Computational evaluation of optimal reservoir and sink lengths for threshold current density of electromigration damage considering void and hillock formation (English)
- New search for: Takaya, Ryuji
- New search for: Sasagawa, Kazuhiko
- New search for: Moriwaki, Takeshi
- New search for: Fujisaki, Kazuhiro
- New search for: Takaya, Ryuji
- New search for: Sasagawa, Kazuhiko
- New search for: Moriwaki, Takeshi
- New search for: Fujisaki, Kazuhiro
In:
Microelectronics and Reliability
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118
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2021
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ISSN:
- Article (Journal) / Electronic Resource
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Title:Computational evaluation of optimal reservoir and sink lengths for threshold current density of electromigration damage considering void and hillock formation
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Contributors:Takaya, Ryuji ( author ) / Sasagawa, Kazuhiko ( author ) / Moriwaki, Takeshi ( author ) / Fujisaki, Kazuhiro ( author )
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Published in:
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Publication date:2021-02-01
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents – Volume 118
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Engineering application research on reliability prediction of the combined DC-DC power supplyHe, Yuchen / Zhang, Haiming / Wang, Pingzhou / Huang, Yunzhi / Chen, Zhiwei / Zhang, Yingying et al. | 2021
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Editorial Board| 2021
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Ruggedness of Dual-GCT against dynamic avalanche and surge currentYang, Wuhua / Wang, Cailin / Yang, Jing / Zhang, Qi / Su, Le et al. | 2021
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Thermal characterization of GaN lateral power HEMTs on Si, SOI, and poly-AlN substratesMagnani, Alessandro / Cosnier, Thibault / Amirifar, Nooshin / Chatterjee, Urmimala / Zhao, Ming / Li, Xiangdong / Geens, Karen / Decoutere, Stefaan et al. | 2021
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Reliability analysis for TO-247 multilayered power module packaging under mechanical oscillation based on finite element methodGhaderi, Davood et al. | 2021
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Improving the reliability of SRAM-based PUFs under varying operation conditions and aging degradationSaraza-Canflanca, P. / Carrasco-Lopez, H. / Santana-Andreo, A. / Brox, P. / Castro-Lopez, R. / Roca, E. / Fernandez, F.V. et al. | 2021
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Stochastic behavioral models for system level reliability analysis including non-normal and correlated process variationTaddiken, Maike / Hillebrand, Theodor / Peters-Drolshagen, Dagmar / Paul, Steffen et al. | 2021
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Reduced length redundancy adaptive protection for the cascaded integrator-comb interpolation filter on FPGAGear, Kyle W. / Sánchez-Macián, Alfonso / Maestro, Juan Antonio et al. | 2021
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FEM model calibration for simulation aided thermal designCioban, R. / Szőke, Sz. / Zaharie-B, D. / Kórádi, Z. / Leordean, C. / Simon, S. et al. | 2021
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Influence of post-bonding heating process on the long-term reliability of Cu/Al contactEto, Motoki / Araki, Noritoshi / Yamada, Takashi / Sugiyama, Masaaki / Fujimoto, Shinji et al. | 2021
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Stress/strain characterization in electronic packaging by micro-Raman spectroscopy: A reviewMa, Lulu / Qiu, Wei / Fan, Xuejun et al. | 2021
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Study on the influence of fretting wear on electrical performance of SMA connectorFeng, Chenzefang / Lin, Xinxin / Hu, Jianxiong / Shen, Ben / Hu, Zhou / Zhu, Fulong et al. | 2021
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Computational evaluation of optimal reservoir and sink lengths for threshold current density of electromigration damage considering void and hillock formationTakaya, Ryuji / Sasagawa, Kazuhiko / Moriwaki, Takeshi / Fujisaki, Kazuhiro et al. | 2021