Cleaning and surface conditioning technology in semiconductor device manufacturing 11 : [the Eleventh International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing was held during the 216th meeting of the Electrochemical Society, in Vienna, Austria from October 4 to 9, 2009] (English)
- New search for: Electrochemical Society, Electronics and Photonics Division
- Further information on Electrochemical Society, Electronics and Photonics Division:
- http://d-nb.info/gnd/6057340-5
- New search for: Hattori, Takeshi
- New search for: Electrochemical Society, Electronics and Photonics Division
- Further information on Electrochemical Society, Electronics and Photonics Division:
- http://d-nb.info/gnd/6057340-5
2009
-
ISBN:
- Conference Proceedings / Print
-
Title:Cleaning and surface conditioning technology in semiconductor device manufacturing 11 : [the Eleventh International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing was held during the 216th meeting of the Electrochemical Society, in Vienna, Austria from October 4 to 9, 2009]
-
Contributors:
-
Conference:International Symposium on Semiconductor Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing ; 11 ; 2009 ; Vienna
ECS Cleaning Symposium ; 11 ; 2009 ; Vienna
Meeting of the Electrochemical Society ; 216 ; 2009 ; Vienna -
Published in:ECS transactions ; 25,5
-
Publisher:
- New search for: Electrochemical Soc.
-
Place of publication:Pennington, NJ
-
Publication date:2009
-
Size:X, 383 S.
-
ISBN:
-
Type of media:Conference Proceedings
-
Type of material:Print
-
Language:English
- New search for: 53.56
- Further information on Basic classification
- New search for: 621.381
- Further information on Dewey Decimal Classification
-
Keywords:
-
Classification:
-
Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
-
Non-Aqueous/Dry Cleaning Technology without Causing Damage to Fragile Nano-StructuresHattori, T. / Electrochemical Society et al. | 2009
- 17
-
Cleaning and strip requirements for metal gate based CMOS integrationSchram, T. / Sebai, F. / Claes, M. / Vos, R. / Masayuki, W. / Albert, J. / Rohr, E. / Kubicek, S. et al. | 2009
- 17
-
Cleaning and Strip Requirement for Metal Gate Based CMOS IntegrationSchram, T. / Farid, S. / Cleas, M. / Vos, R. / Wada, M. / Albert, J. / Rohr, E. / Kubicek, S. / Electrochemical Society et al. | 2009
- 29
-
Interplay between Dry Etch and Wet Clean in Patterning La~2O~3/HfO~2 Containing High-k/metal Gate StacksVos, I. / Hellin, D. / Vrancken, C. / Geypen, J. / Bender, H. / Vecchio, G. / Paraschiv, V. / Vertommen, J. / Boullart, W. / Electrochemical Society et al. | 2009
- 37
-
Structural Changes of La~2O~3-doped Hf-based High-k Dielectrics during Aqueous HF TreatmentSugita, Y. / Hayashi, M. / Aoyama, T. / Ikeda, K. / Electrochemical Society et al. | 2009
- 45
-
New Wet Process Strategies for Reduced La~2O~3 and MgO~2 High-k Cap-dielectric LossWada, M. / Vos, R. / Claes, M. / Schram, T. / Snow, J. / Mertens, P. / Eitoku, A. / Electrochemical Society et al. | 2009
- 55
-
Study of CMOS-compatible Copper Etching for Organic CoatingLambert, M. / Rostam-Khani, P. / Veen, J.t. / van Nimwegen, L. / Frederix, F. / Electrochemical Society et al. | 2009
- 63
-
Influence of UV Irradiation on the Removal of Post-etch Photoresist in Porous Low-k Dielectric PatterningKesters, E. / Le, Q. / Lux, M. / Onandia, L. / Baerts, C. / Vereecke, G. / Electrochemical Society et al. | 2009
- 71
-
Effect of Radical Scavenger and UV Irradiation on Removal of Photoresist and BARC using Water/Ozone in Cu/Low-k InterconnectLe, Q. / Lux, M. / Kesters, E. / Prager, L. / Vereecke, G. / Electrochemical Society et al. | 2009
- 79
-
Impact of the Volatile Acid Contaminants on Copper Interconnects Electrical PerformancesFontaine, H. / Feldis, H. / Danel, A. / Cetre, S. / Ailhas, C. / Electrochemical Society et al. | 2009
- 87
-
Surfactants as an Additive to Wet Cleaning Solutions for Plasma Etch Residue Removal: Compatibility to a Porous CVD-SiCOH Ultra Low-k Dielectric MaterialAhner, N. / Schulz, S. / Zacher, M. / Electrochemical Society et al. | 2009
- 95
-
SAM Modification of CMP Conditioner for the Prevention of Particle AdhesionKwon, T. / Kang, Y. / Kim, I. / Kim, D. / Kim, J. / Chun, J. / Park, M. / Park, J. / Electrochemical Society et al. | 2009
- 101
-
Screening and Evaluation of Different Wet Cleaning Solutions for Post Etch Residue Removal in BEOL ApplicationsSuhard, S. / Claes, M. / Loh, J. / Vereecke, G. / Pantouvaki, M. / Demuynck, S. / Vereecke, B. / Beyer, G. / Electrochemical Society et al. | 2009
- 109
-
Dilute HF Solutions for Copper Cleaning during BEOL Processes: Effect of Aeration on Selectivity and Copper CorrosionThanu, D.P.R. / Venkataraman, N. / Raghavan, S. / Mahdavi, O. / Electrochemical Society et al. | 2009
- 117
-
Using a Novel Solvent-based Technology to Preserve Low-k Material when Removing Gap Fill MaterialFranklin, C. / Rector, A. / Pfettscher, D. / Pollard, K. / Scheele, D. / Electrochemical Society et al. | 2009
- 123
-
Cleaning of Silicon Wafer Surfaces with Reactive GasesVierhaus, J. / Haase, C. / Briesemeister, J. / Burte, E. / Electrochemical Society et al. | 2009
- 131
-
Drying Impact on Semiconductor Surfaces after Innovative Solvent ExposureLe Tiec, Y. / Fournel, F. / Rochat, N. / Barnes, J. / Veillerot, M. / Morales, C. / Moriceau, H. / Clavelier, L. / Rieutord, F. / Morote, C. et al. | 2009
- 139
-
Characterization of the HCl Absorption & Outgassing Mechanisms by FOUPs' PolymersFontaine, H. / Borde, Y. / Brych, C. / Danel, A. / Electrochemical Society et al. | 2009
- 147
-
Cleaning Process in Single Wafer Tool: Impact of Dispersion Phenomena on Rinsing TimeMallet, A. / Prat, M. / Broussous, L. / Schmitz, P. / Electrochemical Society et al. | 2009
- 155
-
Solar Cell Texturing: A Simplified RecipeVukosav, T. / Herrera, P. / Reinhardt, K. / Electrochemical Society et al. | 2009
- 165
-
Yield Qualification of All Wet Photoresist Stripping for CMOS Well Loop Implant Masks in 300mm High Volume ManufacturingNan, R. / Lee, F. / Hung, J. / Chu, J.M. / Yuan, J. / Yang, D. / Butterbauth, J. / Electrochemical Society et al. | 2009
- 173
-
Removal of Photoresist and BARC in Cu BEOL using an All-wet ProcessLe, Q. / Klipp, A. / Lux, M. / Li, Y. / Zhao, L. / Vereecke, G. / Electrochemical Society et al. | 2009
- 179
-
Lossless Solvent-based Extension Implant StripVos, R. / Mannaert, G. / Halder, S. / Wada, M. / Sonnemans, R. / Tsvetanova, D. / Valckx, N. / Vanstreels, K. / Conard, T. / Mertens, P. et al. | 2009
- 187
-
Characterization of 248nm Deep Ultraviolet (DUV) Photoresist after Ion ImplantationTsvetanova, D. / Vos, R. / Vereecke, G. / Clemente, F. / Vanstreels, K. / Conard, T. / Franquet, A. / Parac-Vogt, T.N. / Mertens, P. / Heyns, M.M. et al. | 2009
- 195
-
Photo-etching of Silicon by N-Fluoropyridinium SaltGoto, S. / Tsukamoto, K. / Kawase, T. / Ajari, N. / Nagai, T. / Adachi, K. / Uchikoshi, J. / Morita, M. / Electrochemical Society et al. | 2009
- 203
-
Investigation of Physical Cleaning Process Window by Atomic Force MicroscopeKim, T. / Wostyn, K. / Bearda, T. / Park, J. / Mertens, P. / Heyns, M.M. / Electrochemical Society et al. | 2009
- 211
-
Particle Removal and Damage Thresholds from Particle Removal and Damage Formation Frequency for High-Velocity-Aerosol CleaningWostyn, K.L. / Wada, M. / Andreas, M. / Kenis, K. / Roussel, P. / Bearda, T. / Leunissen, P. / Mertens, P. / Electrochemical Society et al. | 2009
- 219
-
Damage Cluster Analysis of Patterned Wafers during Solvent Spray CleaningHalder, S. / Wostyn, K.L. / Andreas, M. / Wada, M. / Brems, S. / Bearda, T. / Pacco, A. / Kenis, K. / Vos, R. / Mertens, P. et al. | 2009
- 227
-
Comparison of Jet Spray and Megasonic Module for a Cleaning of Aluminum Layer SurfaceMin, J. / Kim, N. / Yang, J. / Park, Y. / Kim, T. / Electrochemical Society et al. | 2009
- 233
-
Impact of Steam-Water Mixed Spray on Silicon and Metal SurfacesMashiko, T. / Hayashida, A. / Yamada, Y. / Sanada, T. / Watanabe, M. / Electrochemical Society et al. | 2009
- 241
-
Collapse Mechanisms for High Aspect Ratio Structures with Application to Clean ProcessingPeter, D. / Holsteyns, F. / Dalmer, M. / Kruwinus, H. / Lechner, A. / Bensch, W. / Electrochemical Society et al. | 2009
- 249
-
Removal of Post-dry Etch Residue uing Ultra Low Environmental Load TechniqueHayashida, A. / Seki, A. / Mashiko, T. / Sanada, T. / Watanabe, M. / Electrochemical Society et al. | 2009
- 249
-
Removal of post-dry etch residue using ultra low environmental load techniqueHayashida, A. / Seki, A. / Mashiko, T. / Sanada, T. / Watanabe, M. et al. | 2009
- 257
-
Effect of Laser Shock Wave Cleaning Direction on Particle Removal Behavior at TrenchsKim, J. / Busnaina, A. / Park, J. / Electrochemical Society et al. | 2009
- 265
-
Water and Bubble Motions Under Megasonic Wave in a Silicon Wafer Wet Cleaning BathHabuka, H. / Okada, Y. / Fukumoto, R. / Yoshii, H. / Kato, M. / Electrochemical Society et al. | 2009
- 273
-
Reevaluation of Hydrogen Gas Dissolved Cleaning Solutions in Single Wafer Megasonic CleaningKang, B. / Lee, S. / Kim, I. / Choi, E. / Kim, B. / Busnaina, A. / Hattori, T. / Park, J. / Electrochemical Society et al. | 2009
- 281
-
Development of a Single-beam Megasonic System for Nano-particle CleaningKim, H. / Lee, Y. / Lim, E. / Electrochemical Society et al. | 2009
- 287
-
Impact of Acoustical Reflections on Megasonic Cleaning PerformanceBrems, S. / Hauptmann, M. / Camerotto, E. / Pacco, A. / Halder, S. / Zijlstra, A. / Doumen, G. / Bearda, T. / Mertens, P. / Electrochemical Society et al. | 2009
- 295
-
Megasonic Metrology for Enhanced Process DevelopmentKumari, S. / Keswani, M. / Beck, M. / Liebscher, E. / Liang, T. / Deymier, P. / Raghavan, S. / Electrochemical Society et al. | 2009
- 303
-
Damage-free Design of Megasonic Waveguide for Single Wafer ProcessAhn, Y. / Yu, D. / Yang, J. / Kulkarni, A. / Kim, J. / Lee, H. / Kim, T. / Electrochemical Society et al. | 2009
- 311
-
Cleaning and Damage Performance of Single Wafer Cleaning Tools using Physical Removal ForcesPacco, A. / Halder, S. / Kenis, K. / Bearda, T. / Mertens, P. / Electrochemical Society et al. | 2009
- 319
-
Influence of Subharmonics on Megasonic CleaningHiguchi, A. / Electrochemical Society et al. | 2009
- 329
-
Ruthenium Wet Etch on 200mm MEMS Wafers with Sodium HypochloriteSegaud, R. / Gabette, L. / Louveau, O. / Besson, P. / Electrochemical Society et al. | 2009
- 337
-
Gold Wet Etch Optimization on 200mm Substrates for MEMS ApplicationsGabette, L. / Segaud, R. / Fadloun, S. / Avale, X. / Besson, P. / Electrochemical Society et al. | 2009
- 345
-
Cleaning-Free Deposition of Highly Crystallized Si Films on Plastic Film Substrates Using Pulsed-Plasma CVD under Near-Atmospheric PressureMatsumoto, M. / Ito, S. / Inayoshi, Y. / Murashige, S. / Fukidome, H. / Suemitsu, M. / Nakajima, S. / Uehara, T. / Toyosihima, Y. / Electrochemical Society et al. | 2009
- 351
-
Etching of Sacrificial CVD Silicon Dioxides with Anhydrous HF VaporRitala, H. / Kiihamaki, J. / Electrochemical Society et al. | 2009
- 361
-
Monitoring of Semiconductor Surfaces using Photoconductance Decay (PCD) MethodDrummond, P. / Ramani, S. / Ruzyllo, J. / Electrochemical Society et al. | 2009
- 367
-
Metrology for Implanted Si Substrate and Dopant Loss StudiesRadisic, D. / Shamiryan, D. / Mannaert, G. / Boullart, W. / Rosseel, E. / Bogdanowicz, J. / Goosens, J. / Marrant, K. / Bender, H. / Sonnemans, R. et al. | 2009
- 375
-
Quantitative Analysis of Transition Metals Penetrating the Silicon Substrate by Dopant Ion ImplantationSaga, K. / Ueno, K. / Ohno, R. / Electrochemical Society et al. | 2009
- 383
-
Electrochemical and Analytical Study of the Si Etching Mechanism in HFValckx, N. / Vos, R. / Rip, J. / Doumen, G. / Mertens, P. / Bearda, T. / Heyns, M.M. / De Gendt, S. / Electrochemical Society et al. | 2009