Smart Systems Integration: Value chains and markets (English)
- New search for: Kóhler, Thomas
- New search for: Kóhler, Thomas
In:
Smart Systems Integration 2014
; 209-216
;
2019
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ISBN:
- Conference paper / Print
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Title:Smart Systems Integration: Value chains and markets
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Contributors:Kóhler, Thomas ( author )
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Conference:International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components ; 8. ; 2014 ; Wien
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Published in:Smart Systems Integration 2014 ; 209-216
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Publisher:
- New search for: Curran Associates, Inc.
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Place of publication:Red Hook, NY
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Publication date:2019
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ISBN:
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Type of media:Conference paper
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Type of material:Print
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Language:English
- New search for: 50.94
- Further information on Basic classification
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Classification:
BKL: 50.94 Mikrosystemtechnik, Nanotechnologie -
Source:
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
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Smart Systems enable automotive powertrain developmentBergmann, Alexander et al. | 2019
- 13
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Energy efficient magnetoresistive sensors for low-power and wireless applicationsSlatter, Rolf / Doms, Marco et al. | 2019
- 23
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Progress in manufacturing of GaN SAW devices resonating in the GHz frequency range for T sensors applicationsMuller, Alexandru et al. | 2019
- 25
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Peristaltic MicroPump with Active Damping (PMP-AD)Spieth, Sven / Schumacher, Axel / Götz, Martin / Kattinger, Gerhard / Merz, Jürgen / Zengerle, Roland et al. | 2019
- 33
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Tunable Straining of Silicon Nanowires Integrated in a MEMS Device by Electrostatic ActuationWagesreither, Stefan et al. | 2019
- 37
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Failure Mechanisms in the 3D Integration of MEMS and ASIC via Au-capped CuBorowsky, David / Schelling, Christoph / Burghartz, Joachim et al. | 2019
- 45
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Waferbonding Technologies for 3D-IntegrationBaum, Mario / Hofmann, C. / Besser, J. / Vogel, K. / Wiemer, M. / Gessner, T. et al. | 2019
- 53
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Monolithic integration of temporary bonded thin wafersUhrmann, Thomas / Burggraf, Jürgen / Bravin, Julian / Wiesbauer, Harald / Dragoi, Viorel / Wimplinger, Markus / Matthias, Thorsten / Lindner, Paul et al. | 2019
- 59
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Highly lonized Sputter Deposition into Through Silicon Vias with Aspect Ratios Up to 15:1Viehweger, Kay / Wolf, M. J. / Lang, K.-D. / Weichart, J. / Elghazzali, M. / Reynolds, G. J. / Koller, A. / Dill, A. et al. | 2019
- 69
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Fully autonomous Tire Pressure Monitoring System (TPMS) powered by a vibrational electrostatic energy harvesterElfrink, R. / Acht, V. van / Stanzione, S. / Bembnowicz, P. / Tutelaers, M. / Schaijk, R. van et al. | 2019
- 77
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Integration concepts for fluidic actuators in hybrid structuresSchüller, Martin / Lipowski, M. / Weigel, P. / Otto, T. / Geßner, T. / Walther, M. / Schulze, R. / Nestler, J. / Kroll, L. et al. | 2019
- 85
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Non-specific NDIR microarrays as an in-line tool to monitor food processingCalaza, Carlos / Fonseca, Luis et al. | 2019
- 93
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A monolithic integrated MEMS in a 350 nm technology for filter monitoring applicationsNeubert, Marco / Heinz, Steffen / H, John Thomas / Erler, Klaus et al. | 2019
- 101
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Design of Integrated Sensor System for Detection of Traces of Different Molecules in the AirStrle, Drago / Muševič, Igor et al. | 2019
- 111
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"Optics in foil" integrated LED packages for the optimization of beam shaping and color homogeneitySchrank, Franz / Pachler, Peter / Hoschopf, Hans / Kuna, Ladislav / Nemitz, Wolfgang / Sommer, Christian / Hartmann, Paul / Wenzl, Franz P. / Nicolics, Johann / Fulmek, Paul et al. | 2019
