SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE (English)
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2022
- Patent / Electronic Resource
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Title:SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE
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Patent number:US2022278039
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Patent applicant:
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Patent family:
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Contributors:SAITO MAI ( author ) / IWAYA AKIHIKO ( author ) / NAKAMURA YOKO ( author ) / ASAI TATSUHIKO ( author ) / GOHARA HIROMICHI ( author ) / WATAKABE TSUBASA ( author ) / SATO NARUMI ( author )
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Publisher:
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Publication date:2022-09-01
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
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Classification:
IPC: H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
Source: