Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies (English)
Free access
- New search for: MARTINEZ SERGIO V
- New search for: OGORZALEK JEFFREY R
- New search for: LOTT PATRICK J
- New search for: MARTINEZ SERGIO V
- New search for: OGORZALEK JEFFREY R
- New search for: LOTT PATRICK J
2021
- Patent / Electronic Resource
-
Title:Low cost approach for depositing solder and adhesives in a pattern for forming electronic assemblies
-
Patent number:US11033990
-
Patent applicant:
-
Patent family:
-
Contributors:
-
Publisher:
- New search for: Europäisches Patentamt
-
Publication date:2021-06-15
-
Type of media:Patent
-
Type of material:Electronic Resource
-
Language:English
- New search for: B23K / H05K
- Further information on International Patent Classification
-
Classification:
-
Source: