Wafer grinding processing control method, device and system and readable storage medium (Chinese)
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- New search for: LI XIAOJU
- New search for: HE WEIMENG
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- New search for: FANG CUIYI
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2024
- Patent / Electronic Resource
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Title:Wafer grinding processing control method, device and system and readable storage medium
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Additional title:晶片的研磨加工控制方法、装置、系统及可读存储介质
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Patent number:CN117464550
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Patent applicant:
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Patent family:
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Contributors:LI XIAOJU ( author ) / HE WEIMENG ( author ) / CHEN YINGMEI ( author ) / FANG CUIYI ( author ) / LI BAIFENG ( author ) / HE HAO ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2024-01-30
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Chinese
- New search for: B24B
- Further information on International Patent Classification
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Classification:
IPC: B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING, Maschinen, Einrichtungen oder Verfahren zum Schleifen oder Polieren -
Source: