Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging (English)
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In:
IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS
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17
, 3
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498-509
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2011
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ISSN:
- Article (Journal) / Print
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Title:Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging
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Contributors:Kopp, C. ( author ) / Bernabe, S. ( author ) / Bakir, B.B. ( author ) / Fedeli, J. ( author ) / Orobtchouk, R. ( author ) / Schrank, F. ( author ) / Porte, H. ( author ) / Zimmermann, L. ( author ) / Tekin, T. ( author )
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Published in:IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS ; 17, 3 ; 498-509
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Publisher:
- New search for: Institute of Electrical and Electronics Engineers (IEEE)
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Publication date:2011-01-01
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Size:12 pages
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ISSN:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 537.5
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Classification:
DDC: 537.5 -
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Table of contents – Volume 17, Issue 3
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 493
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Table of contents| 2011
- 495
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Introduction to the Issue on Photonic Packaging and Integration TechnologiesGarcía-Blanco, Sonia M. / Bakir, Muhannad S. / Matthews, Karen I. / Ohashi, Keishi / Horst, Folkert et al. | 2011
- 498
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Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and PackagingKopp, C / Bernabé, Stéphane / Bakir, B B / Fedeli, J / Orobtchouk, R / Schrank, F / Porte, H / Zimmermann, L / Tekin, T et al. | 2011
- 498
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On-Chip Integration and Interconnects - Silicon Photonic Circuits: On-CMOS Integration, Fiber Optical Coupling, and Packaging (Invited Paper)Kopp, C et al. | 2011
- 510
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1× N Multimode Interference Beam Splitter Design Techniques for On-Chip Optical InterconnectionsHosseini, A / Kwong, D N / Yang Zhang, / Subbaraman, H / Xiaochuan Xu, / Chen, R T et al. | 2011
- 510
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1x N Multimode Interference Beam Splitter Design Techniques for On-Chip Optical InterconnectionsHosseini, A. / Kwong, D.N. / Zhang, Y. / Subbaraman, H. / Xiaochuan, X. / Chen, R.T. et al. | 2011
- 516
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Monolithic Integration of Silicon-, Germanium-, and Silica-Based Optical Devices for Telecommunications ApplicationsTsuchizawa, Tai / Yamada, Koji / Watanabe, Toshifumi / Sungbong Park, / Nishi, Hidetaka / Rai Kou, / Shinojima, Hiroyuki / Itabashi, Sei-ichi et al. | 2011
- 516
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Monolithic Integration of Silicon-, Germanium-, and Silica-Based Optical Devices for Telecommunications Applications (Invited Paper)Tsuchizawa, T et al. | 2011
- 526
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Wafer Level High-Speed Germanium Photodiode Array IntegrationKopp, Christophe / Ferron, Alexandre / Hartmann, Jean-Michel / Fournier, Maryse / Augendre, Emmanuel / Grosse, Philippe / Fedeli, Jean-Marc / Derks, Henk et al. | 2011
- 531
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Thermal Analysis: VCSELs on an SiOBChen, C C / Chen, Y C / Chin-Ta Chen, / Hsu-Liang Hsiao, / Chia-Chi Chang, / Cheng, Y T / Wu, Mount-Learn et al. | 2011
- 540
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Monolithic Integration of 2-D Multimode Interference Couplers and Silicon Photonic WiresWei-Chao Chiu, / Cheng-Yen Lu, / Lee, Ming-Chang M et al. | 2011
- 546
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Integration and Packaging of a Macrochip With Silicon Nanophotonic Links (Invited Paper)Cunningham, J E et al. | 2011
- 546
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Integration and Packaging of a Macrochip With Silicon Nanophotonic LinksCunningham, J E / Krishnamoorthy, A V / Ron Ho, / Shubin, I / Thacker, H / Lexau, J / Lee, D C / Dazeng Feng, / Chow, E / Ying Luo, et al. | 2011
- 559
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Two-Axis MEMS Lens Alignment System for Free-Space Optical InterconnectYoxall, B E / Walmsley, R / Huei-Pei Kuo, / Shih-Yuan Wang, / Tan, M / Horsley, D A et al. | 2011
- 559
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Chip-to-Chip and Board-to-Board Interconnects - Two-Axis MEMS Lens Alignment System for Free-Space Optical InterconnectYoxall, B E et al. | 2011
- 566
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Analysis of Reflective Self-Organized Lightwave Network (R-SOLNET) for Z-Connections in 3-D Optical Circuits by the Finite-Difference Time-Domain MethodYoshimura, Tetsuzo / Wakabayashi, Kazuyuki / Ono, Shigeru et al. | 2011
- 571
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Grating-Based Optical Fiber Interfaces for Silicon-on-Insulator Photonic Integrated Circuits (Invited Paper)Roelkens, G et al. | 2011
- 571
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Grating-Based Optical Fiber Interfaces for Silicon-on-Insulator Photonic Integrated CircuitsRoelkens, G / Vermeulen, D / Selvaraja, S / Halir, R / Bogaerts, W / Van Thourhout, D et al. | 2011
- 581
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Design and Analysis of Optical Coupling Between Silicon Nanophotonic Waveguide and Standard Single-Mode Fiber Using an Integrated Asymmetric Super-GRIN LensQian Wang, / Ter-Hoe Loh, / Ng, D K T / Seng-Tiong Ho, et al. | 2011
- 590
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Integrated-Optic Free-Space-Wave Coupler for Package-Level On-Board Optical InterconnectsUra, S / Shimizu, K / Kita, Y / Kintaka, K / Inoue, J / Awatsuji, Y et al. | 2011
- 597
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A Grating-Coupler-Enabled CMOS Photonics PlatformMekis, A / Gloeckner, S / Masini, G / Narasimha, A / Pinguet, T / Sahni, S / De Dobbelaere, P et al. | 2011
- 597
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A Grating-Coupler-Enabled CMOS Photonics Platform (Invited Paper)Mekis, A et al. | 2011
- 609
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Integrated Optical Backplane AmplifierJing Yang, / Lamprecht, Tobias / Wörhoff, Kerstin / Driessen, Alfred / Horst, Folkert / Offrein, Bert J / Ay, Feridun / Pollnau, Markus et al. | 2011
- 617
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Ultrathin Optoelectronic Device Packaging in Flexible CarriersBosman, E / Missinne, J / Van Hoe, B / Van Steenberge, G / Kalathimekkad, S / Van Erps, J / Milenkov, I / Panajotov, K / Van Gijseghem, T / Dubruel, P et al. | 2011
- 617
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Packaging and Testing Technologies - Ultrathin Optoelectronic Device Packaging in Flexible Carriers (Invited Paper)Bosman, E et al. | 2011
- 629
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Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMSLapisa, Martin / Stemme, Göran / Niklaus, Frank et al. | 2011
- 629
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Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS (Invited Paper)Lapisa, M et al. | 2011
- 645
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Packaging and Assembly for Integrated Photonics — A Review of the ePIXpack Photonics Packaging Platform (Invited Paper)Zimmermann, L et al. | 2011
- 645
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Packaging and Assembly for Integrated Photonics—A Review of the ePIXpack Photonics Packaging PlatformZimmermann, L / Preve, G B / Tekin, T / Rosin, T / Landles, K et al. | 2011
- 652
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Passive Alignment and Mounting of LiNbO$_3$ Waveguide Chips on Si Substrates by Low-Temperature Solid-State Bonding of AuTakigawa, R / Higurashi, E / Suga, T / Kawanishi, T et al. | 2011
- 659
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Wafer-Testing of Optoelectonic–Gigascale CMOS Integrated CircuitsThacker, H D / Ogunsola, O O / Muler, A V / Meindl, J D et al. | 2011
- 659
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Wafer-Testing of Optoelectonic-Gigascale CMOS Integrated Circuits (Invited Paper)Thacker, H D et al. | 2011
- 671
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Device and Integration Technology for Silicon Photonic Transmitters (Invited Paper)Park, H et al. | 2011
- 671
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Device and Integration Technology for Silicon Photonic TransmittersHyundai Park, / Sysak, M N / Hui-Wen Chen, / Fang, A W / Di Liang, / Ling Liao, / Koch, B R / Bovington, J / Yongbo Tang, / Wong, K et al. | 2011
- 689
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Nanobonding Technology Toward Electronic, Fluidic, and Photonic Systems IntegrationHowlader, M M R / Selvaganapathy, P R / Deen, M Jamal / Suga, T et al. | 2011
- 689
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Nanobonding Technology Toward Electronic, Fluidic, and Photonic Systems Integration (Invited Paper)Howlader, M M R et al. | 2011
- 704
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Review of Packaging of Optoelectronic, Photonic, and MEMS ComponentsTekin, Tolga et al. | 2011
- 704
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Review of Packaging of Optoelectronic, Photonic, and MEMS Components (Invited Paper)Tekin, T et al. | 2011
- 720
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Enabling Devices Toward Fully Integrated Systems - Investigation of LED Light Output Performance Characteristics Under Different Alternating Current Regulation ModesFeng, W et al. | 2011
- 720
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Investigation of LED Light Output Performance Characteristics Under Different Alternating Current Regulation ModesWeifeng Feng, / Yongzhi He, / Shi, Frank G et al. | 2011
- 724
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Transverse-Mode Analysis of Red-Emitting Highly Polarized Vertical-Cavity Surface-Emitting LasersWeidenfeld, S / Eichfelder, M / Wiesner, M / Schulz, Wolfgang-Michael / Rosbach, R / Jetter, M / Michler, P et al. | 2011
- 730
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Silicon Photodiodes in Standard CMOS TechnologyFang-Ping Chou, / Guan-Yu Chen, / Ching-Wen Wang, / Yu-Chang Liu, / Wei-Kuo Huang, / Yue-Ming Hsin, et al. | 2011
- 730
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Silicon Photodiodes in Standard CMOS Technology (Invited Paper)Chou, F-P et al. | 2011
- 741
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High Thermal Stability of Phosphor-Converted White Light-Emitting Diodes Employing Ce:YAG-Doped GlassWang, Jimmy / Chun-Chin Tsai, / Wei-Chih Cheng, / Ming-Hung Chen, / Cheng-Hsun Chung, / Wood-Hi Cheng, et al. | 2011
- 747
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Optoelectronic CMOS Power Supply Unit for Electrically Isolated Microscale ApplicationsAktan, O / Sarioglu, B / Cindemir, U / Onur Unlu, Saruhan / Dundar, G / Mutlu, S / Yalcinkaya, A D et al. | 2011
- 757
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ANNOUNCEMENTS - Call for Papers — IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS Issue on Biophotonics 2| 2011
- 757
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Biophotonics 2| 2011
- 758
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Photonics for environmental sensing| 2011
- 758
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Call for Papers — IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS Issue on Photonics for Environmental Sensing| 2011
- 759
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Call for Papers — IEEE JOURNAL OF QUANTUM ELECTRONICS Special Issue on Optoelectronic Device Integration| 2011
- 759
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Special issue of the IEEE Journal of Quantum Electronics on Optoelectronic Device Integration| 2011
- 760
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Call for Papers — IEEE JOURNAL OF SELECTED TOPICS IN QUANTUM ELECTRONICS Issue on Quantum and Nanoscale Photonics| 2011
- 760
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Special issue on quantum and nanoscale photonics| 2011
- C2
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IEEE Journal of Selected Topics in Quantum Electronics publication information| 2011
- C3
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IEEE Journal of Selected Topics in Quantum Electronics information for authors| 2011
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PHOTONIC PACKAGING AND INTEGRATION TECHNOLOGIES| 2011