Copper-containing eutectic high-entropy alloy and preparation method and application thereof (Chinese)
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2023
- Patent / Electronic Resource
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Title:Copper-containing eutectic high-entropy alloy and preparation method and application thereof
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Additional title:一种含铜共晶高熵合金及其制备方法和应用
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Patent number:CN116536565
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Publication date:2023-08-04
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Chinese
- New search for: C22C
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Classification:
IPC: C22C Legierungen, ALLOYS -
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