Method of bonding two substrates and device manufactured thereby (English)
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2017
- Patent / Electronic Resource
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Title:Method of bonding two substrates and device manufactured thereby
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Patent number:US9573804
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Patent applicant:
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Patent family:
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Contributors:VAN 'T OEVER RONNY ( author ) / BLOM MARKO THEODOOR ( author ) / HANEVELD JEROEN ( author ) / OONK JOHANNES ( author ) / OLDE RIEKERINK MARINUS BERNARDUS ( author ) / TIJSSEN PETER ( author ) / TIGELAAR HENDRIK JAN HILDEBRAND ( author ) / FEHR JEAN-NOËL ( author ) / ROULET JEAN-CHRISTOPHE ( author ) / GUPTA AMITAVA ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2017-02-21
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: B81C / C23F / H01L
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Classification:
IPC: B81C Verfahren oder Geräte besonders ausgebildet zur Herstellung oder Behandlung von Mikrostrukturbauelementen oder -systemen, PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS / C23F Nichtmechanisches Entfernen metallischer Stoffe von Oberflächen, NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES / H01L Halbleiterbauelemente, SEMICONDUCTOR DEVICES -
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