Wafer expanding device for chip packaging (Chinese)
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2022
- Patent / Electronic Resource
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Title:Wafer expanding device for chip packaging
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Additional title:用于芯片封装的晶圆扩片装置
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Patent number:CN115458443
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Patent applicant:
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Patent family:
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Contributors:WU JIAJIA ( author )
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Publisher:
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Publication date:2022-12-09
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Chinese
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: