Using Standards to Increase Productivity While Fighting Counterfeits (English)
- New search for: Shearon, Cameron
- New search for: Shearon, Cameron
In:
SMTA International Conference 2019 ; Volume 1 of 2
; 417
;
2020
- Conference paper / Print
-
Title:Using Standards to Increase Productivity While Fighting Counterfeits
-
Contributors:Shearon, Cameron ( author )
-
Conference:SMTA International Conference ; 2019 ; Rosemont, Ill.
-
Published in:
-
Publisher:
- New search for: Curran Associates, Inc.
-
Place of publication:Red Hook, NY
-
Publication date:2020
-
Type of media:Conference paper
-
Type of material:Print
-
Language:English
-
Source:
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
-
High Performance RF Diplexer Module Using a Glass InterposerWoychik, Charles / Lauffer, John / Gaige, Michael / Wilson, William / Carey, James / Neely, Matthew / Pollard, Scott / Parmar, Raj et al. | 2020
- 6
-
High Frequency Characteristics of Glass InterposerKuramochi, Satoru / Tanaka, Masaya / Akazawa, Miyuki / Yamada, Syohei / Nippon, Dai et al. | 2020
- 12
-
Evaluation of Warpage Behavior of SMD-Packages and Boards During SolderingMeier, Karsten / Wohlrabe, Heinz / Albrecht, Oliver / Trodler, Jörg et al. | 2020
- 19
-
Reliability of Electrical Devices due to Warpage Behavior of SMD-Packages and Boards during SolderingTrodler, Jörg / Meier, Karsten / Wohlrabe, Heinz / Albrecht, Oliver et al. | 2020
- 25
-
High Temperature Component Warpage as a Function of Moisture Sensitivity (MSL) RatingHubble, Neil et al. | 2020
- 33
-
X-ray Micro-Computed Tomography Based FE Models to Capture Realistic Manufacturing Variability in Cu-Al Wirebonds and Solder-Joints in QFNsLall, Pradeep / Kasturi, Madhu / Kothari, Naku / Locker, David et al. | 2020
- 46
-
Real Time X-Ray Analysis of Void Formation and Dynamics in QFN Devices During ReflowKrastev, Evstatin / Kullar, Sandeep / Rand, Christopher / Dage, Nordson et al. | 2020
- 52
-
New X-Ray Technologies for Enhanced Void InvestigationVaga, Ragnar et al. | 2020
- 61
-
Solder Joint Reliability of BGA Packages on High Frequency Laminate PCBs Under Power CyclingLakshminarayana, Akshay / Pallapothu, Mahesh / Chaudhari, Mugdha / Rahangdale, Unique / Misrak, Abel / Agonafer, Dereje et al. | 2020
- 66
-
High Density RDL Technologies for Panel Level Packaging of Embedded DiesBöttcher, Lars / Kosmider, S. / Kahle, R. / Ostmann, A. / Schein, F. et al. | 2020
- 73
-
Multi-axis Loading Effect on Edgebond and Edgefilled WLCSP Thermal Cycling PerformanceLee, Tae-Kyu / Hsiao, Andy / Ibe, Edward / Loh, Karl et al. | 2020
- 80
-
Effect of Cure Conditions on the Interface Properties and Reliability of Potted Electronics in 25,000g Mechanical ShockLall, Pradeep / Dornala, Kalyan / Lowe, Ryan / Deep, John et al. | 2020
- 91
-
Solder Joint Integrity Evaluation of Bottom Terminated Component (BTC) Subjected to Thermal CyclingPearson, Tim et al. | 2020
- 103
-
An Investigation on the Influence of Copper and Nickel Solderable Surfaces on Solder Joint Degradation due to Gold EmbrittlementGates, Daphne et al. | 2020
- 111
-
High-reliability Lead-free Solder for Low-cost Die Attach ApplicationsPandher, Ranjit / Nagarajan, Niveditha / Kumar, Sathish / Dutt, Gyan / Bilgrien, Carl et al. | 2020
- 118
-
Mechanical Failure of Thermal Interface Materials Due to Thermal Aging and Impact on Performance of Electronic PackageChauhan, Tushar / Chowdhury, Raufur / Misrak, Abel / Bhandari, Rabin / Rajmane, Pavan / Sivaraju, Krishna Bhavana / Abdulhasansari, Milad / Agonafer, Dereje et al. | 2020
- 124
-
Modification and Application of Organic Phase Change Materials for Thermal Peak ManagementNowottnick, Mathias / Maxa, Jacob / Novikov, Andrej et al. | 2020
- 130
-
Investigating BTC Design Parameters for Robust Electrochemical Reliability on a Printed Circuit BoardMcMeen, Mark / Bixenman, Mike et al. | 2020
- 136
-
Reliability Assessment of BGA Solder Joints - Megtron 6 VS FR4 Printed Circuit BoardsChowdhury, Raufur et al. | 2020
- 142
-
Automotive Pb-Free BGA Packages Solder-Joint ReliabilityCarpenter, Burton / Mawer, Andrew / Benson, Mollie / Arthur, John / Yeung, Betty et al. | 2020
- 149
-
Properties of Mixing SAC Solder Alloys with Bismuth-Containing Solder Alloys for a Low Reflow Temperature ProcessSwanson, Tayler et al. | 2020
- 159
-
Evaluations on the Mixing of the Tin-Bismuth Paste with SnAgCu BGA Components in Terms of PeakTemperature, Time Over Melting and Paste VolumeBath, Jasbir / Joshi, Shantanu / Segura, Roberto et al. | 2020
- 169
-
Root Cause and Solution to Mitigate the Hot Tear Defect Mode in Hybrid SAC-Low Temp Solder JointsHarris, Todd / Byrd, Kevin / Badwe, Nilesh et al. | 2020
- 175
-
Optimising Solder Alloy Composition for Low Temperature AssemblySweatman, Keith / Nishimura, Tetsuro / Akaiwa, Tetsuya / Naraynanan, Pavithiran et al. | 2020
- 183
-
Gold (Au) Embrittlement of Plastic Quad Flat(pack) No-Lead (PQFN) Solder Joints and Mitigation StrategiesVianco, Paul / Garcia, T. / Jaramillo, C. E. / McKenzie, B. M. / Reese, J. et al. | 2020
- 202
-
New High Reliability Lead Free Solder Alloy for Electronic Application in Extreme EnvironmentXiang, Shawn / Hasnine, Md / Wei, Xiang et al. | 2020
- 211
-
Fluxes Designed for Suppressing Non-Wet-Open at BGA AssemblyLee, Ning-Cheng / Zhou, Fengying / Chen, Fen et al. | 2020
- 218
-
Effect of No Clean Residue on Signal Integrity at High FrequencyNguyen, Jennifer et al. | 2020
- 224
-
Novel Fluxes with Decreased Viscosity After Reflow for Flip Chip and SIP AssemblyLee, Ning-Cheng / Mao, Runsheng / Chen, Fen et al. | 2020
- 228
-
NImproved IC Package Reliability via Epoxy Flux ReinforcementYamatsu, Shigeru / Yamaguchi, Atsushi / Behr, Andy / Matsuno, Koso / Suzuki, Yasuhiro et al. | 2020
- 235
-
Novel Application Methods of Solder Joint Encapsulant Materials for SnAgCu FCBGA Solder JointsHuettis, Alex / Palanisamy, Barath / Aspandiar, Raiyo et al. | 2020
- 247
-
PCBA Cleanliness as a Means to Improve Humidity Robustness of ElectronicsAmbat, *Rajan / Piotrowska, Kamila et al. | 2020
- 251
-
Origin of lonic Contamination in Automotive Electronics Case StudyDore, Maurice et al. | 2020
- 256
-
Elimination of “Nickel Corrosion” in ENIG and ENEPIG by using “Reduction Assisted Immersion Gold” in place of “Standard Immersion Gold”Milad, George / Bengston, Jon / Gruenwald, Albin et al. | 2020
- 263
-
Ultrathin and High Temperature Conformal Coatings for Corrosive Resistance of ElectronicsKumar, Rakesh et al. | 2020
- 270
-
Solder-joint Reliability of a 0.65mm Pitch Molded Array Package for Automotive ApplicationsCarpenter, Burton / Benson, Mollie / Sakib, A. R. Nazmus / Mawer, Andrew / Galles, Paul / Fahim, Abdullah et al. | 2020
- 280
-
Challenges of Automotive Electronics MiniaturizationDore, Maurice et al. | 2020
- 284
-
Automotive Harsh Environments and Implications for ADAS and AD SensorsHoward, Dwight et al. | 2020
- 293
-
Analysis of the Root Cause for Solder Joint CrackingHu, Chaohui / Li, Weiming / Shen, Jianghua et al. | 2020
- 299
-
Qualification of High Density Connector Solutions for Military and Avionic EnvironmentsCho, Kimera / Pearson, Tim / Hillman, David / Wilcoxon, Ross / Aerospace, Collins et al. | 2020
- 306
-
Effect of Creep and Fatigue on Individual SAC305 Solder Joint Reliability in Iso-thermal CyclingAbueed, Mohammed / Alathamneh, Raed / Hamasha, Sa'd / Suhling, Jeff / Lall, Pradeep et al. | 2020
- 315
-
Thermal Cycling Reliability of Newly Developed Lead-Free Solders for Harsh EnvironmentsHamasha, Sa'd / Akkara, Francy John / Zhao, Cong / Ahmed, Sudan / Abueed, Mohammed / Su, Sinan / Suhling, Jeffrey / Lall, Pradeep et al. | 2020
- 323
-
Evaluation of Tin Whisker Formation on SOT and Discrete Components Assembled with Bismuth-Containing Lead-Free Solder Alloys after High Temperature, High Humidity StorageDelhaise, Andre et al. | 2020
- 344
-
Influence of a New Abnormal (CuNi)6Sn5 / (NiCu)3Sn4 Layer Growth at Temperatures Above 175°C in Tin Silver Based Lead-Free Solder JointsTimoHerberholz, Timo / Prihodovsky, Andrey / Nowottnick, Mathias et al. | 2020
- 354
-
Development of Low Temperature Sn-Bi Based Pb-Free Solder AlloysMaalekian, Mehran / Das, Aranav / Krassenburg, Ludo / Veen, Co van / Kodentsov, Alexander / Biglari, Mo et al. | 2020
- 359
-
How X-Ray Technology is Improving the Electronics Assembly ProcessValenzuela, Carlos et al. | 2020
- 365
-
Smart Inspection Methods in the Electronics IndustryVaga, Ragnar et al. | 2020
- 373
-
Test Methodology for Printed FSR'sCollins, Edward et al. | 2020
- 389
-
Micro-Computed Tomography Analysis for Failure Analysis in ElectronicsBrennan, Claire et al. | 2020
- 396
-
Improve AO! Performance through Smart Visual Insight Solutions CollaborationZhang, Wayne / Zhao, Ziv / Wu, Ben / Tang, Peng / Wang, Yan / Cole, Marie / Shen, Li Qin / Vogel, Andrew et al. | 2020
- 402
-
An Interesting Approach to Yield ImprovementBryant, Keith et al. | 2020
- 410
-
Can A Help Us in the Fight Against Counterfeit Components?Thomas, Glen et al. | 2020
- 417
-
Using Standards to Increase Productivity While Fighting CounterfeitsShearon, Cameron et al. | 2020
- 424
-
Impact of 10-year Room Temperature Aging on the Temperature Cycle Reliability of SAC105 424Chen, Deng Yun / Manoharan, Subramani / McClusky, Patrick / Osterman, Michael et al. | 2020
- 431
-
Microstructure and Mechanical Properties of SAC-Bi Solder Alloys with AgingHamasha, Sa'd / Belhadi, Mohamed EI Amine / Athamneh, Raed Al / Wentlent, Luke et al. | 2020
- 439
-
Thermal Cycling Reliability and Failure Mode of Two Ball Grid Array Packages with High Reliability Pb-Free Solder AlloysCoyle, Richard et al. | 2020
- 457
-
Attachment Quality and Thermal Fatigue Reliability of a Surface Mount Chip Resistor Assembled with a Low Temperature SolderJohnson, Charmaine / Coyle, Richard / Popowich, Richard / Xu, Chen / Anselm, Martin / Parihar, Ajitesh Singh / Swanson, Tayler / Clark, Lenora / Fullerton, Jason et al. | 2020
- 465
-
Bottom Terminated Component (BTC) Void Concerns: Real and Imagine AerospaceHillman, David / Wilcoxon, Ross / Pearson, Tim / Cho, Kim / Aerospace, Collins et al. | 2020
- 478
-
Status of Pb-free Risk Mitigation for Aerospace and Defense — “An Attitude Adjustment” PerspectiveRafanelli, Anthony et al. | 2020
- 484
-
Precipitation of Bi and SbSn Phases in Next-Generation Pb-Free SoldersGourlay, Chris / Belyakov, S. A. / Sweatman, K. / Akaiwa, T. / Nishimura, T. et al. | 2020
-
The Impact of Smart Factory Solutions on PCB ManufacturingFieldhouse, Nicholas et al. | 2020
-
Identifying Voids on BTC Assemblies with X-ray AnalysisCardoso, Bill et al. | 2020
-
Synthesis and Properties of Several Functional Dimeric Epoxy Resins Containing Naphthalene Units N/AEdwards, Mark / Morinaga, Kunihiro / Hayashi, Koji / Takahashi, Yoshiyuki et al. | 2020
-
Challenges in Detection of Assembly Level CounterfeitsDas, Diganta et al. | 2020