Trends in insulating varnish today (English)
- New search for: Wroblewski, H. A.
- New search for: Moore, J. E.
- New search for: Wroblewski, H. A.
- New search for: Moore, J. E.
In:
1973 EIC 11th Electrical Insulation Conference
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44-46
;
1973
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ISBN:
- Conference paper / Electronic Resource
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Title:Trends in insulating varnish today
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Contributors:Wroblewski, H. A. ( author ) / Moore, J. E. ( author )
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Published in:
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Publisher:
- New search for: IEEE
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Publication date:1973-09-01
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Size:576677 byte
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ISBN:
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DOI:
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Type of media:Conference paper
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Front matter| 1973
- 1
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The struggle with nuclear power standardsSimmons, Alfred J. et al. | 1973
- 3
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Evaluation of radiation resistance of polymers for nuclear power plant applicationsCanady, Van L. et al. | 1973
- 6
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Characteristics of enameled wire under application of voltage when immersed in water or under humid conditionsNoguchi, Hiroshi / Tobita, Shuji et al. | 1973
- 9
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Material and cable design for nuclear power generating station installationsLaGase, F. E. / Armstrong, R. S. et al. | 1973
- 11
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Properties of various plural coated magnet wires for hermetic motorsOkubo, N. / Horikoshi, S. / Shirahata, I. et al. | 1973
- 15
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New ultra thin powder coating capabilitiesWolinski, Leon E. et al. | 1973
- 19
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Matching chemical and physical properties of powdered resins to electrostatic fluid bed application equipmentMeyer, Curt L. et al. | 1973
- 22
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A water soluble wire enamelHaughney, J. P. / Hurayt, G. et al. | 1973
- 24
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Fundamental aspects of a new electrodeposition insulating process "MEDIS"Shibayama, K. / Sato, F. / Ono, H. et al. | 1973
- 28
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A new magent wire manufacturing process based on electrodepositionShibayama, K. / Suzuki, T. / Hiraoka, Y. et al. | 1973
- 33
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New impregnating resinsRichon, George L. et al. | 1973
- 34
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Performance characteristics of improved solventless silicone resinsVanwert, Bernard / Ruth, Thomas E et al. | 1973
- 38
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Effect on physical properties of variations in a two-part epoxy resin systemKurz, Robert A. et al. | 1973
- 41
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New heat resistant “DP resin”Yokono, H. / Numata, S. / Mukai, J. / Muroi, T. et al. | 1973
- 44
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Trends in insulating varnish todayWroblewski, H. A. / Moore, J. E. et al. | 1973
- 47
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Material considerations for safety in consumer electronicsSanderson, Richard L. et al. | 1973
- 48
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New considerations in flammability testing of lead and hook-up wiresSpade, R. L. et al. | 1973
- 52
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250-45 to double insulationBogue, Richard et al. | 1973
- 54
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Insulating materials for double insulated power toolsChamy, Peter G. / Bednarski, Ted E. / Bennett, John L. et al. | 1973
- 56
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Material advancement economizes double insulated power toolsDeller, T. E. / Wilkinson, R. E. / Duncan, J. et al. | 1973
- 60
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Adaptation of a gas chromatographic method for analysis of effluent from manufacturing processesHutchinson, Royce L. et al. | 1973
- 64
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Environmental problems involved in the use of asbestos containing electrical insulationsFenner, Edmund M. et al. | 1973
- 67
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Determination of explosive hazard of gases generated during pyrolysis of motor stator encapsulantsDiliberti, J. / Tobin, J. F. et al. | 1973
- 70
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International development in insulation system characterizationKelen, Andreas / Mahon, Laurence P. / Reymers, Howard E. et al. | 1973
- 72
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Evaluation of laminates for high temperature electrical/mechanical applicationsSeidler, Lawrence E. et al. | 1973
- 76
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A modified method of testing thermal endurance of winding wiresSteinhaus, Rudolf R. et al. | 1973
- 79
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Thermal stability of magnet wire evaluated by viscoelastic behaviorMasuda, Shigeo / Asano, Nobuyuki et al. | 1973
- 83
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The process of resin rich insulating materials for use in high voltage rotating machinesNeal, J. E. / Scarlett, E. et al. | 1973
- 87
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A new method for obtaining the thermal conductivity of electrical insulationKultzow, Robert J. et al. | 1973
- 90
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Development of new mica paper epoxy insulation systems for high voltage rotating machinesHirabayashi, S. / Shibayama, K. / Matsuda, S. / Ito, S. et al. | 1973
- 92
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Air gap winding for superconducting electrical machinerySterrett, C. C. / Haller, H. E. / Lauroesch, Hugo C. / Lonseth, Palmer et al. | 1973
- 95
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Reliability testing of aluminum magnet wire connections for hermetic motorsSpears, Jerry L. et al. | 1973
- 99
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Some evaluations of hermetic motor insulation systemsTokunaga, T. / Isogai, T. / Kurokawa, S. et al. | 1973
- 102
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Correlation of properties of polyethylene terephthalate with aging in refrigerantsKohne, John A. et al. | 1973
- 105
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Improving the quality of dual coat amide imide/polyester wire by using the dissipation factor as a bake indicatorMol, Evert A. et al. | 1973
- 109
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History and progress of IEEE hermetic subcommitteeEmmons, Harold L. et al. | 1973
- 110
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The new insulation system TOSTIGHT∗ II for high voltage induction motorsMitsui, H. / Yamamoto, M. / Huruhata, S. et al. | 1973
- 114
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Vacuum pressure impregnation: The key to void-free coil insulationRolshouse, Bill / Arndt, Dana et al. | 1973
- 117
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Extension of the post impregnation concept to high voltage windingsStabile, S. J. et al. | 1973
- 122
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Commutator design for commutator fusingWarner, Allan et al. | 1973
- 126
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Comparison of the effect of varnish treatment processes on the moisture resistance of electrical insulation systems for random wound motorsFlaherty, R. J. / Kimball, J. A. / Tobin, J. F. et al. | 1973
- 131
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EPDM for molded electrical connectors and accessoriesSpenadel, L. / Murphy, J. J. et al. | 1973
- 134
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Evaluation of a molded splicing systemTaj, Hatim H. et al. | 1973
- 137
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Tree initiation in polyethyleneNoto, Fumitoshi / Yoshimura, Noboru et al. | 1973
- 141
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Cast urethane insulatorsDelmonte, John / Norring, W. D. et al. | 1973
- 144
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A new approach to the evaluation of organic insulating materials for service in polluted conditionsTonnesen, Ole et al. | 1973
- 149
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Test methods useful in selecting materials for outdoor high voltage insulationNiemi, R. G. / Orbeck, T. et al. | 1973
- 153
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A contribution to the study of aging of cable insulating materialsGouldson, E. J. / Gahir, A. S. / Kurtz, M. et al. | 1973
- 157
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Outdoor insulator surface conductance and surface arcingDakin, T. W. / Mullen, G. A. / Chenoweth, T. E. / Dodds, J. J. et al. | 1973
- 162
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Indoor and outdoor transformer insulation systemsPendleton, W. W. / Bimbiris, Alfons et al. | 1973
- 167
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A portable liquid power factor instrumentSambhu, M. K. et al. | 1973
- 170
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Insulation resistance measurements at low frequenciesBartnikas, R. / Spielvogel, R. et al. | 1973
- 172
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Methods for evaluating new dielectric liquids for use in high voltage electrical equipmentBurow, R. F. / Vincent, G. A. / Brooks, W. T. et al. | 1973
- 175
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The use of the oxygen electrode for determining the susceptibility of liquid dielectrics to biodegradeNeely, W. B. / Litchfield, N. / Blau, G. / Hamilton, E. C. et al. | 1973
- 178
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Safety aspects of high voltage power line fault location techniquesReynolds, P. H. / Dyner, B. L. et al. | 1973
- 181
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Electrical insulation aspects of compressed gas cablesDoepken, Herbert C. / Bolin, Philip C. et al. | 1973
- 183
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Stress grading in extruded cablesSingh, N. / Bruhin, A. C. et al. | 1973
- 185
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Development of field molded splices for ethylene-propylene rubber and crosslinked polyethylene insulated cablesNelson, A. L. / Mcavoy, F. M. et al. | 1973
- 188
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Non-conventional power transmission systemsWeeks, W. L. et al. | 1973
- 192
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Micropackaging of electronic circuitsMcdonald, R. D. et al. | 1973
- 194
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Leadless packaging challenges the traditional dipGrossman, Stephen E. et al. | 1973
- 197
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On the temperature response of semiconductor devicesBaxter, Gene K. et al. | 1973
- 201
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Flexible beam-leaded substratesBachner, Frank J. et al. | 1973
- 202
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Miniature explosive bonding for electrical interconnectionsCranston, B. H. et al. | 1973
- 205
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Flexible advanced packagingPerrino, F. A. et al. | 1973
- 206
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New laminates for printed circuit boardsYanagihara, Kohtaro / Sugie, Soji / Gaku, Morio et al. | 1973
- 208
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Thermal characterization of multilayer printed wiring boards during laminationEngelmaier, Werner et al. | 1973
- 211
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Prediction of multilayer printed wiring board temperatures during laminationAung, W. et al. | 1973
- 215
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Kerimid 601 polyimide resin for multilayer printed wiring boardsDarmory, F. P. et al. | 1973
- 217
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Comparative testing and evaluation of conformal, coating materials and processesWorthington, D. Gene et al. | 1973
- 223
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New silicone elastoplastic coating for electronic applicationsWaterman, W. R. et al. | 1973
- 225
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Sources of error in drilling printed circuit laminatesMcKeon, L. R. / Reynolds, M. J. / Speicher, C. G. et al. | 1973
- 228
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Voltage breakdown of fineline flexible printed wiringRainal, A. J. / Landry, E. F. / Lahti, J. N. et al. | 1973
- 231
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Characterization of Kapton® polyimide film for use in flexible circuitryKreuz, John A. et al. | 1973
- 234
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Reliability considerations of multilayer printed circuit boardsMcCormick, John E. / Rigling, Walter S. et al. | 1973
- 236
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Panels and pins, production and perfection (The AMP "select solder" approach)Cobaugh, R. / Coller, J. et al. | 1973
- 240
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Plated pin surface evaluationGetten, J. R. / Vanvestrout, V. D. et al. | 1973
- 242
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Reflow soldering of circuits on heat sensitive materialsSchoenthaler, D. / Pfahl, R. C. et al. | 1973
- 245
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Electrical performance of pin-connected stacked backplanesKnausenberger, W. H. et al. | 1973
- 248
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Cabling for high speed circuitsMoulton, R. Kirk et al. | 1973
- 251
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User's view of some newer insulation materialsSinclair, William Y. et al. | 1973
- 253
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Fatigue life of flexible printed studies: Selected studiesVan Dover, L. K. / Lindfors, J. F. et al. | 1973
- 257
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Sand-bath and thermal-shock testing of plated-through-holesModlo, Robert J. et al. | 1973
- 258
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Selecting microwave stripline laminatesWorboys, David C. et al. | 1973
- 260
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Microstrip tantalum resistors deposited through electron beam techniquesKonsowski, S. G. / Hall, R. D. et al. | 1973
- 262
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Effects of variations in alumina substrates on dielectric constant at microwave frequenciesBailey, J. T. / Gaddy, J. H. / Getsinger, W. J. / Olyphant, M. / Kawada, Jun-Ichiro / Sugie, Soji et al. | 1973
- 263
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Conditioning and packaging factors in stripline performanceOlyphant, M. et al. | 1973
- 266
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Metallizing microwave stripline substrates in high performance crossed-field amplifiersAng, C. / Mills, G. J. / Isenberg, S. F. et al. | 1973
- 269
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Round-robin correlation testing of an X-band dielectric constant and dissipation factor test methodVan Dover, L. K. Monty et al. | 1973
- 271
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Laser cut microwave thin film circuitsMino, T. D. / Oberholzer, D. J. / Strittmatter, C. A. et al. | 1973
- 274
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Beryllium oxide is cost effectiveFleischner, P. L. et al. | 1973
- 278
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A constant index lens for integrated digital electronicsTurner, E. M. / Bogner, Bruce F. et al. | 1973
- 281
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Microstrip phased array antennasMunson, Robert et al. | 1973
- 284
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Cost-effective and reliable hybrid circuit assemblyJackson, C. Roger et al. | 1973
- 286
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Microwave stripline packaging using conductive epoxyHartman, J. A. / Palermo, C. A. et al. | 1973
- 289
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ARC plasma technology for electronic devicesBabbitt, R. W. / Harris, D. H. / Janowiecki, R. J. / Wilson, M. C. / Chang, J. T. / Bolger, Justin C. et al. | 1973
- 292
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Flow test for electronic foam encapsulantsJohnson, L. I. / Ryan, R. J. et al. | 1973
- 295
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Skylab high voltage systems corona assessmentDunbar, William G. et al. | 1973
- 298
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Evaluation of potting compounds by electrical resistivity techniquesLequin, Doris S. et al. | 1973
- 301
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TPRTM thermoplastic rubber in wire and cable applicationsAllen, Kenneth R. et al. | 1973
- 304
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Lightweight electronic harness wireRead, John G. et al. | 1973
- 306
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An electronic systems viewpoint of the automobile environmentMcCarter, O. T. et al. | 1973
- 314
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Automated ground transport systems: Some observed materials problemsMayhan, Robert J. / Fenton, Robert E. / Olson, Karl W. et al. | 1973
- 317
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The computerized car in 1979: Supplying the demandCohen, Philip L. et al. | 1973
- 319
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A microwave automatic vehicle identification systemStaras, H. / Klensch, R. J. / Rosen, J. et al. | 1973
- 320
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Parylene thin films dielectricsJayne, W. M. / Lee, S. M. et al. | 1973
- 324
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Holographic evaluation of electronic circuits using photochrome filmsLo, D. S. et al. | 1973
- 326
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Electrophoretic deposition as applied to ground planes and other electrical hardwarePresti, Frank P. / Damm, E. P. et al. | 1973
- 330
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Effective use of epoxy adhesives in microelectronicZimmerman, D. D. et al. | 1973
- 333
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Some aspects of adhesive-induced corrosion in electronic devicesDahringer, D. W. et al. | 1973
- 336
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Epoxy device bonding and die handling techniques for hybrid microcircuitsKimball, Jay et al. | 1973
- 337
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Weaknesses in a strong film adhesiveBurkett, Frank S. et al. | 1973
- 338
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Optimizing a chip adhesiveKraus, Herbert S. et al. | 1973
- 341
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Partial discharge (corona) detection in electronic systemsReynolds, P. H. / Saile, C. J. et al. | 1973
- 344
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Broadband measurements on materials using time domain metrologyNicolson, A. M. et al. | 1973
- 347
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Fingerprinting resin cure with dielectric analysisOnufer, Robert J. / Yalof, Stanley A. et al. | 1973
- 350
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Rapid measurements of the insulation resistance of capacitorsTait, D. A. G. / Reynolds, P. H. et al. | 1973
- 354
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Dielectric measurements on liquid resins and curing agents from 10 to 200 MHzSnell, John B. / Olyphant, Murray et al. | 1973
- 357
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Seed™, shield effectiveness evaluation deviceMiller, Paul et al. | 1973
- vii
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Table of contents| 1973