Embedded heat pipes as thermal solution for PCBs (English)
- New search for: de Sousa, J. Silvano
- New search for: Fulmek, P. L.
- New search for: Unger, M.
- New search for: Haumer, P.
- New search for: Nicolics, J.
- New search for: de Sousa, J. Silvano
- New search for: Fulmek, P. L.
- New search for: Unger, M.
- New search for: Haumer, P.
- New search for: Nicolics, J.
In:
2017 International Conference on Electronics Packaging (ICEP)
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394-398
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2017
- Conference paper / Electronic Resource
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Title:Embedded heat pipes as thermal solution for PCBs
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Contributors:de Sousa, J. Silvano ( author ) / Fulmek, P. L. ( author ) / Unger, M. ( author ) / Haumer, P. ( author ) / Nicolics, J. ( author )
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Published in:
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Publisher:
- New search for: IEEE
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Publication date:2017-04-01
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Size:696567 byte
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ISBN:
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DOI:
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Type of media:Conference paper
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Welcome to ICEP 2017| 2017
- 1
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Copyright page| 2017
- 1
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Cover page| 2017
- 1
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Partner organizations| 2017
- 1
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Table of contents| 2017
- 1
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Printed electronics and additive packaging for microwave applicationsArmiento, Craig / Trulli, Susan / Akyurtlu, Alkim / Harper, Elicia / Haghzadeh, Mahdi / Laighton, Christopher et al. | 2017
- 1
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Organizing committee| 2017
- 3
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The next generation EDA system for 3D printing technologiesKariya, Kazuhiro et al. | 2017
- 5
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Functional inkjet 3D printing system for customized electronicsTsukada, Kenji / Kawajiri, Akihiro / Hashimoto, Yoshitaka / Makihara, Katsuaki / Tominaga, Ryojiro / Fujita, Masatoshi / Sato, Takeshi et al. | 2017
- 7
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Reliability assessment using modified energy based model for WLCSP solder jointsTsou, C. Y. / Chang, T. N / Wu, K. C. / Wu, P. L. / Chiang, K.N. et al. | 2017
- 16
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Innovated ultra-thin and super fine-pitch panel RDL substrate manufacturing for advanced packageChen, Yu-Hua / Lin, Puru Bruce / Ko, Cheng-Ta / Tseng, Tzyy-Jang et al. | 2017
- 19
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Low temperature interconnect fabrication using submicron/nano metallic particlesSong, Jenn-Ming / Cheng, Chi-Nan / Huang, Guo-Lun et al. | 2017
- 23
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Fine line fan out package on panel levelFann, Daniel / Fang, David / Chiang, Jeffery / Huang, Kevin et al. | 2017
- 26
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Preparation and properties of passivation film layers spray coated flexible Cu(In, Ga)Se2 solar cellsLee, Sang Hee / Park, Byung Min / Kim, Hyun Sik / Chang, Ho Jung et al. | 2017
- 28
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Formation of through-silicon-vias by Tin filling processes using pressure infiltration and electrodeposition/reflowPark, Donghyun / Kim, Jae-Hwan / Oh, Tae Sung et al. | 2017
- 30
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Effects of ultrasonic process on the adhesion of Cu/non-conductive PCB substrate in electroless copper platingKang, Ju-Suk / Lee, Jinuk / Kwon, Hyun-Woo / Lee, Jae-Ho et al. | 2017
- 33
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Electroplating for the Ni probe tipKim, Nam Gil / Sun, Yong-Bin et al. | 2017
- 35
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Technology roadmap overviews and future direction through technology gapsRichardson, Chuck / Tsuriya, Masahiro / Fu, Haley et al. | 2017
- 41
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Relative humidity dependence of creep corrosion on printed circuit boardsSingh, Prabjit / Palmer, Larry / Lee, Dem / Lee, Jeffrey / Guo, Karlos / Liu, Julie / Lee, Simon / Tong, Geoffrey / Xu, Chen / Fleming, Debbie et al. | 2017
- 47
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Inspection/metrology benchmarking on fine pitch design substrate for advanced packagesXue, Feng / Watanabe, Hiroyuki / Han, Cindy / Reynolds, Charles / Wassick, Thomas / Pomerantz, Glenn / Tsuriya, Masahiro et al. | 2017
- 51
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High-temperature Pb-free die attach material project phase 1: Survey resultPei, Lim Sze / Pan, Binghua / Zhang, Hongwen / Ng, Wayne / Wu, Bosgum / Siow, Kim S. / Sabne, Sayalee / Tsuriya, Masahiro et al. | 2017
- 57
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Low temperature direct Cu bonding for MEMS packagingSong, Jenn-Ming / Liang, Sin-Yong / Chiang, Po-Hao / Huang, Shang-Kun / Chiu, Ying-Ta / Tarng, David / Hung, Chih-Pin / Lin, Jing-Yuan et al. | 2017
- 61
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Solder joint reliability analysis for large size WLCSPShih, Meng-Kai / Shih, Hsin-Chih / Lee, Ying-Chih / Tamg, David / Hung, C P et al. | 2017
- 66
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Parameters study of thermomechanical reliability of board-level fan-out packageShih, Meng-Kai / Lee, Ying-Chih / Chen, Ryan / Tarng, David / Hung, C P et al. | 2017
- 76
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Innovative laser enabled dual damascene process for ultra-fine line multi-layer routing for advanced packagingHichri, Habib / Lee, Seongkuk / Arendt, Markus et al. | 2017
- 82
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Study of influence of mechanical property of temporary bonding adhesive on warpage of FO-WLPNishido, K. / Hamaguchi, K. / Takekoshi, M. / Suzuki, N. / Nonaka, T. et al. | 2017
- 86
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Effects of external bending stress on device-embedded substrateMiyama, Katsumi / Katoh, Yoshihisa et al. | 2017
- 90
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Silver sinter joining for WBG die-attachSuganuma, Katsuaki / Nagao, Shijo / Sugahara, Toru / Zhang, Hao / Chen, Chuantong / Ishina, Toshiyuki / Jiu, Jinting et al. | 2017
- 94
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Laserbonding instead of ultrasonic wire bonding — An alternative joining technology for power applicationsSedlmair, Josef / Mehlmann, Benjamin / Olowinsky, Alexander et al. | 2017
- 97
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First failure point of a SiC power module with sintered Ag die-attach on reliability testsSugiura, Kazuhiko / Iwashige, Tomohito / Tsuruta, Kazuhiro / Chen, Chuantong / Nagao, Shijo / Zhang, Hao / Sugahara, Tohru / Suganuma, Katsuaki et al. | 2017
- 101
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High temperature SiC power device realized by electroless plating diffusion barrier for Ag sinter die-attachSeki, S. / Shimoyama, A. / Zhang, H. / Kurosaka, S. / Sugioka, T. / Fujita, H. / Yamamura, K. / Muramatsu, T. / Sugahara, T. / Nagao, S. et al. | 2017
- 106
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Reliability of POL-kw power modulesYin, Liang / Nagarkar, Kaustubh / Gowda, Arun / Kapusta, Christopher / Tuominen, Risto / Gillespie, Paul / Sherman, Donna / Johnson, Tammy / Hayashibe, Shingo / Ito, Hitoshi et al. | 2017
- 112
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Packaging IGBT modules by rapid sintering of nanosilver paste in a current wayXie, Yijing / Mei, Yunhui / Feng, Shuangtao / Zhang, Pu / Zhang, Long / Yang, Yingkun et al. | 2017
- 117
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Packaging technology of power module for automotive applicationsShimozuma, Ayako / Hayashi, Hiromasa / Higuchi, Shingo / Sakamoto, Yoshitsugu / Okada, Sakie et al. | 2017
- 122
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Microstructural homogeneity of sintered Ag joint after pressureless sintering processZhang, Hao / Chen, Chuantong / Jiu, Jinting / Nagao, Shijo / Suganuma, Katsuaki et al. | 2017
- 125
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Thermal resistance evaluation of die-attachment made of nano-composite Cu/Sn TLPS paste in SiC power moduleKato, Fumiki / Lang, Fengqun / Nakagawa, Hiroshi / Yamaguchi, Hiroshi / Kimura, Ryuuji / Okada, Keiji / Shindo, Hiroaki / Ooi, Tatsuya / Tamaki, Rei / Sekine, Shigenobu et al. | 2017
- 130
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Effect of size and shape of Ag particles for mechanical properties of sintered Ag joints evaluated by micro-compression testChen, Chuantong / Nagao, Shijo / Sugahara, Tohru / Zhang, Hao / Jiu, Jinting / Suganuma, Katsuaki / Iwashige, Tomohito / Sugiura, Kazuhiko / Tsuruta, Kazuhiro et al. | 2017
- 135
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Study of influence of under-fill matetrial properties on the reliability of FC-BGAHamaguchi, Kouji / Takahashi, Hisato / Suzuki, Naoya et al. | 2017
- 139
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An investigation on ultrathin wafer dicing by ultrafast laser with high density plasma etchingWu, Shih-jeh / Hsu, Hsiang-Chen / Lin, Wen-Fei / Fu, Shen-Li et al. | 2017
- 144
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Real time X-ray imaging of soldering processes at the SPring-8 synchrotronNogita, K. / Salleh, M. A. A. Mohd / Zeng, G. / McDonald, S. D. / Gourlay, C. / Yasuda, H. et al. | 2017
- 148
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Fabrication of self-standing curved film with pillar arrays by large area spherical soft-UV imprint lithographyKamibayashi, T. / Kuwae, H. / Nobori, A. / Shoji, S. / Mizuno, J. et al. | 2017
- 152
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Fine pitch plating resist for high density FO-WLPKatsurayama, Makoto / Ito, Hirokazu / Akimaru, Hisanori / Matsumoto, Tomoyuki / Sakakibara, Hirokazu / Okamoto, Kenji / Hasegawa, Koichi et al. | 2017
- 156
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Corundum-strructured α-Ga2O3-based alloys for future power device applicationsKaneko, Kentaro / Oda, Masaya / Hitora, Toshimi / Fujita, Shizuo et al. | 2017
- 158
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Electroless Ni-P plating applicable to fine patternSeto, Hiroki / Murata, Toshiya et al. | 2017
- 162
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The study of Nano anchoring copper foil for PWBSato, Makiko / Obata, Naoki / Kokaji, Yoshinobu / Okubo, Ken / Suzuki, Osamu et al. | 2017
- 167
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Low temperature direct bonding of polyoxymethylene (POM) through self assembly monolayer (SAM)Fu, Weixin / Kuwae, Hiroyuki / Ma, Bo / Shoji, Shuichi / Mizuno, Jun et al. | 2017
- 171
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Cu-Sn based joint material having IMC forming control capabilitiesIkeda, Hiroaki / Sekine, Shigenobu / Kimura, Ryuji / Shimokawa, Koichi / Okada, Keiji / Shindo, Hiroaki / Ooi, Tatsuya / Tamaki, Rei / Nagata, Makoto et al. | 2017
- 177
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The effect of surface activation process for the GaAs device propertiesFujino, Masahisa / Managaki, Nobuto / Yamada, Hiroshi / Suga, Tadatomo et al. | 2017
- 181
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Heat transfer performance of uni-directional porous heat sink for cooling of next generation on-vehicle inverterTakai, Kio / Yuki, Kohei / Yuki, Kazuhisa / Kibushi, Risako / Unno, Noriyuki et al. | 2017
- 181
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Improvement of cooling performance of impinging air by intermittent flow control : Relationship between nozzle diameter and cooling performanceFurusawa, T. / Fukue, T. / Shirakawa, H. / Hirose, K. et al. | 2017
- 188
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Comparison of thermal properties between Si and SiC power MOSFET using electro-thermal analysisKibushi, R. / Hatakeyama, T. / Yuki, K. / Unno, N. / Ishizuka, M. et al. | 2017
- 193
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Thermal management of silicon micro robot driven by neural networks IC control SMA actuatorTakato, M. / Nakata, Y. / Uchiumi, Y. / Tanaka, T. / Saito, K. / Uchikoba, F. et al. | 2017
- 199
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Immersion cooling technology of SiC-based on-vehicle inverter by anti-freezing liquid with subcooled boilingMa, Tianyu / Yuki, Kazuhisa / Furusho, Tadashi / Kibushi, Risako / Unno, Noriyuki / Suzuki, Koichi et al. | 2017
- 202
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Advanced cooling technology via boiling heat transfer considering the wettability of a heating surfaceUnno, Noriyuki / Jia, Xiang Yi / Yuki, Kazuhisa / Kibushi, Risako / Satake, Shin-ichi / Suzuki, Koichi et al. | 2017
- 206
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Cooling augmentation of subcooled boiling liquid by a nano-particle coated surfaceIwanaga, Yoshito / Yuki, Kazuhisa / Unno, Noriyuki / Kibushi, Risako / Suzuki, Koichi et al. | 2017
- 210
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Liquid-gas heat exchanger for low pressure refrigerant applicationRajput, Nirmal S. / Matsuba, Asuka / Sakuma, Hisato / Yoshikawa, Minoru et al. | 2017
- 216
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Flip chip joining with low temperature solders and thermal gradient bondingAoki, Toyohiro / Nakamura, Eiji / Hisada, Takashi / Mori, Hiroyuki / Yamamichi, Shintaro et al. | 2017
- 220
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Effects of Cu plating formulas on the solder joint reactionsChi, Shang-Wei / Lee, Hsuan / Chen, Chih-Ming et al. | 2017
- 223
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Effect of Ag-11Au-4.5Pd alloy bonding wire properties and structure on bond strengths and reliabilityCao, Jun / Fan, JunLing / Gao, WenBin et al. | 2017
- 229
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Surface-activated Bonding of III-V compound semiconductors and Si for fabricating hybrid tandem solar cellsShigekawa, Naoteru / Liang, Jianbo et al. | 2017
- 232
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Role of Bi in microstructure formation of Sn-Cu-Ni based BGAs on Cu metallizationsBelyakov, S. A. / Nishimura, T. / Akaiwa, T. / Sweatman, K. / Gourlay, C. M. et al. | 2017
- 237
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CMOS class-E power amplifier module with CPW bonding wires for 5GHz applicationKanaya, Haruichi et al. | 2017
- 239
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Transmission line signal radiation pattern by near-field measurementChou, Min / Liang, Kai-Wen / Tu, Meng-Hua / Wu, Sung-Mao et al. | 2017
- 243
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A cross type of unbalanced dipole antenna with the bent type of semicircular and trapezoidal radiating elementsYamada, Tomohiro / Koshiji, Fukuro / Nagatsu, Yudai / Koshiji, Kohji et al. | 2017
- 247
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A self-complementary antenna for WLAN and WiMAX applications using traditional molding skills and techniquesMaeda, Atsushi / Haga, Tsuyoshi / Watanabe, Yoshiteru / Abe, Yuichi et al. | 2017
- 250
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High density optical and electrical interfaces for chip-scale silicon photonic receiverTakemura, Koichi / Ibusuki, Yasuhiro / Ukita, Akio / Kurihara, Mitsuru / Kinoshita, Keizo / Okamoto, Daisuke / Fujikata, Junichi / Yashiki, Kenichiro / Suzuki, Yasuyuki / Horikawa, Tsuyoshi et al. | 2017
- 255
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Integration of optical interconnect for servers : Packaging approach toward near-CPU opticsTaira, Yoichi et al. | 2017
- 259
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Packaging of UV LED with a stacked silicon reflector for converged UV emissionQiu, Xing / Lo, Jeffery C. C. / Lee, S. W. Ricky et al. | 2017
- 264
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Design and fabrication for low loss channel-shuffling polymer waveguidesAbe, Kohei / Taira, Yoichi / Ishigure, Takaaki et al. | 2017
- 268
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Comprehensive analysis on SCM specifications for high-performance SCM/NAND flash hybrid SSD with through-silicon viaYamada, Tomoaki / Suzuki, Atsuya / Sugiyama, Yusuke / Matsui, Chihiro / Takeuchi, Ken et al. | 2017
- 272
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A study on frequency dispersion of transmission characteristics of shielded-flexible printed circuitsKayano, Yoshiki / Inoue, Hiroshi et al. | 2017
- 278
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High impedance design and investigation using TDR for fine lines on high density organic substrateKuo, Hung-Chun / Chu, Fu-Chen / Wang, Chen-Chao / Hung, Chih-Pin et al. | 2017
- 282
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Canary devices for through-silicon vias a condition monitoring approachJerchel, Kathleen / Grams, Arian / Nissen, Nils F. / Suga, Tadatomo / Lang, Klaus-Dieter et al. | 2017
- 288
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A MEMS-based measurement approach for contact normal force measurement in crimp terminalsMajcherek, S. / Aman, A. / Fochtmann, J. et al. | 2017
- 292
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Novel wafer level packaging for large die size deviceChang, T. N. / Tsou, C. Y. / Wang, B. H. / Chiang, K. N. et al. | 2017
- 297
