Uncertainty analysis of solder alloy material parameters estimation based on model calibration method (English)
- New search for: Gang, Jin Hyuk
- New search for: An, Dawn
- New search for: Joo, Jin Won
- New search for: Choi, Joo Ho
- New search for: Gang, Jin Hyuk
- New search for: An, Dawn
- New search for: Joo, Jin Won
- New search for: Choi, Joo Ho
In:
Microelectronics and Reliability
;
52
, 6
;
1128-1137
;
2012
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ISSN:
- Article (Journal) / Electronic Resource
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Title:Uncertainty analysis of solder alloy material parameters estimation based on model calibration method
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Contributors:
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Published in:Microelectronics and Reliability ; 52, 6 ; 1128-1137
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Publisher:
- New search for: Elsevier Ltd
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Publication date:2012-01-07
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Size:10 pages
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents – Volume 52, Issue 6
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 953
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Nvidia’s GPU failures: A case for prognostics and health managementPecht, Michael et al. | 2011
- 958
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New optimized Dual-Material (DM) gate design to improve the submicron GaN-MESFETs reliability in subthreshold regimeLakhdar, N. / Djeffal, F. et al. | 2011
- 964
-
Study of the breakdown failure mechanisms for power AlGaN/GaN HEMTs implemented using a RF compatible processXie, Gang / Xu, Edward / Zhang, Bo / Ng, Wai Tung et al. | 2011
- 969
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Investigation on the thermal behavior of 0.15@mm gate-length In"0"."4Al"0"."6As/In"0"."4Ga"0"."6As MHEMTLin, C. K. / Chiu, H. C. / Lin, C. W. / Kao, H. l. / Chien, F. T. et al. | 2012
- 969
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Investigation on the thermal behavior of 0.15μm gate-length In0.4Al0.6As/In0.4Ga0.6As MHEMTLin, Che-Kai / Chiu, Hsien-Chin / Lin, Chao-Wei / Kao, Hsuan-ling / Chien, Feng-Tso et al. | 2011
- 974
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Temperature dependent drain current model for Gate Stack Insulated Shallow Extension Silicon On Nothing (ISESON) MOSFET for wide operating temperature rangeKumari, Vandana / Saxena, Manoj / Gupta, R.S. / Gupta, Mridula et al. | 2011
- 984
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Modeling of noise for p-channel DG-FinFETsPandit, Srabanti / Syamal, Binit / Sarkar, C.K. et al. | 2011
- 989
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Effect of localised charges on nanoscale cylindrical surrounding gate MOSFET: Analog performance and linearity analysisGautam, Rajni / Saxena, Manoj / Gupta, R.S. / Gupta, Mridula et al. | 2011
- 995
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Stress immunity enhancement of the SiN uniaxial strained n-channel metal–oxide–semiconductor field-effect-transistor by channel fluorine implantationChen, Yung-Yu / Hsieh, Chih-Ren / Chiu, Fang-Yu et al. | 2011
- 999
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Characterization and reliability of nMOSFETs on flexible substrates under mechanical strainKao, Hsuan-ling / Yeh, Chih-Sheng / Chen, Meng-Ting / Chiu, Hsien-Chin / Chang, Li-Chun et al. | 2011
- 1005
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Determination of contact parameters of Ni/n-GaP Schottky contactsDuman, S. / Ejderha, K. / Yiğit, Ö. / Türüt, A. et al. | 2011
- 1012
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HMM–TLP correlation for system-efficient ESD designNotermans, Guido / Bychikhin, Sergey / Pogany, Dionyz / Johnsson, David / Maksimovic, Dejan et al. | 2011
- 1020
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Study of intrinsic characteristics of ESD protection diodes for high-speed I/O applicationsYeh, Chih-Ting / Ker, Ming-Dou et al. | 2011
- 1031
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Analysis of reliability and optimization of ESD protection devices supported by modeling and simulationChvala, A. / Donoval, D. / Beno, P. / Marek, J. / Pribytny, P. / Molnar, M. et al. | 2011
- 1039
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Oxide and interface trap densities estimation in ultrathin W/La2O3/Si MOS capacitorsMamatrishat, M. / Kubota, T. / Seki, T. / Kakushima, K. / Ahmet, P. / Tsutsui, K. / Kataoka, Y. / Nishiyama, A. / Sugii, N. / Natori, K. et al. | 2011
- 1043
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Physical properties and electrical characteristics of H2O-based and O3-based HfO2 films deposited by ALDFan, Jibin / Liu, Hongxia / Kuang, Qianwei / Gao, Bo / Ma, Fei / Hao, Yue et al. | 2012
- 1050
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W doping effect on the dielectric properties of amorphous Ga2O3 films grown on Si substrate for low-k applicationsDakhel, A.A. et al. | 2011
- 1055
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A novel method to improve cell endurance window in source-side injection split gate flash memoryTsair, Yong-Shiuan / Fang, Yean-Kuen / Juang, Feng-Renn / Wang, Yu-Hsiung / Chu, Wen-Ting / Lin, Yung-Tao / Tran, Luan et al. | 2011
- 1060
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Modeling of SET seasoning effects in Phase Change Memory arraysZambelli, C. / Chimenton, A. / Olivo, P. et al. | 2012
- 1065
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Yield enhancement techniques for 3-dimensional random access memoriesLu, Shyue-Kung / Chang, Tin-Wei / Hsu, Han-Yu et al. | 2011
- 1071
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Experimental study of microrectangular groove structure covered with multi mesh layers on performance of flat plate heat pipe for LED lighting moduleHsieh, J.C. / Huang, H.J. / Shen, S.C. et al. | 2011
- 1080
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Electrical failure analysis of peristaltic micropumps fabricated with PZT actuatorsChen, Bing-Liang / Huang, Pao-Cheng / Jang, Ling-Sheng / Chen, Ming-Kun et al. | 2012
- 1086
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Economic design of the mean prognostic distance for canary-equipped electronic systemsWang, Wenbin / Luo, Shuxin / Pecht, Michael G. et al. | 2011
- 1092
-
Challenges and developments of copper wire bonding technologyLiu, Peisheng / Tong, Liangyu / Wang, Jinlan / Shi, Lei / Tang, Hao et al. | 2011
- 1099
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Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modesMedjahed, Hassen / Vidal, Paul-Etienne / Nogarede, Bertrand et al. | 2012
- 1105
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Experiment study of dynamic looping process for thermosonic wire bondingWang, Fuliang / Chen, Yun / Han, Lei et al. | 2012
- 1112
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Inhomogeneous deformation and microstructure evolution of Sn–Ag-based solder interconnects during thermal cycling and shear testingChen, Hongtao / Han, Jing / Li, Jue / Li, Mingyu et al. | 2012
- 1121
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Acceleration of the growth of Cu3Sn voids in solder jointsBorgesen, Peter / Yin, Liang / Kondos, Pericles et al. | 2011
- 1128
-
Uncertainty analysis of solder alloy material parameters estimation based on model calibration methodGang, Jin Hyuk / An, Dawn / Joo, Jin Won / Choi, Joo Ho et al. | 2012
- 1138
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Investigation of intermetallic compounds (IMCs) in electrochemically stripped solder joints with SEMHurtony, Tamás / Bonyár, Attila / Gordon, Péter / Harsányi, Gábor et al. | 2011
- 1143
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Optimization modeling of the cooling stage of reflow soldering process for ball grid array package using the gray-based Taguchi methodLau, Chun-Sean / Abdullah, M.Z. / Che Ani, F. et al. | 2012
- 1153
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Reflow discoloration formation on pure tin (Sn) surface finishZeng, Xu / Sun, Hong-Qi / He, Yan-Feng / Qu, Xin-Ping et al. | 2012
- 1157
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Adhesion improvement of Cu-based substrate and epoxy molding compound interface by hierarchical structure preparationZhang, Wenjing / Luo, Wei / Hu, Anmin / Li, Ming et al. | 2011
- 1165
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Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packagingYim, Byung-Seung / Kwon, Yumi / Oh, Seung Hoon / Kim, Jooheon / Shin, Yong-Eui / Lee, Seong Hyuk / Kim, Jong-Min et al. | 2011
- 1174
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A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packagesJang, Kyung-Woon / Park, Jin-Hyoung / Lee, Soon-Bok / Paik, Kyung-Wook et al. | 2011
- 1182
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Studies on various chip-on-film (COF) packages using ultra fine pitch two-metal layer flexible printed circuits (two-metal layer FPCs)Suk, Kyoung-Lim / Choo, Kyosung / Kim, Sung Jin / Kim, Jong-Soo / Paik, Kyung-Wook et al. | 2011
- 1189
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On thermo-mechanical reliability of plated-through-hole (PTH)Su, Fei / Mao, Ronghai / Xiong, Ji / Zhou, Kun / Zhang, Zheng / Shao, Jiang / Xie, Cunyi et al. | 2011
- 1197
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Adaptive fault-tolerant DVFS with dynamic online AVF predictionFirouzi, Farshad / Azarpeyvand, Ali / Salehi, Mostafa E. / Fakhraie, Sied Mehdi et al. | 2012
- 1209
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Low cost and highly reliable hardened latch design for nanoscale CMOS technologyNan, Haiqing / Choi, Ken et al. | 2011
- 1215
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Efficient algorithms to accurately compute derating factors of digital circuitsAsadi, Hossein / Tahoori, Mehdi B. / Fazeli, Mahdi / Miremadi, Seyed Ghassem et al. | 2011
- 1227
-
Radiation hardened by design techniques to reduce single event transient pulse width based on the physical mechanismChen, Jianjun / Chen, Shuming / Liang, Bin / Liu, Biwei / Liu, Fanyu et al. | 2011
- 1233
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Single event upset mitigation by means of a sequential circuit state freezeSmith, Farouk et al. | 2011
- 1241
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Fault model for on-chip communication and joint equalization and special spacing rules for on-chip bus designLi, Lei / Hu, Jianhao et al. | 2011
- 1247
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Variability aware low leakage reliable SRAM cell design techniqueIslam, A. / Hasan, Mohd. et al. | 2012
- IFC
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Inside front cover - Editorial board| 2012