Yttrium-hafnium-doped aluminum-cobalt-chromium-iron-nickel-silicon high-entropy thermal barrier bonding layer (Chinese)
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- New search for: MOU RENDE
- New search for: YU JINGYI
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2022
- Patent / Electronic Resource
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Title:Yttrium-hafnium-doped aluminum-cobalt-chromium-iron-nickel-silicon high-entropy thermal barrier bonding layer
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Additional title:一种钇铪掺杂铝钴铬铁镍硅高熵热障粘结层
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Patent number:CN114411081
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Patent applicant:
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Patent family:
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Contributors:MOU RENDE ( author ) / YU JINGYI ( author ) / YANG WENHUI ( author ) / CAI YAN ( author ) / SHEN ZAOYU ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2022-04-29
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Chinese
- New search for: C23C / B22F / C22C
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