Low cost package warpage solution (English)
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- New search for: KARHADE OMKAR G
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- New search for: KARHADE OMKAR G
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2022
- Patent / Electronic Resource
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Title:Low cost package warpage solution
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Patent number:US11328937
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Patent applicant:
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Patent family:
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Contributors:KARHADE OMKAR G ( author ) / DESHPANDE NITIN A ( author ) / MALLIK DEBENDRA ( author ) / ZIADEH BASSAM M ( author ) / TOMITA YOSHIHIRO ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2022-05-10
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: H01L
- Further information on International Patent Classification
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: