC-Si Films under Dry Sliding ConditionMori, H. / Takahashi, N. / Nakanishi, K. / Tachikawa, H. / Ohmori, T. et al. | 2008
- 408
-
Effect of Magnetic Field on Copper Electroplating-Application to Through-Hole PlatingMorimoto, R. / Yazawa, S. / Aogaki, R. / Sugiyama, A. / Saitou, M. et al. | 2008
- 415
-
Tin Displacement Plating on Copper Using Alginate Gel ParticleShitanda, I. / Kawano, T. / Itagaki, M. / Watanabe, K. et al. | 2008
- 423
-
On the 100 th Anniversary of the Chromium IndustriesYamazaki, Y. et al. | 2008
- 424
-
``Element Science and Technology'' Project Beforehand with Forecasted Over-demany of ResourcesHalada, K. et al. | 2008
- 430
-
Fabrication of Ferromagnetic Nanodot Arrays by Wet ProcessesOuchi, T. / Homma, T. et al. | 2008
- 437
-
Tribological Issue in Automobile Industry and DLC CoatingTachikawa, H. et al. | 2008
- 443
-
Bonding Process Using Metallic NanoparticlesHirose, A. et al. | 2008
- 448
-
Formation of Highly Ordered Tunnel Pits by Electrochemical Etching of Al Foil Using Masking FilmNishio, K. / Fukushima, T. / Masuda, H. et al. | 2008
- 452
-
Kanagawa Industrial Technology CenterMagaino, S. et al. | 2008
- 455
-
YUDENSHA. CO, LTDKiyokawa, H. et al. | 2008
- 458
-
Roll Coater Compared with Curtain CoaterKanai, H. / Nomura, H. et al. | 2008
- 460
-
Study on Super-Hydrophobic and Oleophobic Surfaces Prepared by the Chemical Adsorption TechniqueTsuji, I. / Ohkubo, Y. / Ogawa, K. et al. | 2008
- 465
-
Heterogeneous Sulfidation Characteristic of Copper, Zinc and Nickel in Simulated Plating Wastewater Using Calcium SulfideSoya, K. / Mihara, N. / Kuchar, D. / Kubota, M. / Matsuda, H. / Fukuta, T. / Yagishita, K. et al. | 2008
- 470
-
In-Situ Analysis of Corrosion Behavior of Copper Wiring System in LSI by Atomic Force MicroscopyHonbo, K. / Mabuchi, K. / Yamada, S. et al. | 2008
- 483
-
Invitation to the 118^t^h Meeting of the Surface Finishing Society of JapanIto, S. et al. | 2008
- 484
-
Current Status of Thermal Spray TechnologyOhmori, A. / Nakahira, A. et al. | 2008
- 490
-
Promising Field in New Thermal Spray Technology ``Cold Spray''Sakaki, K. et al. | 2008
- 495
-
Current Status and Problems of HVOF Thermal SprayWada, T. et al. | 2008
- 501
-
Present Status of Heat-Resistant Coatings and Standardization Trend for Their Evaluation and Testing MethodsItoh, Y. / Wada, K. et al. | 2008
- 508
-
Application of Thermal Spray for Heavy Duty Gas TurbineKojima, Y. et al. | 2008
- 514
-
An Application of Thermal Spray Techniques to Sodium Sulfur Battery Cell for Store Electrical PowerAndo, T. / Harada, Y. et al. | 2008
- 520
-
Hard Thermal Sprayed Coating and Corrosion ResistanceTakatani, Y. et al. | 2008
- 526
-
Problems and Perspectives in Leading-Edge Semiconductor Wafer Cleaning TechnologyHattori, T. et al. | 2008
- 534
-
Preparation and Properties of Carbon Microcoils (CMC)Motojima, S. / Chen, X. et al. | 2008
- 543
-
Chemical Reaction in an Interface Layer Consisting of Metal, Electrolyte and Air Generated during Zinc ElectroplatingTsuru, Y. / Tahira, M. / Yamada, T. et al. | 2008
- 548
-
Electrochemical Impedance Analysis for Detection of Cracks in Plating FilmItagaki, M. / Sakai, Y. / Shitanda, I. / Watanabe, K. / Yasuda, K. et al. | 2008
- 555
-
Fabrication of Cu Micro-pattern on Organic Resin Board by Electroless Plating and Laser IrradiationKikuchi, T. / Wachi, Y. / Sakairi, M. / Takahashi, H. / Iino, K. / Katayama, N. et al. | 2008
- 562
-
Fabrication of Conductive Thin Films on Precursor Polyimide via Chemical Reduction of Nickel (II) ComplexMatsumura, Y. / Enomoto, Y. / Jyo, T. / Akamatsu, K. / Nawafune, H. et al. | 2008
- 569
-
Editorial: Situation of Each Member's Company in This SocietyNakagishi, Y. et al. | 2008
- 570
-
Recent Surface Treatment Technologies for Printed Writing BoardsTakagi, K. et al. | 2008
- 579
-
Technical Overview and Trend of Oxide-Alternative Adhesion Promoting ProcessNishu, K. et al. | 2008
- 584
-
Coupling Agents for Metallic MaterialsYamabe, H. et al. | 2008
- 589
-
The Progression of Immersion Silver as a Final Finish for Circuit BoardsKenny, J. / Wengenroth, K. / Antonellis, T. / Kawashima, S. / Nagakura, M. et al. | 2008
- 593
-
New Copper Surface Treatment Technology for High Density Printed Wiring BoardYamashita, T. / Inoue, F. / Arike, S. / Hasegawa, K. et al. | 2008
- 597
-
Organic Solderability Preservative for Lead-free SolderingFukuda, H. et al. | 2008
- 602
-
Drug and PoisonKiyokawa, H. et al. | 2008
- 605
-
Effect of Pulse Current Electrolysis on the Mechanical Properties of Ni-SiC Composite Platings Using the Watts Bath Containing Sic Particles and Surfactants with an Azobenzene GroupKusabiraki, K. / Ogihara, H. / Iwata, S. / Shrestha, N.K. / Saji, T. et al. | 2008
- 610
-
Evaluation of Tin-Copper Mixed Catalyst for Replacement of Tin-Palladium Mixed Catalyst for Electroless PlatingInoue, K. / Baba, K. / Sugiyama, T. / Watanabe, M. / Honma, H. et al. | 2008
- 615
-
Effects of Deposition Temperature and Annealing Conditions on Flexibility of Flash-Evaporated TiNi Alloy FilmMineta, T. / Kubo, H. / Makiguchi, D. / Makino, E. / Kawashima, T. / Shibata, T. et al. | 2008
- 621
-
The Control of Friction Coefficient of DLC Coatings Using Micro-Dimpled SubstrateSuzuki, K. / Akebono, H. / Suzuki, H. et al. | 2008
- 627
-
Electrodeposition of Filled Via Using Periodical Reverse CurrentKondo, K. / Fukuda, R. / Saito, T. / Okamoto, N. / Ito, K. et al. | 2008
- 633
-
Application of Electropolished Titanium Plates to Counter Electrode for Dye-sensitized Solar CellsMuranaka, T. / Shiratsuchi, R. / Morita, M. et al. | 2008
- 641
-
Editorial: From Finishing to StartingHomma, T. et al. | 2008
- 642
-
Progress and Future View of Nanoimprint TechnologyHirai, Y. et al. | 2008
- 648
-
Room-Temperature NanoimprintNakamatsu, K.-i. / Matsui, S. et al. | 2008
- 654
-
Nanoimprint Lithography for CMOS Device FabricationWada, H. et al. | 2008
- 658
-
Optical Device Applications Using Nanoimprint TechnologiesMorikawa, M. et al. | 2008
- 662
-
Application of Nanoimprint Technology for BiodeviceSaito, T. / Kuwabara, K. / Yamamoto, J. / Miyauchi, A. et al. | 2008
- 667
-
Glass Nanoimprinting Molds Using Plated Ni-W AlloyYasui, M. / Takahashi, M. / Kaneko, S. / Hirabayashi, Y. / Sugimoto, K. / Maeda, R. et al. | 2008
- 671
-
Nanoimprint Lithography-Developments in Mass Production Technology-Tanaka, S. / Takaya, Y. et al. | 2008
- 676
-
