Conference record - 2003 IEEE International Symposium on Electronics & the Environment : May 19 - 22, 2003, 2003, Boston, MA, USA ; [held in conjunction with the 4th Electronics Recycling Summit] (English)
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2003
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ISBN:
- Conference Proceedings / Print
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Title:Conference record - 2003 IEEE International Symposium on Electronics & the Environment : May 19 - 22, 2003, 2003, Boston, MA, USA ; [held in conjunction with the 4th Electronics Recycling Summit]
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Contributors:
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Conference:IEEE International Symposium on Electronics & the Environment ; 11 ; 2003 ; Boston, Mass.
ISEE ; 11 ; 2003 ; Boston, Mass.
Electronics Recycling Summit ; 4 ; 2003 ; Boston, Mass. -
Publisher:
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Place of publication:Piscataway, NJ
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Publication date:2003
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Size:382 S
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Remarks:IEEE catalog number 03CH37425
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ISBN:
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Type of media:Conference Proceedings
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Type of material:Print
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Language:English
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Contract number:03CH37425
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Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Brominated flame retardants: issues surrounding their use in electrical and electronic equipmentDawson, R.B. / Landry, S.D. et al. | 2003
- 7
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Is the WEEE EcoEfficient?Stevels, A. / IEEE Computer Society / International Association of Electronics Recyclers et al. | 2003
- 7
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Is the WEEE Directive EcoEfficient?Stevels, A. et al. | 2003
- 13
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X-free mobile electronics-strategy for sustainable developmentMueller, J. / Griese, H. / Hageluken, M. / Middendorf, A. / Reichl, H. et al. | 2003
- 19
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Alternatives to reduce perfluorinated compound (PFC) emissions from semiconductor dielectric etch processes: meeting environmental commitments while minimizing costsKrishnan, N. / Smati, R. / Raoux, S. / Dornfeld, D. et al. | 2003
- 25
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Strategies to integrate life cycle engineering into technological developments-the 3G Greenbook InitiativeGriese, H. / Muller, J. / Stobbe, L. / Reichl, H. / Rick, K. et al. | 2003
- 30
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Construction of dynamic green supply chain based on agentWang shuwang, / Zheng ren, / Liu zhifeng, / Liu guangfu, et al. | 2003
- 36
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Lean disassembly line layout, and network simulation modelsRanky, P.G. / Morales, L.C. / Caudill, R.J. et al. | 2003
- 42
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Practical aspects of the materials declaration processMasanet, E.R. / Newton, M.D. / Auer, R. et al. | 2003
- 48
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Multi-criteria decision aid for product end of life options selectionKiritsis, D. / Bufardi, A. / Xirouchakis, P. et al. | 2003
- 54
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Disassembly AND/OR graph model for "disassembly for recycling"Jiangang Gao, / Dong Xiang, / Haifeng Chen, / Guanghong Duan, / Jinsong Wang, et al. | 2003
- 60
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DISX: a procedure for the automated generation of disassembly process plansDas, S. / Yedlarajiah, D. / Gurram, S. et al. | 2003
- 66
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Cradle to gate toxic impacts of solders: a comparison of impact assessment methodsSocolof, M.L. / Geibig, J.R. / Swanson, M.B. et al. | 2003
- 72
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A multi-phase mathematical programming approach to strategic planning of an efficient reverse supply chain networkPochampally, K.K. / Gupta, S.M. et al. | 2003
- 79
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Supply chain management and reverse logistics-integration of reverse logistics processes into supply chain management approachesBaumgarten, H. / Butz, C. / Fritsch, A. / Sommer-Dittrich, T. et al. | 2003
- 84
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Reconfigurable logistics systems for efficient processes-a new planning tool setSommer-Dittrich, T. / Butz, C. / Baumgarten, H. et al. | 2003
- 88
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Green product development in quality function deployment by using fuzzy logic analysisTsai-Chi Kuo, et al. | 2003
- 94
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Special requirements for demanufacturing of military electronicsChurchill, P.G. et al. | 2003
- 99
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Economic and environmental characteristics of global cellular telephone remanufacturingSkerlos, S.J. / Morrow, W.R. / Kuei-yuan Chan, / Fu Zhao, / Hula, A. / Seliger, G. / Basdere, B. / Prasitnarit, A. et al. | 2003
- 105
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Plastics Separation Planning Enhancements from New Laser Identification Technology and Work Measurement AnalysisBlyler, L. / Tieman, L. / Stuart, J. A. / Duplaga, L. / Meyer, N. / Grant, E. / IEEE Computer Society / International Association of Electronics Recyclers et al. | 2003
- 105
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Plastic separation planning enhancements from new laser identification technology and work measurement analysisBlyler, L. / Tieman, L. / Stuart, J.A. / Duplaga, L. / Meyer, N. / Grant, E. et al. | 2003
- 111
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Implementing DFE through a product-based environmental management systemDonnelly, K. / Boehm, T. et al. | 2003
- 114
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Design for environment: an environmental analysis model for the modular design of productsXueqing Qian, / Zhang, H.C. et al. | 2003
- 120
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Life cycle assessment tool for electromechanical products green designXiang Dong, / Liu Xueping, / Wu Ying, / Wang Jinsong, / Duan Guanghong, et al. | 2003
- 125
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Material composition profiles of select IT components, a design for environment project with the High Density Packaging User Group (HDPUG)Brady, T.A. / O'Connell, S. / Tanskanen, P. / Bergman, R. / Senfield, P. / Hoekstra, J. / Mann, T. / Burkitt, J. et al. | 2003
- 131
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Electricity use of wired and wireless telecommunications networks in the United StatesMatthews, H.S. / Woon Sien Loh, / Hui Min Chong, et al. | 2003
- 137
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Environmental effects of information telecommunication networks in JapanTakahashi, K.I. / Nakamura, J. / Maeda, T. / Origuchi, T. / Kunioka, T. / Harada, H. / Miyamoto, S. / Fujimoto, J. et al. | 2003
- 141
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Life cycle assessment of the mobile communication system UMTS: towards eco-efficient systemsStutz, M. / Emmenegger, M.F. / Frischknecht, R. / Guggisberg, M. / Witschi, R. / Otto, T. et al. | 2003
- 147
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Assessing the potential of telecommuting as an energy savings technology in JapanWilliams, E.D. et al. | 2003
- 153
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Sustainable product and material end-of-life management: an approach for evaluating alternativesDickinson, D.A. / Caudill, R.J. et al. | 2003
- 159
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Neural network model for product end-of-life strategiesChen, J.L. / Jun-Nan Wu, et al. | 2003
- 165
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Checklist for optimized design for re-use of printed wire boards and componentsBrandstotter, M. / Knoth, R. / Kopacek, B. / Kopacek, P. et al. | 2003
- 169
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A tool to support environmentally preferable purchasing of electronic productsRifer, W. / Stitzhal, D. / Chalfan, L. et al. | 2003
- 173
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Life cycle environmental impact of the Internet infrastructure in a universityLoerincik, Y. / Sangwon Suh, / Jolliet, O. et al. | 2003
- 177
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"The most of the most"-study on a new LCA methodLiu Lei, / Liu Zhifeng, / Fung, R. et al. | 2003
- 183
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Life cycle environmental impact of the telemonitoring system of the city of Martigny SwitzerlandLoerincik, Y. / Jolliet, O. / Matas, C. / Revaz, J.M. et al. | 2003
- 187
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Energy analysis of end-of-life options for personal computers: resell, upgrade, recycleWilliams, E.D. / Sasaki, Y. et al. | 2003
- 193
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Validating an environmental performance improvement model for large and small companiesHussey, D.M. / Eagan, P.D. et al. | 2003
- 199
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Integration of environmental assessment tools in product developmentMiddendorf, A. / Petermann, C. / Reichl, H. / Griese, H. / Schrodl, J. / Reiner, A. et al. | 2003
- 205
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A technique used for estimating the processing cost of IT equipment received by an asset recovery centerGrenchus, E.J. / Keene, R.A. et al. | 2003
- 209
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Repair or buy a new one? The environmental consequences for electronicsLegarth, J.B. / Salter, I. / Willum, O. et al. | 2003
- 214
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Assessing integrated circuit manufacturing for environmental performance and sustainability: a full scale IC business applicationDickinson, D.A. / Mosovsky, J.A. / Houthuysen, S.D. et al. | 2003
- 220
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Becoming a zero waste to landfill facilityGjetley, L. / Pierre, F. et al. | 2003
- 224
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Product sustainability improvement based on performance of product componentsMeimei, G. / Mengchu Zhou, et al. | 2003
- 230
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Two innovative technologies used in the latest sustainable multifunctional office equipmentKakegawa, I. et al. | 2003
- 234
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Dynamic scheduling and line balancing methods, and software tools for lean and reconfigurable disassembly cells and linesRanky, P.G. / Subramanyam, M. / Caudill, R.J. / Limaye, K. / Alli, N. et al. | 2003
- 240
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Creating business value and environmental performance through the use of customer-focused quality toolsEagan, P. / Finster, M.P. / Hussey, D. et al. | 2003
- 246
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Web based ecodesign supporting system for electronic productsJungman Chung, / Hankyung Lee, / Youngdeog Koh, / Tak Hur, et al. | 2003
- 251
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Toward environmentally conscious product design-a comprehensive DfE implementation in new generation cellular phonesLindholm, M.E. et al. | 2003
- 255
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Extending PC lifespan through secondary marketsWilliams, E.D. et al. | 2003
- 260
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Ten facts to know about plastics from consumer electronicsFisher, M. / Biancaniello, J. / Kingsbury, T. / Headley, L. et al. | 2003
- 265
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Eco-efficiency of take-back and recycling, a comprehensive approachHuisman, J. / Stevels, A. et al. | 2003
- 271
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Emissions from the incineration of electronics industry wasteStewart, E.S. / Lemieux, P.M. et al. | 2003
- 276
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Life Cycle Inventory Development for Water Fabrication in Semiconductor ManufacturingMurphy, C. F. / Laurent, J.-P. / Allen, D. T. / IEEE Computer Society / International Association of Electronics Recyclers et al. | 2003
- 276
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Life cycle inventory development for wafer fabrication in semiconductor manufacturingMurphy, C.F. / Laurent, J.-P. / Allen, D.T. et al. | 2003
- 282
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Research about the quantified assess system on the life cycle of typical electromechanic product based on the economic characterLiu Gang, / Xian Dong, / Duan Guanghong, / Wang Jingsong, et al. | 2003
- 286
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An information system management of assessment of disassembly and recycleMeng Peng, / Duan Guanghong, / Xiang Dong, / Liu Xueping, / Wu Ying, / Li Fangyi, / Li Yi, et al. | 2003
- 291
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Printed scholarly books and e-book reading devices: a comparative life cycle assessment of two book optionsKozak, G.L. / Keolelan, G.A. et al. | 2003
- 297
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An organizational change strategy to improve environmental protectionCors, R. / Eagan, P. / Courter, S.L. et al. | 2003
- 303
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Communicating eco-efficiency in industrial contexts: a framework for understanding the (lack) of success and applicability of eco-designPascual, O. / Boks, C. / Stevels, A. et al. | 2003
- 309
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Assessing base level of service for electronics collection and recycling programs: Seattle-Tacoma case studyCaudill, R. / Jackson, S. / Rifer, W. / Marella, F. / Cole, S. / Willmott, A. et al. | 2003
- 315
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Integration of a product stewardship program: a case studyLockwood, D.A. / Hazen, C. et al. | 2003
- 318
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E&HS aspects on metal recovery from electronic scrapLehner, T. et al. | 2003
- 323
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Occupational risks associated with electronics demanufacturing and CRT glass processing operations and the impact of mitigation activities on employee safety and healthPeters-Michaud, N. / Katers, J. / Barry, J. et al. | 2003
- 329
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Is CRT glass-to-lead recycling safe and environmentally friendly?Weitzman, D.H. et al. | 2003
- 335
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Strategies to optimize return on investment (ROI) through effective reverse supply chain programsLee, J. / Lund, M. et al. | 2003
- 341
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A symbolic methodology to improve manual disassembly economicsRios, P. / Blyler, L. / Tieman, L. / Stuart, J.A. / Duplaga, L. / Meyer, N. / Grant, E. et al. | 2003
- 347
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An environmentally conscious management model for end-of-life electromechanical productsXueqing Qian, / Zhang, H.C. et al. | 2003
- 352
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Wisconsin end-of-life electronics studyDiggelman, C. / Brachman, S. et al. | 2003
- 358
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Environmental benchmarking of medium-sized TVs sold in North America, Europe and Asia (China)Carlier, T. / Duncan, S. / Boks, C. / Stevels, A. / Bras, B. et al. | 2003
- 365
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Case studies for calculation of factor XAoe, T. / Matsuoka, Y. / Shikata, N. / Michiyasu, T. / Fukuda, M. et al. | 2003
- 371
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Introduction and development of a factor X (eco-efficiency) toolAoe, T. et al. | 2003
- 377
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Designing for designers-ecodesign tools to inform and inspireLofthouse, V. et al. | 2003
- 383
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Author index| 2003
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Conference Record. 2003 IEEE International Symposium on Electronics and the Environment (Cat. No.03CH37425)| 2003