New Evaluation Technology for Electro-Magnetic Shielding Materials and EM Absorption Materials (Unknown)
- New search for: Suzuki, H.
- New search for: Suzuki, H.
In:
JOURNAL- SURFACE FINISHING SOCIETY OF JAPAN
;
62
;
251-254
;
2011
-
ISSN:
- Article (Journal) / Print
-
Title:New Evaluation Technology for Electro-Magnetic Shielding Materials and EM Absorption Materials
-
Contributors:Suzuki, H. ( author )
-
Published in:JOURNAL- SURFACE FINISHING SOCIETY OF JAPAN ; 62 ; 251-254
-
Publisher:
- New search for: SURFACE FINISHING SOC JAPAN
-
Publication date:2011-01-01
-
Size:4 pages
-
ISSN:
-
Type of media:Article (Journal)
-
Type of material:Print
-
Language:Unknown
- New search for: 684.1043
- Further information on Dewey Decimal Classification
-
Classification:
DDC: 684.1043 -
Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 62
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
-
A Happy New Year !Takahashi, H. et al. | 2011
- 2
-
Recent Advances in Coated Steel Sheets and the Corrosion Protection MechanismNishikata, A. et al. | 2011
- 8
-
Hot-dip Zinc-Aluminum Alloy Coated Steel SheetOoi, T. et al. | 2011
- 14
-
Hot-dip Zn-Al-Mg Alloy Coated Steel SheetsUranaka, M. et al. | 2011
- 20
-
Aluminized Steel SheetsMaki, J. et al. | 2011
- 25
-
Corrosion Protection Mechanism of Zinc Coated Steel SheetShinohara, T. et al. | 2011
- 30
-
Accelerated Corrosion Test Method in International Standard for Surface-Treated Steel SheetsSuga, S. et al. | 2011
- 35
-
Atmospheric-Pressure Microplasma Treatment on Fluorocarbon Thin Film and Mechanism of Fabrication of Nano-textured SurfaceSakakibara, A. / Itoigawa, F. / Nakamura, T. / Hayakawa, S. et al. | 2011
- 41
-
Effect of Corrosion Atmosphere Using Environmental Test Chamber on Whisker Growth of Tin ElectroplatingHino, M. / Murakami, K. / Mitooka, Y. / Muraoka, K. / Takamizawa, M. et al. | 2011
- 47
-
Influence of Electroless Ni-P Film Condition on Wire BondabilityKato, I. / Terashima, H. / Watanabe, H. / Honma, H. et al. | 2011
- 54
-
Analyses of Stabilizer in Electroless Ni-P Films by Thermal Desorption Spectrometry (TDS)Deguchi, K. / Hirashita, N. / Maejima, K. / Koiwa, I. et al. | 2011
- 73
-
Future Challenge of the Surface Finishing Society and Education of TechnologistYamashita, T. et al. | 2011
- 74
-
Self-Organizations and Engineering ApplicationsYamaguchi, T. et al. | 2011
- 80
-
Self-Organized Formation of Layered Structures of Iron-Group Alloys by Oscillatory ElectrodepositionNakanishi, S. et al. | 2011
- 85
-
Protection of Metals against Corrosion by Coverage with Ultrathin Polymer Films of Self-Assembled MonolayersAramaki, K. et al. | 2011
- 92
-
Nano- and Microfabrication Using Self-Organized Materials ∼ Natural Lithography ∼Asoh, H. / Ono, S. et al. | 2011
- 98
-
Self-Assembled Monolayer to MultilayerSugimura, H. et al. | 2011
- 104
-
Dynamically Tunable Microwrinkles: Tunability and ApplicationsOhzono, T. et al. | 2011
- 109
-
Multi-Functional Sunscreen Agent using Self-OrganizationIshii, H. / Yamada, K.-i. et al. | 2011
- 115
-
Tin Plating and Tin Alloy Plating (1)Fujimura, I. et al. | 2011
- 119
-
Learning from the Story of Three Little PigsMatsumura, Y. et al. | 2011
- 121
-
Improvement of Tribological Characteristics and Fatigue Life for Magnesium Alloy with DLC/FPB Combined Surface TreatmentSasada, T. / Suzuki, H. et al. | 2011
- 127
-
Chromium Free Pretreatment of Plating on Polystyrene ResinSatoh, M. / Miyoshi, Y. / Kakihara, K. / Tanaka, A. / Yamazaki, K. et al. | 2011
- 131
-
Physical Properties of Plating Films from Boric Acid-Free Nickel Sulfamate BathWakuda, Y. / Yoshida, K. / Tashiro, K. / Honma, H. et al. | 2011
- 138
-
Electrodeposition Behavior of Zn-Ni Alloy from Zincate SolutionIkari, Y. / Motomura, K. / Kobayashi, S. / Nakano, H. / Kanda, K. et al. | 2011
- 145
-
Considering the Surface Finishing Society of JapanIto, S. et al. | 2011
- 146
-
Synthesis of Diamond from Gas Phase; Technology and ApplicationFujimori, N. et al. | 2011
- 152
-
Fabrication and Application of Diamond Films for Dry Forming DieTakeuchi, S. / Yokosawa, T. et al. | 2011
- 157
-
Applications of Diamond Film as Electrodes for Electrolytic ProcessesNishiki, Y. et al. | 2011
- 163
-
Development of Hetero-Epitaxial Diamond Substrate and its Device ApplicationsSawabe, A. / Kodama, H. / Washiyama, S. / Hitaka, M. / Abe, S. / Ichihara, Y. / Kotaki, T. / Koyama, K. / Oyama, K. / Ishigaki, N. et al. | 2011
- 170
-
Next Generation Power Device by DiamondShikata, S. et al. | 2011
- 175
-
Fabrication of a Diamond-Based Imprint MoldYoshikawa, H. / Ando, Y. / Takezawa, N. / Yamanoi, T. / Hiraide, T. / Mita, M. / Oi, H. / Yoshimoto, M. et al. | 2011
- 179
-
Characterization of Multi-Walled Carbon Nanotube-Supported Pt Catalyst Prepared by Metal Nanocolloidal Solution for a Polymer Electrolyte Fuel Cell CatalystEguchi, M. / Yamamoto, S. / Kikuchi, M. / Uno, K. / Kobayashi, Y. / Nishitani-Gamo, M. / Ando, T. et al. | 2011
- 184
-
Effects of Dimension of Micro Pillar Array and Plasma Modification on Wetting Properties of SU-8 Surface for Water DropletKobayashi, S. / Makino, E. / Mineta, T. et al. | 2011
- 189
-
Optimization of Silver Mirror Reaction for Silver CoatingAoki, Y. / Azumi, K. et al. | 2011
- 197
-
ReconstructionSakamoto, Y. et al. | 2011
- 198
-
Surface Phenomena and Oxide Film Growth on MagnesiumOno, S. et al. | 2011
- 204
-
Biomedical Application of Biodegradable Magnesium AlloysYamamoto, A. et al. | 2011
- 211
-
Rechargeable Magnesium BatteryYoshimoto, N. / Morita, M. et al. | 2011
- 217
-
The Environmental Friendly Plating Process on Magnesium AlloyHara, K. et al. | 2011
- 222
-
Hayabusa, Hayate vs. Mizuho, SakuraChinda, A. et al. | 2011
- 225
-
Tin Plating and Tin Alloy Plating (2)Fujimura, I. et al. | 2011
- 229
-
High-Performance Liquid Chromatography Analysis of Copper Electroplating Additives used for Via-FillingNishitani, T. / Honma, H. et al. | 2011
- 243
-
Create the FutureMoriga, T. et al. | 2011
- 244
-
Recent Trends in Electromagnetic Wave Shield and Microwave Absorber MaterialYamamoto, T. et al. | 2011
- 251
-
New Evaluation Technology for Electro-Magnetic Shielding Materials and EM Absorption MaterialsSuzuki, H. et al. | 2011
- 255
-
Electromagnetic Wave Absorption Material Composed of Nanocomposite Magnetic ParticlesFujieda, T. et al. | 2011
- 261
-
Surface Treated Steel Sheets Contributing to the EMC of Electronics EquipmentsHirano, Y. et al. | 2011
- 265
-
Dreams of the Past, Dreams of the PresentKondoh, E. et al. | 2011
- 267
-
SEM Observation of the Surface of Polyimide Film with High Permittivity by Ar Ion Implantation TechniqueSuzuki, Y.-i. / Ogata, Y.H. et al. | 2011
- 273
-
Application of FE-EPMA Evaluation to Microstructure between Pb-free Solder Alloy and Ni-P Coating LayerIkemoto, S. / Kitahara, Y. / Oda, T. / Noguchi, T. / Maeda, C. / Yamashita, M. et al. | 2011
- 279
-
E-book and Technical InformationMorikawa, T. et al. | 2011
- 280
-
Surface Plasmon Probes for Surface EngineeringKajikawa, K. et al. | 2011
- 285
-
Advanced Biosensing Based on PlasmonicsIshida, A. et al. | 2011
- 291
-
Improvement of Photodetector Performance by Surface PlasmonOno, A. / Satoh, H. / Inokawa, H. et al. | 2011
- 296
-
High Sensitive Optical Measurement by the Use of Localized Surface PlasmonsKano, H. et al. | 2011
- 301
-
In-situ Monitoring of Dynamic Behavior of a Single Molecule at Metal NanogapTakase, M. / Nabika, H. / Yasuda, S. / Murakoshi, K. et al. | 2011
- 306
-
Precious Metals for Localized Surface Plasmon Resonance Measurement ApplicationsKurita, M. et al. | 2011
- 309
-
Analog and DigitalTakaoka, H. et al. | 2011
- 311
-
Surface Modification of Solder Resist and Dry Film Resist by 60Hz Nonequilibrium Atmospheric Pressure Plasma Using O~2/N~2 GasIwata, Y. / Sakamoto, H. / Inui, H. / Hori, M. et al. | 2011
- 317
-
Influence of Hydrogen-Induced Superabundant Vacancies in Electrodeposited Rh FilmFukumuro, N. / Narita, S. / Yae, S. / Matsuda, H. et al. | 2011
- 323
-
IT (Information Technology)Yae, S. et al. | 2011
- 324
-
The Past, Present, and Future of Anodic Porous Alumina Study - For the Development of Novel Nano-Technologies -Takahashi, H. et al. | 2011
- 330
-
Three-Dimensional Porous Alumina Micro-StructuresTsukamoto, T. / Kase, T. / Ogino, T. et al. | 2011
- 335
-
Detachment Methods of Porous Anodic Alumina Films from Al Substrates and Fabrication of Free-Standing Alumina MembranesMizuki, I. et al. | 2011
- 341
-
Nanoporous Waveguide Sensor Using a Porous Anodic Alumina FilmYamaguchi, A. / Teramae, N. et al. | 2011
- 346
-
Effect of High-Frequency Switching Electrolysis on Structure of Anodic Oxide Film Formed on Aluminum AlloyFujita, M. / Tanaka, H. / Muramatsu, H. / Yamamoto, T. / Asoh, H. / Ono, S. et al. | 2011
- 351
-
Let's Compare `Spices'Shinta, R. et al. | 2011
- 354
-
Microstructures and Hardness of Cr-B-N, Cr-C-N and Cr-O-N Coatings Deposited by PVD Arc Ion Plating MethodMinami, T. / Nishio, S. / Murata, Y. et al. | 2011
- 365
-
Innovative Surface Finishing Technology Can Reactivate JapanKume, M. et al. | 2011
- 366
-
Latest PWB Surface Finish and Technology TrendsUtsunomiya, H.H. et al. | 2011
- 372
-
Laser Drilling Technology for Printed Wiring BoardKuze, O. et al. | 2011
- 377
-
Selective Electroless Copper Plating on Minute Circuit Pattern using of Conductive PasteSanichi, S. et al. | 2011
- 382
-
Technology of Copper Via FillingEda, T. / Hagiwara, H. / Kimizuka, R. et al. | 2011
- 387
-
ENEPIG as Final Finish Plating on Printed Wiring Board and Package SubstrateTajima, K. et al. | 2011
- 392
-
Electroless Tin Plating for Printed Wiring BoardsTanaka, K. et al. | 2011
- 397
-
Electrodeposition and Properties of Gold-Nickel Alloy Film with a Nanocrystalline-Amorphous Mixed StructureSenda, K. / Iwai, R. / Tokuhisa, T. / Kato, M. / Yamachika, N. / Okinaka, Y. / Osaka, T. et al. | 2011
- 403
-
The Effect of Pretreatment to the Steel Surface on Galvannealing Behavior of Galvanized SteelTaira, S. / Sakurai, M. / Sugimoto, Y. / Hamada, E. / Sato, K. / Hashimoto, S. et al. | 2011
- 411
-
Analysis of Sulfur Compound in Electroless Nickel Plating Solution by Electrochemical MeasurementTsukahara, Y. / Watariguchi, S. / Tajima, K. / Yoshioka, T. / Yanagimoto, H. et al. | 2011
- 413
-
Synthesis of Gold Nanoparticles on Petal-shaped Silica by Solution PlasmaYamamoto, T. / Tanabe, F. / Takai, O. / Saito, N. et al. | 2011
- 421
-
Energy Policy and Surface TechnologyHara, M. et al. | 2011
- 422
-
Surface Finishing Technology for Substrates of Electronic DevicesChinda, A. et al. | 2011
- 429
-
Next Generation Organic Solderability PreservativeKurita, Y. / Yokoe, K. / Hirao, H. et al. | 2011
- 433
-
Development of a New Multi Layer Substrate using Ag-Sn Liquid Phase Sintering ProcessKondo, K. et al. | 2011
- 436
-
Present State Analysis of Additive for Via-Filling Plating Solution - Applying Cyclic Voltammetric Stripping (CVS) Analysis -Nishiki, S. et al. | 2011
- 440
-
Through Copper Direct Drilling Process by CO~2 LaserOkamoto, K. / Ito, K. / Muraki, T. et al. | 2011
- 443
-
AlN Materials as the High Thermal Conductive SubstrateYamamoto, Y. et al. | 2011
- 448
-
Direct Copper Electrodeposition on High Resistivity Substrates and Property of Deposited Copper FilmArimura, H. / Tsuruoka, T. / Akamatsu, K. / Nawafune, H. et al. | 2011
- 451
-
Fabrication of Micro-Circuit with Aluminum and Its OxideKikuchi, T. / Fujita, S. / Sakairi, M. et al. | 2011
- 456
-
Joint Meeting of Iwate Surface Technology Association and Japan Society of Corrosion Engineering, Tohoku Branch inNanao, H. et al. | 2011
- 457
-
Influence of Additional Element Ni and Cu on Corrosion Resistance of FeAl in HCl SolutionTomaru, M. / Yakou, T. et al. | 2011
- 463
-
Effectiveness of Coulostatic Electrodeposition of MultilayersTakane, N. / Narita, H. / Arai, S. et al. | 2011
- 475
-
Three Kinds of PolicyWatanabe, S. et al. | 2011
- 477
-
Si Clathrate CompoundsImai, M. / Imai, Y. et al. | 2011
- 486
-
Rechargeable Batteries Using Molecular ClustersYoshikawa, H. / Awaga, K. et al. | 2011
- 491
-
Metal-Cluster CatalystsTada, M. et al. | 2011
- 496
-
Electrical Conduction by Clusters - Copper Acetylide Nanowires -Judai, K. et al. | 2011
- 503
-
Electrical and Thermoelectric Properties of a-tetragonal Boron NanobeltsKirihara, K. et al. | 2011
- 509
-
Let's compare ``Citrus sudachi'' with ``Kabosu''Murata, Y. et al. | 2011
- 511
-
Local Cu Electro-Plating on Non-Conductive Substrate and Fabrication of Metal Structure with Solution Flow Type Micro-Droplet CellSakairi, M. / Goto, Y. / Kikuchi, T. / Fushimi, K. et al. | 2011
- 516
-
Electrode Performance of S-doped Vanadium Pentoxide as Cathode Active Material for Rechargeable Magnesium BatteryInamoto, M. / Kurihara, H. / Yajima, T. et al. | 2011
- 521
-
New Quantitative Analysis Method for Evaluation of White Rust Occurrence on Zinc-Coated Steel Sheets with Chemical Conversion CoatingsKajiyama, H. / Fujita, S. / Uesugi, M. / Hara, N. et al. | 2011
- 533
-
On Changing Number of Our Society's MemberIto, S. et al. | 2011
- 535
-
The Basic Wastewater Treatment and the Response to the New Wastewater RegulationInamoto, J. et al. | 2011
- 541
-
Selective Separation and Recovery of Metals from Electroplating Wastewater by SulfidationNomura, N. / Abe, H. / Fukuta, T. / Yagishita, K. et al. | 2011
- 546
-
New Technology of Waste Water Treatment by Using Gas SensorOnishi, A. et al. | 2011
- 549
-
Metal Recovery from Electroplating Wastewater using Iron-Oxidizing BacteriaMiki, O. / Kato, T. et al. | 2011
- 554
-
Continuous Nickel Recovery from Spent Electroless Nickel Plating Bath by Solvent ExtractionTanaka, M. / Naganawa, H. / Watanabe, S. / Kumano, H. et al. | 2011
- 559
-
Contact Resistance Stability and Mechanism of Multilayered Sn/Ag Electroplating on Cu Alloys under High Temperature CircumstanceChu, S.-Z. / Kumagai, J. / Okita, T. / Tamakawa, T. / Okada, K. / Nakaya, K. / Kato, N. et al. | 2011
- 568
-
The Friction Properties Examination of DLC Films against Woods, Cloths and PapersHonda, M. / Yamamoto, A. / Fuyama, N. / Nawachi, N. / Tsutsumoto, T. et al. | 2011
- 575
-
Analysis of Inhibitor Film Coated on NickelSakurai, K. / Yamashita, T. et al. | 2011
- 583
-
Education and ResearchOno, S. et al. | 2011
- 584
-
Take a Step Forward to New Plating Technology!Nawafune, H. / Akamatsu, K. / Tsuruoka, T. et al. | 2011
- 589
-
Reactive Composit Plating Using Nano-PowderKoiwa, I. / Haijima, Y. et al. | 2011
- 594
-
Composite Plating of NanoparticlesMatsubara, H. et al. | 2011
- 602
-
Preparation of Oxide Semiconductors by Electrochemical Reactions and the Construction of Photovoltaic DevicesIzaki, M. et al. | 2011
- 609
-
New Electroless Plating using Nano Dispersion of PolypyrroleIshiguro, T. / Harasawa, J. / Ashizawa, H. et al. | 2011
- 614
-
Etchingless Electroless Plating with Metal Colloid CatalystsHoriuchi, S. / Nakao, Y. et al. | 2011
- 619
-
Prospects of Electroforming for Precise Microfabrication TechnologyHattori, T. et al. | 2011
- 625
-
Medical Chip Devices Functionalized by Plating TechnologyObata, T. et al. | 2011
- 630
-
Improvement of Osteoconductivity of Hydroxyapatite Coating on Ti Substrate using Hydro-ProcessingKuroda, K. / Okido, M. et al. | 2011
- 635
-
Gold Plating Films for Electronic ComponentsSugiyama, A. / Yokoshima, T. / Hachisu, T. / Okinaka, Y. / Osaka, T. et al. | 2011
- 642
-
Future Plating Technology for Next Generation High Density Electronic PackagingAoyagi, M. et al. | 2011
- 647
-
Plating Technology Required of LED LightingKatayama, J. et al. | 2011
- 652
-
Current Plating Technologies and Future Plating Technologies for Automotive IndustriesBessho, T. et al. | 2011
- 657
-
Quantum Chemical Analysis of Electroless Deposition ProcessesKunimoto, M. / Homma, T. et al. | 2011
- 663
-
A Grant of Photocatalyst Function by the Electrolytic Deposition of FeTiOx to the Hole Inside of Aluminum Anodic Oxidation FilmsFujino, T. et al. | 2011
- 667
-
Preparation of Nickel Oxide Tubes from Electrospinning and Electroless Plating Techniques and Their Application to Electrochemical CapacitorsTsutsumi, H. et al. | 2011
- 672
-
Electrodeposition of Cu-Sn Alloy from an Environmentally Friendly Noncyanide Sulfosuccinate BathNakamura, T. / Yamamoto, T. / Nagayama, T. / Mizutani, Y. / Nawafune, H. et al. | 2011
- 676
-
Novel Surface Modification Process by the Polygonal Barrel-Sputtering MethodAbe, T. / Inoue, M. et al. | 2011
- 681
-
The Wear Resistance Property of Cu/Ni Multilayer Films Prepared by Electrodeposition in Single and Dual BathsFukunishi, M. / Matsumoto, F. / Sato, Y. et al. | 2011
- 686
-
Influence of Gloss Agent Types on Tensile Properties of Bulk Nanocrystalline Ni Electrodeposited from Sulfamate BathMatsui, I. / Iwami, H. / Takigawa, Y. / Uesugi, T. / Higashi, K. et al. | 2011
- 691
-
Electroless Copper Plating on Resins Using Nano-Dispersion of PolypyrroleAshizawa, H. / Kato, S.-i. / Nakamura, Y. et al. | 2011
- 696
-
Corrosion Control in the Coating Process of Mg AlloysAzumi, K. / Hamed, E.H. / Tang, J. et al. | 2011
- 702
-
Thermal Expansion Properties of Invar Alloy ElectrodepositsYamamoto, T. / Nagayama, T. / Nakamura, T. / Mizutani, Y. et al. | 2011
- 708
-
Effect of Nickel(II) ion on Copper Electrodeposition from Ethylenediamine Complex BathArimura, H. / Shigematsu, T. / Tsuruoka, T. / Akamatsu, K. / Nawafune, H. et al. | 2011
- 712
-
Zero-Emission Recycling of Electroless Nickel Plating SolutionTakagami, H. / Ooyabu, G. / Kawakami, H. / Fukumuro, N. / Yae, S. / Matsuda, H. et al. | 2011
- 717
-
Effect of the Addition of Saccharin Sodium Salt on the Hardness of Electroplated Ni-P FilmSaeki, I. / Kimura, T. / Haruki, K. / Sato, T. et al. | 2011
- 720
-
Formation of PtCu Catalyst by Electrodeposition and Dealloying Method onto Cycloolefin PolymerMisu, Y. / Nishizeko, H. / Yokoshima, T. / Momma, T. / Osaka, T. et al. | 2011
- 723
-
Preparation of Transparent, Photocatalytic Layer by Use of Highly Cystalline TiNbOx-System Nanosheets and Its Application for Rapid Decomposition of Organic CompoundSuzuki, S. / Teshima, K. / Yamaguchi, A. / Yubuta, K. / Shishido, T. / Oishi, S. et al. | 2011
- 726
-
Study of the Blackening Electroless Ni-P Plating for Superior Solar AbsorptionIkeyama, K. / Miyamoto, M. / Ariyama, Y. / Yamaguchi, F. et al. | 2011
- 728
-
Copper Filling using Diallylamine AdditivesAnami, Y. / Takeuchi, M. / Okamoto, N. / Saitou, T. / Bunya, M. / Kondo, K. et al. | 2011