Development of a New Melt Transcription Molding Process to Produce Thin Wall and Large Area Thermoplastic Products with Micro-Nano Scale Structures on Their SurfacesKishida, K. / Yakemoto, K. / Ito, H. / Shiroganeya, T. et al. | 2008
- 682
-
Modeling and Simulation of Electroplating in Micro-and Nano-ScalesAogaki, R. et al. | 2008
- 690
-
Corrosion Resistance of Lead Free Copper AlloyWada, H. / Tomikawa, T. / Ichino, R. / Okido, M. et al. | 2008
- 696
-
Prevention of Physical Property Changes While Being Kept at Room Temperature on the Electrodeposited CopperMatsuda, M. / Yoshihara, S. / Dobashi, M. et al. | 2008
- 701
-
Electrodeposition from Tin-Iron Alloy Plating Baths Containing Ferric IonSonoda, T. / Ando, N. / Fujihira, Y. et al. | 2008
- 707
-
Editorial: Change and No ChangeSagisaka, K. et al. | 2008
- 708
-
Progress of Technologies in Metal NanoparticlesToshima, N. et al. | 2008
- 712
-
Production of Nanoparticles and Their ApplicationsYonezawa, T. et al. | 2008
- 718
-
Nanoparticle Synthesis by Thermal PlasmasWatanabe, T. et al. | 2008
- 724
-
Synthesis of Size-Controlled Metal Nanoparticles by Wet-process and Their ApplicationsTomonari, M. / Ida, K. et al. | 2008
- 729
-
Preparation and Property Behavior of Thermo-Responsive Magnetic Nano ParticlesHata, H. et al. | 2008
- 732
-
Individually Dispersed Nano-particle Ink and Conductive Circuit Formation by InkjetOda, M. / Hayashi, S. / Ohsawa, M. / Hayashi, Y. / Tei, K. et al. | 2008
- 737
-
Self-Organized Structure Evolution by Colloidal Particles on Adsorptive Substrates or within Wetting FilmsMiyahara, M. / Watanabe, S. et al. | 2008
- 749
-
Simple and Sensitive Determination of Chromium(VI) in Conversion CoatingsKamaya, M. / Yanagi, S. / Nagashima, K. / Wakui, J. et al. | 2008
- 753
-
Preparation of Poly(methyl methacrylate)-Silica Composite Films Using Ethoxysilanes Possessing Acetoxy GroupTsuge, H. / Ono, S. et al. | 2008
- 757
-
Electronic Behavior of Nano-sized CeO~2/Carbon Cluster Composite Materials Obtained through Calcination of a Cerium(III) Acetate/Starch ComplexMiyazaki, H. / Matsui, H. / Ito, S. / Yoshihara, M. et al. | 2008
- 760
-
Electrodeposition of Sn-Pd Alloys from Acid Baths Containing L-CysteineNoro, M. / Fujiwara, Y. et al. | 2008
- 767
-
Learning from PioneersKamasaki, S. et al. | 2008
- 768
-
Direct Atomic-scale Observation Using Electron Diffraction Microscopy -Recording the Behavior of Atoms and the Determination of Elements: More than 60 Years History from Exposure to the Atomic Bombing of Hiroshima-Hashimoto, H. et al. | 2008
- 783
-
Characterization of Group III Nitride Semiconductor Hetero-interfaces by Advanced Transmission Electron MicroscopyTakeguchi, M. et al. | 2008
- 789
-
A New Era of an Ultra-high Resolution FE-SEMShimizu, K.-i. / Mitani, T. et al. | 2008
- 796
-
Focused Ion Beam Technique for Surface and Interface Analysis of Steel SheetsKawano, T. / Noro, H. / Sato, K. et al. | 2008
- 801
-
Development of in situ Electron Microscope Techniques Using Room Temperature Ionic LiquidKuwabata, S. / Torimoto, T. et al. | 2008
- 806
-
Development and Recent Technologies of Atomic Force MicroscopyIchii, T. et al. | 2008
- 812
-
Surface Potential Analysis of Corrosion by Scanning Probe MicroscopyMasuda, H. et al. | 2008
- 818
-
Sensing System for Bioassay Based on Scanning Electrochemical MicroscopyYasukawa, T. / Shuku, H. / Mizutani, F. / Matsue, T. et al. | 2008
- 825
-
Observation of Adsorbed Organic Molecules by in situ STM Operated in LiquidYamada, T. et al. | 2008
- 830
-
Today's Auger Electron Spectrometers (AES) and X-ray Photoelectron Spectrometers (XPS)Yamada, T. et al. | 2008
- 838
-
Materials Analysis with Li-K alpha and Al-L alpha X-ray by Ultra-soft X-ray Spectrometer for Electron Probe MicroanalysisOgiwara, T. / Kimura, T. et al. | 2008
- 842
-
Characterization of Surfaces and Interfaces of Steels Using XPS, AES and SIMSSuzuki, S. et al. | 2008
- 848
-
Element-Specific Surface X-ray Diffraction Using Synchrotron RadiationTakahasi, M. et al. | 2008
- 851
-
Application of Electrochemical Measurement to PlatingYamashita, T. / Yamaguchi, H. et al. | 2008
- 857
-
Practical Methods to Monitor the Properties of Copper Plating Using Electrochemical TechniquesOkubo, T. et al. | 2008
- 863
-
Evaluation of Materials Surface Using Capillary Micro-cell TechniqueFushimi, K. / Sakairi, M. / Habazaki, H. et al. | 2008
- 869
-
Novel Process Control Technology to Meet Challenges of Today's Electroplating RequirementsJaworski, A. / Wikiel, H. / Wikiel, K. / Uekawa, K. et al. | 2008
- 876
-
Scanning Electrochemical Microscopy with Microelectrodes- New Challenges and New ProspectsDonner, C. / Muranushi, Y. et al. | 2008
- 882
-
Characterization of Surfaces and Interfaces by High-resolution RBSNakajima, K. / Kimura, K. et al. | 2008
- 887
-
Recent Trend and Cases of ToF-SIMS AnalysisNanao, H. / Mori, S. et al. | 2008
- 893
-
Hydrogen Microscopy Using Electron-Stimulated Desorption MethodUeda, K. et al. | 2008
- 898
-
Surface-enhanced Infrared Spectroscopic Studies of Electrochemical Surface ReactionsOsawa, M. et al. | 2008
- 904
-
rf-GOES Depth Profiling Analysis of Nano-layers with an Improved Depth ResolutionShimizu, K.-i. et al. | 2008
- 907
-
Direct Observation of Water Droplet Motion on a Hydrophobic Self-assembled Monolayer Surface under AirflowHashimoto, A. / Sakai, M. / Song, J.-H. / Yoshida, N. / Suzuki, S. / Kameshima, Y. / Nakajima, A. et al. | 2008
- 913
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Evaluation of Microscopic Nonuniformity at the Interface between Tin Plated Film and Copper SubstrateMurakami, K. / Miyamoto, G. / Okano, M. / Hino, M. / Takamizawa, M. / Nakai, K. et al. | 2008
- 920
-
Analysis of Tarnished Copper FoilHaijima, Y. / Matsumura, A. / Sugiyama, T. / Tomonaga, S. / Dobashi, M. / Koiwa, I. et al. | 2008
- 925
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Lead Transfer to the Surface into Electrodeposited Tin Film and the Whisker GrowthHino, M. / Murakami, K. / Mitooka, Y. / Takamizawa, M. / Naka, T. / Nakai, K. et al. | 2008
- 931
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Cold Forging Visualization Technology Using a LubricantKomiyama, S. / Imai, Y. et al. | 2008
- 934
-
In-situ Elemental Analysis of Electrodeposited Films by Laser Ablation Plume Spectroscopy : Effects of Dissolved Elements on Emission SpectraSakka, T. / Oguchi, H. / Fukami, K. / Ogata, Y.H. et al. | 2008
- 937
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Structural Characterization of DLC Films Deposited by PBII Using ESRWatanabe, S. / Huang, B. / Moolsradoo, N. et al. | 2008