3D morphology of the petal-like precipitates in Cu-Fe alloys: Experimental study and phase field modelling (English)
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https://orcid.org/0000-0001-8174-6549
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https://orcid.org/0000-0002-8493-9802
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In:
Acta Materialia
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270
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2024
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ISSN:
- Article (Journal) / Electronic Resource
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Title:3D morphology of the petal-like precipitates in Cu-Fe alloys: Experimental study and phase field modelling
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Contributors:Chen, K.X. ( author ) / Demange, G. ( author ) / Cui, X. ( author ) / Wang, Z.D. ( author ) / Pang, X.L. ( author ) / Patte, R. ( author ) / Mao, H.H. ( author ) / Chen, X.H. ( author ) / Shi, R.J. ( author ) / Zapolsky, H. ( author )
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Published in:Acta Materialia ; 270
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Publisher:
- New search for: Acta Materialia Inc.
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Publication date:2024-03-27
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents – Volume 270
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Editorial Board| 2024
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Atomic force microscopy and transmission electron microscopy identification of deformation twinning in the Cr2AlC MAX phaseParent, Salomé / Joulain, Anne / Bahsoun, Hadi / Renou, Gilles / Ouisse, Thierry / Villechaise, Patrick / Tromas, Christophe et al. | 2024
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3D microstructural and strain evolution during the early stages of tensile deformationZelenika, A. / Yildirim, C. / Detlefs, C. / Rodriguez-Lamas, R. / Grumsen, F.B. / Poulsen, H.F. / Winther, G. et al. | 2024
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Curvature conservation and conduction modulation for symmetric charged ferroelectric domain wallsFan, Yuanyuan / Liang, Deshan / Yang, Huayu / Liang, Chen / Dong, Shouzhe / Gao, Rongzhen / Liang, Minchuan / Yang, Jia / Wang, Yue / Ai, Hui et al. | 2024
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3D morphology of the petal-like precipitates in Cu-Fe alloys: Experimental study and phase field modellingChen, K.X. / Demange, G. / Cui, X. / Wang, Z.D. / Pang, X.L. / Patte, R. / Mao, H.H. / Chen, X.H. / Shi, R.J. / Zapolsky, H. et al. | 2024
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