Substrate lifting mechanism (Chinese)
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2024
- Patent / Electronic Resource
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Title:Substrate lifting mechanism
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Additional title:基板提升机构
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Patent number:CN117542769
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Patent applicant:
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Patent family:
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Contributors:LI YAZHOU ( author ) / TAO ZEWEI ( author ) / WANG HE ( author ) / WANG JUN ( author ) / TAO XIAOFENG ( author ) / JIA SHENA ( author ) / HU HAIBO ( author ) / LIU YANG ( author ) / ZHANG XIAOYAN ( author ) / WANG HUI ( author )
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Publisher:
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Publication date:2024-02-09
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Chinese
- New search for: H01L
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: