CAFM detection of resistive tungsten contacts in DRAM devices (English)
- New search for: Ng, E.
- New search for: Lam, D.
- New search for: Zheng, X.
- New search for: Ng, E.
- New search for: Lam, D.
- New search for: Zheng, X.
In:
2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits
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1-4
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2008
- Conference paper / Electronic Resource
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Title:CAFM detection of resistive tungsten contacts in DRAM devices
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Contributors:
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Published in:
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Publisher:
- New search for: IEEE
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Publication date:2008-07-01
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Size:1253945 byte
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ISBN:
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DOI:
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Type of media:Conference paper
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Humidity-induced semiconductor device electrical reliability failures: Mechanism and wafer-level risk evaluation/ electrical screening-test proposalJacob, P. / Nicoletti, G. et al. | 2008
- 1
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Investigation on the mechanism of the leakage failure between poly gate and contact in subnano technologyWang, Q.F. / Toh, S.L. / Deng, Q. / Tan, P.K. / Li, K. / Teong, J. / Mai, Z.H. / Lam, J. et al. | 2008
- 1
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Backside GMR Magnetic Microscopy for flip chip and related microelectronic devicesHechtl, M. et al. | 2008
- 1
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A novel pseudo tri-gate vertical MOSFET with source/drain tieJyi-Tsong Lin, / Ying-Chieh Tsai, / Yi-Chuen Eng, / Shiang-Shi Kang, / Yi-Ming Tseng, / Hung-Jen Tseng, / Po-Hsieh Lin, et al. | 2008
- 1
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DIBL in short-channel strained-Si n-MOSFETMahato, S. S. / Chakraborty, P. / Maiti, T. K. / Bera, M. K. / Mahata, C. / Sengupta, M. / Chakraborty, A. / Sarkar, S. K. / Maiti, C. K. et al. | 2008
- 1
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New models for interconnect failure in advanced IC technologyLloyd, J.R. et al. | 2008
- 1
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Studies and applications of standardless EDX quantification method in failure analysis of wafer fabricationHua Younan, / Liu Binghai, / Mo Zhiqiang, / Teong, Jennifer et al. | 2008
- 1
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The device characteristics of partially undoped poly-silicon gate P-LDMOS power transistorsSu, R.Y. / Chiang, P.Y. / Gong, J. / Tsai, J.L. / Huang, T.Y. / Mingo Liu, / Choub, C.C. et al. | 2008
- 1
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Using line-length effects to optimize circuit-level reliabilityThompson, C.V. et al. | 2008
- 1
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Statistical modeling of via redundancy effects on interconnect reliabilityRaghavan, Nagarajan / Cher Ming Tan, et al. | 2008
- 1
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Trapping and de-trapping characteristics in PBTI and dynamic PBTI between HfO2 and HfSiON gate dielectricsWei-Liang Lin, / Yao-Jen Lee, / Wen-Cheng Lo, / King-Sheng Chen, / Hou, Y. T. / Lin, K. C. / Tien-Sheng Chao, et al. | 2008
- 1
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Nanoanalysis of high-k dielectrics on semiconductorsCraven, A. J. / MacKenzie, M. / McComb, D.W. et al. | 2008
- 1
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Failure site isolation on passive RFID tagsSood, Bhanu / Das, Diganta / Azarian, Michael / Pecht, Michael / Bolton, Brian / Lin, Tingyu et al. | 2008
- 1
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TCAD solutions for submicron copper interconnectCeric, H. / de Orio, R. L. / Cervenka, J. / Selberherr, S. et al. | 2008
- 1
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Raman-IR micro-thermography tool for reliability and failure analysis of electronic devicesSarua, A. / Pomeroy, J. / Kuball, M. / Falk, A. / Albright, G. / Uren, M. J. / Martin, T. et al. | 2008
- 1
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Advanced localization technique of failures in packages / IO-stages of chips using Vector Network AnalyserKrueger, Bernd / Pohl, Helmut / Schumann, Fritz / Schoemann, Stephan et al. | 2008
- 1
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Case study of copper dendrite growth under HAST testSang-Ah Kim, / Do-Seok Ahn, / Yong-Hui Eum, / Duck-Hyun Kim, / Young-Bae Kim, et al. | 2008
- 1
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Au nanocrystal flash memory reliability and failure analysisSingh, Pawan K. / Singh, Kaushal K. / Hofmann, Ralf / Armstrong, Karl / Krishna, Nety / Mahapatra, Souvik et al. | 2008
- 1
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A novel ESD device structure with fully silicide process for mixed high/low voltage operationJian-Hsing Lee, / Shih, J.R. / Dao-Hong Yang, / Chen, Jone F. / Wu, Kenneth et al. | 2008
- 1
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Lid adhesive failure study for flip chip packagingOng, M. C. / Zhao, X. L. / Joman, P. P. / Chin, J. M. / Master, Raj N. et al. | 2008
- 1
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CAFM detection of resistive tungsten contacts in DRAM devicesNg, E. / Lam, D. / Zheng, X. et al. | 2008
- 1
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Gate oxide integrity failure caused by molybdenum contamination introduced in the ion implantationGui, D. / Huang, Y.H. / Ang, G.B. / Xing, Z.X. / Mo, Z.Q. / Hua, Y.N. / Teong, J. et al. | 2008
- 1
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Trends and requirements of future high-performance CMOSKhakifirooz, Ali / Antoniadis, Dimitri A. et al. | 2008
- 1
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Device-level fault isolation of advanced flip-chip devices using scanning SQUID microscopyTeo, C.W. / Lwin, H.E. / Narang, V. / Chin, J.M. et al. | 2008
- 1
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Application of conductive atomic force microscopy to study the in-line electrical defectsToh, S.L. / Deng, Q. / Tang, W.T. / Lim, V. / Gn, F.H. / Tan, P.K. / Tan, H. / Mai, Z.H. / Lam, J. et al. | 2008
- 1
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Review of reliability issues in high-k/metal gate stacksDegraeve, R. / Aoulaiche, M. / Kaczer, B. / Roussel, Ph. / Kauerauf, T. / Sahhaf, S. / Groeseneken, G. et al. | 2008
- 1
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Scale, function and materials: debug and diagnosis in electronic device technology roadmapBoit, C. et al. | 2008
- 1
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Test structure failed node localization and analysis from die backsideLi, Y. G. / Tan, S. H. / Sun, W. R. et al. | 2008
- 1
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Influence of hydrogen annealing on NBTI performanceJin, L. J. / Kuan, H. P. / Sim, D. / Mukhopadhyay, M. et al. | 2008
- 1
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The effect of band gap engineering of the nitride storage node on performance and reliability of charge trap flashSandhya, C. / Ganguly, U. / Singh, K.K. / Olsen, C. / Seutter, S. M. / Conti, G. / Ahmed, K. / Krishna, N. / Vasi, J. / Mahapatra, S. et al. | 2008
- 1
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A rigorous model for trapping and detrapping in thin gate dielectricsGoes, Wolfgang / Karner, Markus / Sverdlov, Viktor / Grasser, Tibor et al. | 2008
- 1
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Tool cleanliness characterization for improving productivity and yieldsChia, Victor K.F. et al. | 2008
- 1
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Degradation of metal-induced laterally crystallized n-type poly-Si thin-film transistors under dynamic voltage stressZhang, Meng / Wang, Mingxiang / Wang, Huaisheng et al. | 2008
- 1
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Application of FIB circuit edit combined with TIVA in advanced failure analysisZhu, David / Neo, S.P. / Loh, S. K / Er, Eddie et al. | 2008
- 1
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A case study on different test screening techniques for ICS with high resistance vias interconnects issuesSim, D. / Tan, Y.C. / Low, F. / Foo, E.G. et al. | 2008
- 1
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Conductive Atomic Force Microscopy failure analysis for SOI devicesLim Soon-Huat, / Zheng Xinhua, / Chea-Wei, Teo / Narang, Vinod / Beng Hock, Teo / Chin, J.M. et al. | 2008
- 1
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Failure analysis of 65nm technology node SRAM soft failureChen changqing, / Er, Eddie / Neo, Soh Ping / Loh Sock Khim, / Wang Qingxiao, / Teong, Jennifer et al. | 2008
- 1
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The impact of gate dielectric nitridation methodology on NBTI of SiON p-MOSFETs as studied by UF-OTF techniqueMaheta, V. D. / Olsen, C. / Ahmed, K. / Mahapatra, S. et al. | 2008
- 1
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A new TDDB lifetime bi-model for eDRAM MIM capacitor with ZrO2 high-k dielectricsChang, S.W. / Chia Lin Chen, / Wang, C.J. / Wu, Kenneth et al. | 2008
- 1
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Scan-based ATPG diagnostic and optical techniques combination: A new approach to improve accuracy of defect isolation in functional logic failureMachouat, A. / Haller, G. / Goubier, V. / Lewis, D. / Pouget, V. / Fouillat, P. / Essely, F. / Perdu, P. et al. | 2008
- 1
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An application of C-AFM as a tool for SRAM soft single-column failure analysis in advanced HV technologiesHung-Sung Lin, / Mong-Sheng Wu, / Yun-Ming Tsou, et al. | 2008
- 1
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Early whisker detection through intermetallic compound (IMC) grain sizeTan, Y. Y. / On, Dinah / Krishnan, J. et al. | 2008
- 1
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IMC growth and DR4 open on TSOP packageWu Caihong, / Lam Tim Fai, / Song Xianzhong, / Chen Bin, / Sun Mingxia, / Wang Xiangru, et al. | 2008
- 1
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Near-infrared spectroscopic photon emission microscopy of 0.13 μm silicon nMOSFETs and pMOSFETsTan, S.L. / Teo, J.K.J. / Toh, K.H. / Isakov, D. / Chan, D.S.H. / Koh, L.S. / Chua, C.M. / Phang, J.C.H. et al. | 2008
- 1
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Stress-induced degradation in strain-engineered nMOSFETsMaiti, T. K. / Mahato, S. S. / Bera, M. K. / Sengupta, M. / Chakraborty, P. / Mahata, C. / Chakraborty, A. / Maiti, C. K. et al. | 2008
- 1
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Reliability of ZrO2/GeOxNy stacked high-k dielectrics on Ge under dynamic and pulsed voltage stressMahata, C. / Bera, M. K. / Bose, P.K. / Chakraborty, A. / SenGupta, M. / Maiti, C. K. et al. | 2008
- 1
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Understanding Soft Defect Localization set-points for reducing cause-not-founds in integrated circuitsRavikumar, V.K. / Phoa, S.L. / Narang, V. / Chin, J.M. et al. | 2008
- 1
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Interfacial characterization of ultra low-k film (kappa=2.55) with time of flight secondary ion mass spectrometry (TOF-SIMS)Widodo, J. / Xing, Z. X. / Mo, Z. Q. / Ouyang, T. / Gui, D. / Hua, Y.N. / Liu, H. / Lu, W. et al. | 2008
- 1
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Current-induced breakdown of carbon nanofiber interconnectsHirohiko Kitsuki, / Tsutomu Saito, / Toshishige Yamada, / Drazen Fabris, / Wilhite, Patrick / Makoto Suzuki, / Yang, Cary Y. et al. | 2008
- 1
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Effect of Refractive Solid Immersion Lens parameters on the enhancement of laser induced fault localization techniquesGoh, S.H. / Quah, A.C.T. / Sheppard, C.J.R. / Chua, C.M. / Koh, L.S. / Phang, J.C.H. et al. | 2008
- 1
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Optimization on SCR device with low capacitance for on-chip ESD protection in UWB RF circuitsChun-Yu Lin, / Ming-Dou Ker, et al. | 2008
- 1
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Effects of pulsed current on electromigration lifetimeLim, M. K. / Gan, C. L. / Tan, T. L. / Ee, Y. C. / Ng, C. M. / Zhang, B. C. / Tan, J. B. et al. | 2008
- 1
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Investigation of soft fail issue in sub-nanometer devices using nanoprobing techniqueHendarto, E. / Lin, H.B. / Toh, S.L. / Tan, P.K. / Goh, Y.W. / Mai, Z.H. / Lam, J. et al. | 2008
- 1
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Chemical and physical characterization techniques in highlighting intermetallic compound (IMC) formationFernandez, Jean Carla M. et al. | 2008
- 1
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Simulation of the multi-source/drain SOI MOSFETPo-Hsieh Lin, / Shiang-Shi Kang, / Jyi-Tsong Lin, / Yi-Chuen Eng, et al. | 2008
- 1
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Trends in solar cell researchMertens, R. et al. | 2008
- 1
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Solderability and reliability of printed electronicsSalam, B. / Lok, B.K. et al. | 2008
- 1
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IPFA 2008 table of contents| 2008
- 1
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Advance packaging requirements for next generation microprocessorsMaster, Raj et al. | 2008
- 1
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Time resolved determination of electrical field distributions within dynamically biased power devices by spectral EBIC investigationsPugatschow, A. / Heiderhoff, R. / Balk, L.J. et al. | 2008
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A simple method for TEM sample preparation without carbon film backgroundMeng-Lung Lee, / Ren-De Lin, et al. | 2008
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A novel dual-BBHH erasing scheme to improve endurance and retention performances for localized charge trapping memoriesShi, Guangjian / Pan, Liyang / Ritzenthaler, Romain / Sun, Lei / Zhigang Zhang, / Xu, Jun et al. | 2008
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Failure analysis matrix of light emitting diodes for general lighting applicationsNam Hwang, et al. | 2008
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Effect of bonding pressure on the bond strengths of low temperature Ag-In bondsMade, Riko I. / Chee Lip Gan, / Chengkuo Lee, / LilingYan, / Aibin Yu, / Seung Wook Yoon, et al. | 2008
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IC package inspection with nanofocus X-ray tubes and nanoCTRoth, Holger / Zhenhui He, / Paul, Thomas et al. | 2008
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EMMI analysis on silicon solar cellYeh, Benjamin / Huang, Russell / Chung, Kevin / Chang, Alan / Chih-Hsun Chu, et al. | 2008
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Characterization and modeling of program/erase induced device degradation in 2T-FNFN-NOR flash memoriesGuoqiao Tao, / Chauveau, Helene / Boter, Dick / van der Vegt, Erik / Dormans, Do / Verhaar, Rob et al. | 2008
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Etching of copper in deionized water rinseGambino, J. / Robbins, J. / Rutkowski, T. / Johnson, C. / DeVries, K. / Rath, D. / Vereecken, P. / Walton, E. / Porth, B. / Wenner, M et al. | 2008
- 1
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Hot carrier degradation in nanowire (NW) FinFETsMaiti, T. K. / Bera, M. K. / Mahato, S. S. / Chakraborty, P. / Mahata, C. / Sengupta, M. / Chakraborty, A. / Maiti, C. K. et al. | 2008
- 1
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Failure analysis enhancement by evaluating the Thermal Laser Stimulation impact on analog ICsSienkiewicz, Magdalena / Perdu, Philippe / Firiti, Abdellatif / Crepel, Olivier / Lewis, Dean et al. | 2008
- 1
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The helium ion microscope for high resolution imaging, materials analysis and FA applicationsThompson, William B. / Notte, John / Scipioni, Larry / Stern, Lewis et al. | 2008
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Reliability of Cu pillar bump for flip chip and 3-D SiPByoung-Joon Kim, / Gi-Tae Lim, / Jaedong Kim, / Kiwook Lee, / Young-Bae Park, / Young-Chang Joo, et al. | 2008
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Improved image processing to enhance thermal laser stimulation signalDeyine-Barth, A. / Sanchez, K. / Perdu, P. / Beaudoin, F. / Benetti, G. / Dudit, S. / Lewis, D. et al. | 2008
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Study on SRAM soft failure using planar-view transmission electron microscopy techniquesLiu, P. / Li, K. / Li, Y. / Chen, C.Q. / Er, E. / Teong, J. et al. | 2008
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A study of NBTI in HfSiON/TiN p-MOSFETs using ultra-fast on-the-fly (UF-OTF) IDLIN techniqueDeora, Shweta / Mahapatra, Souvik et al. | 2008
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