Proceedings of the 2004 IEEE International Symposium on Electronics & the Environment : 10 - 13 May 2004, Scottsdale, AZ, USA ; [and the 5th Electronics Recycling Summit] (English)
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2004
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ISBN:
- Conference Proceedings / Print
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Title:Proceedings of the 2004 IEEE International Symposium on Electronics & the Environment : 10 - 13 May 2004, Scottsdale, AZ, USA ; [and the 5th Electronics Recycling Summit]
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Contributors:
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Conference:IEEE International Symposium on Electronics & the Environment ; 12 ; 2004 ; Scottsdale, Ariz.
ISEE ; 12 ; 2004 ; Scottsdale, Ariz.
Electronics Recycling Summit ; 5 ; 2004 ; Scottsdale, Ariz. -
Publisher:
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Place of publication:Piscataway, NJ
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Publication date:2004
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Size:X, 328 S
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Remarks:IEEE catalog number 04CH37511
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ISBN:
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Type of media:Conference Proceedings
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Type of material:Print
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Language:English
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Contract number:04CH37511
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Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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IEEE International Symposium on Electronics and the Environment| 2004
- 1
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Economic sustainability of reuse as an end-of-life management tool for computers and televisionsRubinstein, L. et al. | 2004
- 7
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Making sustainability accountable: a valuation model for corporate performanceLing Wang, / Li Lin, et al. | 2004
- 13
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Environmental impact of information and communication technologies including rebound effectsTakahashi, K.I. / Tatemichi, H. / Tanaka, T. / Nishi, S. / Kunioka, T. et al. | 2004
- 17
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A macroeconomic analysis of the relationship between IT industries and environmental policiesMatsumoto, M. / Fujimoto, J. / Tekawa, M. / Tamura, T. et al. | 2004
- 23
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Life cycle tools for future product sustainabilityPrzekop, L.A. / Kerr, S. et al. | 2004
- 27
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Thermal performance and microstructure of lead versus lead-free solder die attach interface in power device packagesStinson-Bagby, K. / Huff, D. / Katsis, D. / Van Wyk, D. / Lu, G.Q. et al. | 2004
- 33
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Environmental leadership in electronics manufacturing: lead-free and beyondShangguan, D. et al. | 2004
- 40
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Environmental assessment of halogen-free printed circuit boards, a design for environment (DfE) project with the high density packaging user group (HDPUG)O'Connell, S. / Whitley, A. / Brady, T. / Ching, S. / Fong, A. / Bergman, R. / Burkitt, J. et al. | 2004
- 46
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End-of-life and regulatory issues for flame retardant plastics used in electrical and electronic equipment applicationsDawson, R.B. / Landry, S.D. et al. | 2004
- 51
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A decision-support tool for the take-back of plastics from end-of-life electronicsMasanet, E.R. / Horvath, A. et al. | 2004
- 57
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An economic model for end-of-life management of printed circuit boardsRao, N.U. / Yuan, C.Y. / Zhang, H.C. et al. | 2004
- 63
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Developing product recovery services: a case study from the electrical power network construction industryHerold, M. et al. | 2004
- 68
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Methodology for recycling potential evaluation criterion of waste home appliances considering environmental and economic factorJunbeum Kim, / Yongwoo Hwang, / Matthews, H.S. / Kwangho Park, et al. | 2004
- 74
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Environmental and economic trade-offs in consumer electronic products recycling: a case study of cell phones and computersBhuie, A.K. / Ogunseitan, O.A. / Saphores, J.-D.M. / Shapiro, A.A. et al. | 2004
- 80
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Revisiting energy used to manufacture a desktop computer: hybrid analysis combining process and economic input-output methodsWilliams, E.D. et al. | 2004
- 86
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Using a hybrid approach to evaluate semiconductor life cycle environmental issues - a case study in interconnect module impactsKrishnan, N. / Boyd, S. / Rosales, J. / Dornfeld, D. / Raoux, S. / Smati, R. et al. | 2004
- 91
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Development of a hybrid environmental impact assessment model: a case study on computer displaysXiaoying Zhou, / Schoenung, J.M. et al. | 2004
- 97
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Comparative analysis of the manufacturing and consumer use phases of two generations of semiconductors [microprocessors]Yao, M.A. / Wilson, A.R. / McManus, T.J. / Shadman, F. et al. | 2004
- 97
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Comparative Analysis of the Manufacturing and Consumer Use Phases of Two Generations of SemiconductorsYao, M. A. / Wilson, A. R. / McManus, T. J. / Shadman, F. et al. | 2004
- 104
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Recycling and extended life of electric home appliances: hybrid analysis based on the waste input-output modelNakmura, S. / Kondo, Y. et al. | 2004
- 106
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Comparative analysis of traditional telephone and voice-over-Internet protocol (VoIP) systemsHui Min Chong, / Matthews, H.S. et al. | 2004
- 112
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Energy resource management in the virtual data centerWhite, R. / Abels, T. et al. | 2004
- 117
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Peak-shift method for notebook computers - a power management approach for load levelingHatori, M. et al. | 2004
- 122
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Life-cycle assessment of an intelligent lighting system using a distributed wireless mote networkDubberley, M. / Agogino, A.M. / Horvath, A. et al. | 2004
- 128
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Power Management of Computers - $ 1.5 Billion in Potential Energy Savings AnnuallyKorn, D. / Huang, R. / Beavers, D. / Bolioli, T. / Walker, M. et al. | 2004
- 128
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Power management of computersKorn, D. / Huang, R. / Beavers, D. / Bolioli, T. / Walker, M. et al. | 2004
- 132
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Sustainability and end-of-life product management: a case study of electronics collection scenariosCaudill, R.J. / Dickinson, D.A. et al. | 2004
- 138
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An overview of environmental product performance measurement in the Asian electronics industryPascual, O. / Boks, C. et al. | 2004
- 144
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Operational sustainability metrics - assessing performance of electronics recycling systemsKirchain, R. / Atlee, J. et al. | 2004
- 150
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A review of environmental accounting practices in the Asian electronics industryPascual, O. / Boks, C. et al. | 2004
- 156
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Environmental implications of PCB manufacturing in ChinaJingwei Wang, / Jinqiu Xu, et al. | 2004
- 159
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The environmental impacts of electronics. Going beyond the walls of semiconductor fabsPlepys, A. et al. | 2004
- 166
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Smart disassembly [joint separation method]Hosoda, N. / Halada, K. / Suga, T. et al. | 2004
- 166
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Smart DisassemblyHosoda, N. / Halada, K. / Suga, T. et al. | 2004
- 168
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Life cycle process management for environmentally sound and cost effective semiconductor manufacturingDietrich, J.M. et al. | 2004
- 173
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Reuse and Lifetime Extension Strategies in the Context of Technology Innovations, Global Markets, and Environmental LegislationGriese, H. / Poetter, H. / Schischke, K. / Ness, O. / Reichl, H. et al. | 2004
- 173
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Reuse and lifetime extension strategies in the context of technology innovations, global markets, and environmental legislation [electronics]Griese, H. / Poetter, H. / Schischke, K. / Ness, O. / Reichl, H. et al. | 2004
- 179
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Service to extend the life of TV setsStevels, A. / Boekee, M. et al. | 2004
- 183
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Mathematical model of reusabilityMurayama, T. / Yamamoto, S. / Oba, F. et al. | 2004
- 189
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Baseline study of noncommercial computer reuse in the United StatesLynch, J. et al. | 2004
- 195
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A Decade of Processing End of Life IT Equipment - Lessons Learned at the IBM~(~™~) Endicott Asset Recovery CenterGrenchus, E. J. / Keene, R. A. / Nobs, C. R. et al. | 2004
- 195
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A decade of processing end of life IT equipment - lessons learned at the IBM/sub /spl trade// Endicott asset recovery centerGrenchus, E.J. / Keene, R.A. / Nobs, C.R. et al. | 2004
- 199
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Complying with Extended Producer Responsibility Requirements: Business Impacts, Tools and StrategiesMcCracken, J. / Bell, V. et al. | 2004
- 199
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Complying with extended producer responsibility requirements: business impacts, tools and strategies [electronic products]McCracken, J. / Bell, V. et al. | 2004
- 204
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Global mandate, national policies, and local responses: scale conflicts in China's management of imported e-wasteTong, X. et al. | 2004
- 208
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The role of success factors and obstacles in design for environment: a survey among Asian electronics companiesBoks, C. / Pascual, O. et al. | 2004
- 214
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A distributed design methodology for extensible product life cycle strategy [electronic products]Jianzhi Li, / Shrivastava, P. / Zhang, H.C. et al. | 2004
- 214
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A Distributed Design Methodology for Extensible Product Life Cycle StrategyLi, J. / Shrivastava, P. / Zhang, H. C. et al. | 2004
- 220
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Using dynamic reliability models to extend the economic life of strongly innovative productsvan den Bogaard, J.A. / Shangguan, D. / Jayaram, J.S.R. / Hulsken, G. / Brombacher, A.C. / Ion, R.A. et al. | 2004
- 226
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Used consumer electronics: a comparative analysis of materials recycling technologiesHai-Yong Kang, / Schoenung, J.M. et al. | 2004
- 231
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Investigations on the Metallurgical Use of CRT and LCD GlassSamuelsson, C. / Lehner, T. et al. | 2004
- 231
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Investigations on the metallurgical use of CRT and LCD glass [smelting flux applications]Samuelsson, C. / Lehner, T. et al. | 2004
- 237
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A physical process for recycling and reusing waste printed circuit boardsMou Peng, / Wa Layiding, / Xiang Dong, / Gao Jiangang, / Duan Guanghong, et al. | 2004
- 243
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Eco-efficient implementation of electronic waste policies in practiceHuisman, J. / Stevels, A. et al. | 2004
- 249
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A business-mapping approach to multi-criteria group selection of collection centers and recovery facilitiesPochampally, K.K. / Gupta, S.M. et al. | 2004
- 255
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Environmentally effective policy directions for computersKuehr, R. et al. | 2004
- 258
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The silence of silicon lambs: speaking out health and environmental impacts within Taiwan's Hsinchu Science-based industrial parkShenglin Chang, / Hua-mei Chiu, / Wenling Tu, et al. | 2004
- 264
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Evaluating supply line sustainability and business environmental riskSwarr, T.E. / Cline, H.J. / Soontae Jeong, / Dickinson, D.A. / Caudill, R.J. et al. | 2004
- 270
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Customer perception of buying new but unpacked electronics productsBoks, C. / Galjaard, S. / Huisman, M. / Wever, R. et al. | 2004
- 275
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Bridging the information gap: material tracking and consumer labels to encourage sustainable computingMcCullar, N. / Blackmore, B. / Goh, A. / King, G. / Kowalski, N. / Rau, M. et al. | 2004
- 281
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Development of XML industry standards for information exchange and commerce [electronics recycling industry example]Tucker, J. / Alcorn, W. / Kaplan, K. et al. | 2004
- 281
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Development of XML Industry Standards for Information Exchange and CommerceTucker, J. / Alcorn, W. / Kaplan, K. et al. | 2004
- 287
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New product development challenges of design for environmental compliance and design for electromagnetic complianceArnold, R.R. et al. | 2004
- 292
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Sustainable electrical and electronic plastics recyclingFisher, M. / Kingsbury, T. / Headley, L. et al. | 2004
- 298
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Absence of free, unbound carbon black in printer toners: a California Proposition 65 studyFong, A. / Balstad, E. / Barakat, A. / Brooks, B. et al. | 2004
- 304
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Case Study: Multi Life Cycle CenterKnoth, R. / Brandstotter, M. / Kopacek, B. / Kopacek, P. et al. | 2004
- 304
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Case study: multi life cycle center [waste electric and electronic equipment recycling]Knoth, R. / Brandstotter, M. / Kopacek, B. / Kopacek, P. et al. | 2004
- 309
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GPS and radio tracking of end-of-life products [recycling and waste disposal applications]Lee, J.A. / Thomas, V.M. et al. | 2004
- 309
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GPS and Radio Tracking of End-of-Life ProductsLee, J. A. / Thomas, V. M. et al. | 2004
- 313
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Linking bar codes to recycling information for mobile phonesStutz, M. / Thomas, V.M. / Saar, S. et al. | 2004
- 317
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Data security issues relating to end of life equipmentBennison, P.F. / Lasher, P.J. et al. | 2004
- 321
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Efficient design and effective marketing of a reverse supply chain: a fuzzy logic approachPochampally, K.K. / Gupta, S.M. et al. | 2004
- 327
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Author index| 2004
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Proceedings of the 2004 IEEE International Symposium on Electronics and the Environment Copyright Page| 2004
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Scope and format| 2004
- v
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IEEE International Symposium on Electronics and the Environment Table of Contents| 2004
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Proceedings of the 2004 IEEE International Symposium on Electronics and the Environment (IEEE Cat. No.04CH37511)| 2004