Thermal profiling: a reflow process based on the heating factor (English)
- New search for: Gang Gao, Jin
- New search for: Ping Wu, Yi
- New search for: Ding, Han
- New search for: Hong Wan, Nian
- New search for: Gang Gao, Jin
- New search for: Ping Wu, Yi
- New search for: Ding, Han
- New search for: Hong Wan, Nian
In:
Soldering & Surface Mount Technology
;
20
, 4
;
20-27
;
2008
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ISSN:
- Article (Journal) / Electronic Resource
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Title:Thermal profiling: a reflow process based on the heating factor
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Contributors:Gang Gao, Jin ( author ) / Ping Wu, Yi ( author ) / Ding, Han ( author ) / Hong Wan, Nian ( author )
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Published in:Soldering & Surface Mount Technology ; 20, 4 ; 20-27
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Publisher:
- New search for: Emerald Group Publishing Limited
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Publication date:2008-09-19
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Size:8 pages
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Source:
Table of contents – Volume 20, Issue 4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
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Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloysReid, M. / Punch, J. / Collins, M. / Ryan, C. et al. | 2008
- 9
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Evaluation of the influence of Bi and Sb additions to Sn-Ag-Cu and Sn-Zn alloys on their surface tension and wetting properties using analysis of variance – ANOVABukat, K. / Sitek, J. / Kisiel, R. / Moser, Z. / Gasior, W. / Kościelski, M. / Pstruś, J. et al. | 2008
- 20
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Thermal profiling: a reflow process based on the heating factorGang Gao, Jin / Ping Wu, Yi / Ding, Han / Hong Wan, Nian et al. | 2008
- 28
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Hydrocarbon fluxes for ionic compound free soldering: improvement by peroxide additivesMiyake, Toshihiro / Ishida, Masaru / Inagaki, Satoshi et al. | 2008
- 37
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Workmanship standards and their application on ESA projectsDunn, Barrie D. et al. | 2008
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A review EIPC summer conference, Dresden, May 29-30, 2008| 2008
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Embossing tools for high-resolution manufacturing| 2008
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Cookson move manufacture to Hungary| 2008
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International diary| 2008
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IEMRC 3rd annual conference, 4 July, Loughborough UKStarkey, Pete et al. | 2008
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Optomec and Applied Nanotech Holdings, Inc. announce strategic cooperation to introduce optimized copper inks for aerosol jet printing for printable electronics| 2008
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Michael Brianda appointed as DEK President| 2008
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Mara Technologies expands operations with new assembléon pick and place machines| 2008
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DEK announces precision screens for PV cell production| 2008
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New strategy for printed electronics| 2008
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DEK releases a sweeping range of innovative product functionality improvements| 2008
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HumiSeal strengthens European R&D team with senior appointment| 2008
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iNEMI schedules sustainability summit to plan strategic action on environmental issues| 2008