- 117
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Manufacturing of 3D Mechatronic Systems with Plasma TechnologySchramm, René / Franke, Jörg et al. | 2019
- 125
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Sophisticated 3D systems realized by the combination of 3D-MID (3D Molded Interconnect Devices) and PCB (Printed Circuit Boards)Goth, Christian / Wittwer, Frank / McMillan, Ellen et al. | 2019
- 131
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Interflex: challenges and solutions to fabricate a double-sided wiring layer for a "system in foil"Yacoub-George, Erwin / Drost, Andreas / Hemmetzberger, Dieter / Bollmann, Dieter / Faul, Robert / Bock, Karlheinz et al. | 2019
- 139
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Low cost integration of multilevel lab-on-a-chip using a new generation of dry film photoresistsCourson, Rémi / Cargou, Sébastien / Conédéra, Véronique / Fouet, Marc / Gué, Anne-Marie et al. | 2019
- 149
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Viable Engineered Substrate enabled simple and robust built-in thin film encapsulation on SOI MEMS resonatorsGuo, Bin / Dekker, James R. / Gao, Feng / Salonen, Jaakko et al. | 2019
- 157
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MEMS Foundry Business and MEMS Law "Each Device has its own Process"Schwarz, Uwe / Schmidt, Konstanze et al. | 2019
- 165
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Fabrication Process for Hermetic Biocompatible Miniature Implant EnclosuresSchneeberger, Niklaus / Fehr, Jean-Noël / Roulet, Jean-Christophe / Schnell, Urban / Haneveld, Jeroen / Tijssen, Peter / Oonk, Johannes / Riekerink, Mark Olde / Tigelaar, Hildebrand / Oever, Ronny van 't et al. | 2019
- 171
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3D Module mixing bare dies and packaged componentsMorel, Paul-Henry / Collange, T. / Gavaud, S. / Fritsch, A. / Couderc, P. / Fiant, N. / Noiray, J. et al. | 2019
- 181
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Tactile Sensor Network System with CMOS-MEMS Integration for Social Robot ApplicationsMuroyama, Masanori / Tanaka, Shuji / Kojima, Takahiro / Esashi, Masayoshi / Makihata, Mitsutoshi / Nakayama, Takahiro / Yamaguchi, Ui / Yamada, Hitoshi / Nonomura, Yutaka / Funabashi, Hirofumi et al. | 2019
- 189
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Thermal aspects of color conversion element integration in phosphor converted solid state lighting sourcesHartmann, Paul et al. | 2019
- 191
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LTCC packages optimized for use with SAW and FBAR sensors in environmental parameters monitoringBuiculescu, Valentin / Giangu, loana / Müller, Alexandru / Bechtold, Franz et al. | 2019
- 199
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Fully integration of an innovative pressure sensor platformHerrán, J. / Fernández, l. / Ochoteco, E. / Cabañero, G. / Grande, H. / Flores, A. / Copaci, D. / Blanco, D. / Moreno, L. et al. | 2019
- 209
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Smart Systems Integration: Value chains and marketsKóhler, Thomas et al. | 2019
- 217
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Strategies for Responding to the Reliability Challenges of Future Smart SystemsRzepka, Sven / Andersson, Dag / Vandevelde, Bart et al. | 2019
- 225
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Xtrinsic Intelligent Sensing Framework - A New Era in Sensor Data ProcessingNadworny, Margaret / McGlasson, James et al. | 2019
- 231
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JISSO - Standardization Bridging the GapsHuck, Walter et al. | 2019
- 239
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Advanced Die Attach Simulations and Reduced Order Modeling of Stressed MEMS GyroscopesDorwarth, Markus / Kehrberg, Steven / Schmidt, Benjamin / Bode, Niels / Döring, Christian / Schellenberg, Max / Mehner, Jan et al. | 2019
- 247
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Approaches for System Reliability in Consideration of Application Oriented Loads as well as Physics-Of-FailureStraube, Stefan / Middendorf, Andreas / Lang, Klaus-Dieter / Hahn, Daniel / Jerchel, Kathleen et al. | 2019
- 255
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Increasing the lifetime of wire bond interconnections for power applications by the use of aluminium cladded copper wireFella, Frank / Bock, Johannes / Beart, Karin / Schmidt, Thomas / Schuch, Bernhard et al. | 2019
- 263
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Material parameter identification by combination of stress chip measurements and FE-simulation in MERGERost, Florian / Schindler-Saefkow, Florian / Vogel, Dietmar / Rzepka, Sven / Michel, B. / Tsapkolenko, Alexander / Nossol, Patryk / Schaufuß, Jörg / Adli, Ali Rezaie / Jansen, Kasper et al. | 2019
- 271
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Pitfalls by applying pulsed EMC & ESD System Level Stress Requirements to On-Chip Protection Design by Automotive ExamplesMayerhofer, Michael / Magrini, Filippo / Cao, Yiqun et al. | 2019
- 281
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The SMAC1 approach towards Smart System IntegrationGangemi, Giuliana / Rinaudo, S. / Drogoudis, D. / Gillon, R. / Sanginario, A. / Schropfer, G. / Poncino, M. et al. | 2019
- 291
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Simulation/Co-Simulation Alternatives for Multi-Domain, Multi-Level, Multi-Language Design of Smart Sensor: The SMAC MethodologyLora, Michele / Vinco, Sara / Drogoudis, Dimitrios / Trachanis, Dimitrios / Fummi, Franco et al. | 2019
- 299
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Automatic Behavioural Model Generation Opens New Perspectives in the Design of Smart SystemsGillon, Renaud / Jonghe, Dimitri De / Gielen, Georges et al. | 2019
- 307
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System-aware Design Methodology for MEMS based on High-order Parametric Finite-Element Library Combined with Model-Order-ReductionSanginaro, Alessandro / Demarchi, Danilo / Schropfer, Gerold / Sarl, Coventor / Zerbini, Sarah / Ekwinska, Magdalena / Houlihan, Ruth et al. | 2019
- 311
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MOEMS Virtual Prototype PlatformGuarnera, Mirko et al. | 2019
- 313
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LAB FAB for smart sensors and actuators MEMSZafalon, Roberto et al. | 2019
- 317
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Smart electronic implants for medical biosensoricsStett, Alfred / Link, Gorden / Schneider, Katharina / Rossbach, Daniel / Nawito, Moustafa / Jeschke, Christoph / Haas, Nora / Lebold, Timo et al. | 2019
- 323
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Rapid detection of bacteria by low-cost microfluidic systemPuchberger-Enengl, Dietmar / Keplinger, Franz / Krutzler, Christian / Vellekoop, Michael J. et al. | 2019
- 329
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Polymer-based dry electrodes for high user comfort ECG/EEG measurementsChen, Yun-Hsuan / Beeck, Maaike Op de / Hoof, Chris Van / Carrette, Evelien / Boon, Paul / Vanderheyden, Luc / Grundlehner, Bernard / Mihajlovic, Vojkan et al. | 2019
- 337
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Feedback-based digital RF Power SystemHelvoort, Mark van / Bakel, Marcel van et al. | 2019
- 343
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RF Communication for Active Implant Medical DeviceMolin, Renzo Dal et al. | 2019
- 351
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Roll-to-Roll Hot Embossing of Micron and Nanoscale Structures for the Fabrication of Plastic DevicesKreindl, Gerald / Chouiki, M. / Thorsten, M. / Dumond, J. / Soo, ONG Kian et al. | 2019
- 357
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Design and manufacturing of Roll-to-Roll printed copper layers for communication applicationsZichner, Ralf / Baumann, Reinhard R. et al. | 2019
- 365
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Barrier properties of plastic films coated with AI203 by roll-to-roll ALDKostamo, Juhana / Laine, Risto / Kilpi, Väinö / Li, Wei-Min / Lindfors, Sven / Toivola, Minna / Hirvikorpi, Terhi / Vähä-Nissic, Mika / Vartiainenc, Jari / Nikkolac, Juha et al. | 2019
- 373
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Recent Progress in Printed 2D/3D Electronic DevicesList-Kratochvil, Emil / Sax, Stefan / Blümel, Alexander / Popovic, Karl / Klug, Andreas et al. | 2019
- 383
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Adhesive-based self-alignment mechanisms for modular stacked microsystemsBraun, Tanja / Jagodzinska, Jagoda / Becker, Karl-Friedrich / Bauer, Jörg / Georgi, Leopold / Ostmann, Andreas / Aschenbrenner, Rolf / Lang, Klaus-Dieter et al. | 2019
- 391
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Automatic Footprint Compaction and Bond Wire Placement for Bare Die Chips StacksDittrich, Michael / Heinig, Andy / Schneider, Peter et al. | 2019
- 399
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Laser based vacuum hermetic sealingJames, Rony Jose / Innerhofer, E. / Stadelmann, T. / Berchtold, S. / Bosshard, M. Lützelschwab. Ch. / Epitaux, M. / Hold, A. / Vélez, C. et al. | 2019
- 407
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A Discrete Alternative for ASIC-centered Smart System IntegrationSalo, Tomi et al. | 2019
- 415
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Smart, self-tuned power factor correction PFC- and DC/DC converter system offering optimum power efficiencyStrzalkowski, Bernhard et al. | 2019
- 423
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Smart Sensor Solutions for Advanced Automotive SystemsGrace, Roger H. et al. | 2019
- 425
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A smart 3D ToF sensor system for object trackingOberhammer, Roland / Novak, Gregor / Pitter, Christof / Hranitzky, Robert et al. | 2019
- 431
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Decentralized inter-organizational business process automationRöder, Andre / Weger, Heiko / Benesch, Manfred / Kabitzsch, Klaus / Röder, Klaus et al. | 2019
- 441
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Multi-Sensor for Cutting Fluid ManagementArki, Pál / Tauchnitz, Tina / Dittrich, Rosemarie / Güth, Frederic / Joseph, Yvonne et al. | 2019
- 443
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Functional Nano Patterns realized by aligned Nano Imprint LithographyBaum, Mario / Besser, J. / Wiemer, M. / Gessner, T. / Thanner, C. / Kreindl, G. / Wimplinger, M. et al. | 2019
- 447
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Novel Methodology of MEMS-IC Co-simulation in Smart Systems Development ProcessBieniek, Thomasz / Janczyk, G. / Marchewka, M. / Ekwińska, M. / Wąsowski, J. / Grabiec, P. et al. | 2019
- 451
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Integrateable light sources based on semiconductor nanocrystalsBöttger, Philipp / Meyer, Marcel / Geßner, Thomas / Seidlitz, Holger / Kroll, Lothar / Martin, Jörg / Otto, Thomas et al. | 2019
- 455
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Low stress polyimide multilayers integration for flexible substrateCharlot, Samuel / Valentina, Castagnola / Emeline, Descamp et al. | 2019
- 459
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Reduction of Gas Species Dependency of Thermal Conductivity Vacuum Gauges by In-System Software CalibrationDams, Florian / Schreiner, Rupert et al. | 2019
- 463
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Methodology of MEMS-based Smart Systems Design, Modeling and Simulation - Development PracticeEkwinska, Magdalena / Janczyk, Grzegorz / Bieniek, Tomasz / Grabiec, Piotr et al. | 2019
- 467
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Laser Micromachining of brittle and fragile functional MaterialsEnderlein, Tom / Nestler, Jörg / Otto, Thomas / Gessner, Thomas et al. | 2019
- 471
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Low-cost technology for photolithography on convex surfacesFranitza, Florian / Kosubek, Michael / Kremers, Tom / Rockenbach, Alexander / Mokwa, Wilfried et al. | 2019
- 475
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Influence of High Temperature Annealings on a-SiC:H Thin Film PropertiesFrischmuth, Tobias / Dergez, David / Stuebegger, Marko / Schmid, Ulrich / Hedenig, Ursula / Grille, Thomas et al. | 2019
- 479
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Smart Systems Integration approaches for infrastructure monitoring: Technologies and Applications for Smart Transport and Smart BuildingsGrace, Roger H. et al. | 2019
- 481
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Critical Success Factors for the Commercialization of MEMS: The 2013 MEMS Industry Commercialization Report CardGrace, Roger H. et al. | 2019
- 485
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Optical Multi Viewing Sensor for Welding Tip AnalysisGrüger, Heinrich / Leuchefeld, Michael / Knobbe, Jens / Tedeschi, Eugenio et al. | 2019
- 489
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MEMS based fluorescence microscope with 3d option for dermatological applicationsGrüger, Heinrich / Knobbe, Jens / Bechtel, Christin / Lakner, Hubert et al. | 2019
- 493
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Video microscopy and improved particle tracking for nanoparticle size determination in microfluidicsHaiden, Christoph / Keplinger, Franz / Wopelka, Thomas / Jech, Martin / Vellekoop, Michael et al. | 2019
- 497
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Development of a 'smart' needle integrated with an impedance sensor to determine nerve proximity for nerve blocking (anaesthetic) proceduresHelen, Lisa / Messina, Walter / Moore, Eric / O'Donnell, Brian et al. | 2019
- 501
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Smart City DresdenKaiser, Michael / Gäbler, Uwe et al. | 2019
- 505
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The Relation between Vibration and Stiction of MEMS CantileversKato, Ichiro / Tsuchiya, Y. et al. | 2019
- 509
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High Voltage Amplifier ASIC for High Capacitive Load MEMS based Piezoelectric ActuatorsKöhler, Daniel / Seidel, Ralf / Helke, Christian / Hiller, Karla / Schüller, Martin / Lipowski, Mathias et al. | 2019
- 513
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Finite Element Modeling of Plasmonic StructuresKolchuzhin, Vladimir / Mehner, Jan E. / Sheremet, Evgeniya / Rodriguez, Raul D. / Zahn, Dietrich R. T. / Luque, Lilibeth Leal et al. | 2019
- 517
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Integration of a MOEMS-Based Variable-Focus Laser Scanner for Application in Light-Driven MicrofluidicsKremer, Matthias / Tortschanoff, Andreas et al. | 2019
- 521
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A Wireless Multi-Channel EEG Headset SystemLin, Jin / Lin, Rick / Chang, Mavis / Lemmens, Peter / Wu, Shun-Chi et al. | 2019
- 525
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Pulsed Jet Actuator development for the integration in composite structuresLipowski, Mathias / Schueller, M. / Otto, T. / Gessner, T. / Stiehl, C. / Nestler, J. / Kroll, L. et al. | 2019
- 529
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Low cost silicon interposer made by wet etching with four dense wiring through TSV for application in 3D integrationLuo, Le / Ye, Jiaotuo et al. | 2019
- 533
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A combined fibre coupling / readout diode chip for use in integrated optical interferometryMarkweg, Eric / Hoffmann, Martin / Schädel, Martin / Ortlepp, Hans-Georg / Brodersen, Olaf et al. | 2019
- 537
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Fabrication of gold nanopillars on gold interdigitated impedance electrodes for biomedical applicationsMessina, Walter et al. | 2019
- 539
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Optimizing quantum dot based sensor device structure by determining the band level alignment for better charge injection: a combined UPS/IPS studyMöbius, Martin / Tofighi, Ghazal / Haidu, Francisc / Gordan, Ovidiu D. / Otto, Thomas / Zahn, Dietrich R. T. / Martin, Jörg / Spudat, Christian / Gessner, Thomas et al. | 2019
- 543
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Structural health monitoring with quantum dotsMöbius, M. / Poppitz, E. A. / Ueberfuhr, P. / Tofighi, G. / Gordan, O. D. / Dzhagan, V. M. / Lang, H. / Baumann, R. R. / Zahn, D. R. T. / Kroll, L. et al. | 2019
- 547
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eGo - What you touch is YoursO'Flynn, Brendan / Belcastro, Marco / Mathewson, Alan / O'Mathuna, Cian / Rhelimi, Alain et al. | 2019
- 551
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Stamped Circuit Board Technology (SCB): Packaging Substrates for various markets and applicationsRajenthiran, Mentor / Klein, Andreas et al. | 2019
- 555
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Wireless Data and Energy transmission as part of the HSG-4S Smart Sensor ModelRathfelder, Christoph / Rossbach, Daniel et al. | 2019
- 559
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A practical framework for assuring authenticity and integrity of hardware componentsRust, Carsten / Bock, Holger / Brunner, Verena / Deutschmann, Martin / Fournier, Jacques J. A. / Hermans, Jens / Singelee, Dave et al. | 2019
- 563
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Micro-structured Impedance Electrodes for the Detection of Breast Cancer and Ductal Carcinoma in situSavage, Niall et al. | 2019
- 565
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Recent results and developments in Temporary Wafer Bonding -Debonding on 300mm leading edge toolsSchima, Mario / Wagenitz, Kevin / Wendling, Robert / Grafe, Jürgen / Wiesbauer, Harald / Uhrmann, Thomas et al. | 2019
- 569
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Smart System Integration Technologies for Lightweight StructuresSchüller, Martin / Otto, T. / Geßner, T. / Walther, M. / Tröltzsch, J. / Mehner, J. / Kroll, L. et al. | 2019
- 573
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Ultra-precision Manufacturing of Porcelain-based MEMSStompe, Manuel / Rissing, Lutz et al. | 2019
- 579
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Wearable respiratory belt for human breathing controlStoukatch, Serguei / Bellier, Pierre / Axisa, Fabrice / Destiné, Jacques / Léonard, Jean et al. | 2019
- 583
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Compact driver module for closed-loop control of resonant 2D-MOEMS scannersTortschanoff, Andreas / Kenda, Andreas / Kremer, Matthias / Frank, Albert / Sandner, Thilo et al. | 2019
- 587
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Realization of CMUT based ultrasonic sensor systemsUnamuno, Anartz / Klemm, Markus / Grüger, Heinrich et al. | 2019
- 591
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Design and Analyses of a laterally driven MEMS electro-thermally MicrogripperVoicu, Rodica / Müller, Raluca / Craciunoiu, Florea / Baracu, Angela et al. | 2019
- 595
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Thin film fabrication of highly sensitive earth magnetic field sensorWienecke, Anja / Rissing, Lutz et al. | 2019
- 599
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Fraunhofer Cluster 3D Integration - Key to a holistic Technology and Service ApproachWolf, M. Jürgen / Schulz, Stefan / Schneider, Peter / Zschech, Ehrenfried et al. | 2019