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Investigation of the warpage modeling technique for thick multi-chip module encapsulated by compression moldingSuzuki, Kosuke / Sanada, Yuki / Uchibori, Shinya / Kashiwazaki, Atsushi / Imada, Masaji et al. | 2017
- 302
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Heterogeneous integration RoadmapChen, William / Bottoms, W.R et al. | 2017
- 306
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IoT & wearable electronics revolutionize electronics manufacturing paradigmsBauer, Charles E. / Neuhaus, Herbert J. et al. | 2017
- 308
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Intelligent automation; key factor for high mix manufacturingQuinones, Horatio / Yang, Yong et al. | 2017
- 312
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3D & printed electronics manufacturing strategiesBailey, C. / Stoyanov, S. / Tilford, T. / Tourloukis, G. et al. | 2017
- 316
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Panel processing for high volume/high mix manufacturingAschenbrenner, Rolf / Ostmann, Andreas et al. | 2017
- 318
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FO-WLP market and technology trendsVardaman, E. Jan et al. | 2017
- 321
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New wave Fan-out package : For heterogeneous integrationChao, Shin-Hua / Sung, Yuan-Fu / Luh, Ding-Bang et al. | 2017
- 325
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Trends in Fan-out wafer and panel level packagingBraun, Tanja / Becker, Karl-Friedrich / Wohrmann, Markus / Topper, Michael / Bottcher, Lars / Aschenbrenner, Rolf / Lang, Klaus-Dieter et al. | 2017
- 328
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Electronic packaging gears up for 5G mobile raceNishio, Toshihiko et al. | 2017
- 333
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Reducing technique of sidelobe in millimeter wave beam multiplexing systemIshikawa, Shohei / Honda, Atsushi / Shimura, Toshihiro / Ohashi, Yoji / Shimizu, Masahiko et al. | 2017
- 337
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Recent Trend of Layer-to-Layer Insulation Resin for High Frequency PackageFujishima, Shohei / Sakauchi, Hiroyuki et al. | 2017
- 341
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High thermal sintering die attach for power deviceSeong, Kyeongsool / Iwasaki, Toshihiro / Nakamura, Takashi / Sakumoto, Shotaro / Taniguchi, Fumihiko et al. | 2017
- 345
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Improved adhesion of plating copper metal on various substrates by controlled interface of Ag nanoparticles and thin polymer layerFukazawa, Norimasa / Fujikawa, Wataru / Murakawa, Akira / Shirakami, Jun et al. | 2017
- 351
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Caltrop cupric oxide particles synthesized by X-ray photochemical reactionYamaguchi, Akinobu / Okada, Ikuo / Fukuoka, Takao / Utsumi, Yuichi et al. | 2017
- 355
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Effect of molecular weight of PVA on the reactivity and stability behavior of adhesiveKao, Yu-Chen / Hsu, Meei-Yu / Chen, Yi-Chun / Chen, Kai-Chi et al. | 2017
- 359
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Polymer/Metal composite for flexible interconnect : Conductive, flexible, adhesive and productive materialKawakita, Jin / Chikyow, Toyohiro et al. | 2017
- 363
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Advanced materials with low dielectric properties and highly thermal conductivityTing, Wen-Pin / Tseng, Feng-Po / Chiou, Kuo-Chan et al. | 2017
- 368
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Study of high UPH TCB process with slow cure NCPMyodo, Hiroki / Kamata, Yusuke / Ikeda, Yukihiro / Hoshiyama, Masaaki et al. | 2017
- 372
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Voiding reduction and leadframe interactions in high-lead solder die attach for QFN applicationsSadural, Ariel Jan V. / Clemente, Laura Antoinette D. et al. | 2017
- 377
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Effects of Bi in Sn-Cu based lead-free solder alloys and interconnectsNogita, K. / Salleh, M. A. A. Mohd / Smith, S. / Wu, Y.Q. / McDonald, S.D. / Razak, A.G. Ab / Akaiwa, T. / Nishimura, T. et al. | 2017
- 381
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Effect of substrate metallization on the impact strength of Sn-Ag-Cu solder bumps fabricated in a formic acid atmosphereHe, Siliang / Nishikawa, Hiroshi et al. | 2017
- 386
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Study on temperature dependence of viscosity of halogen-free dispensing solder pasteYamamoto, Tetsuya / Hsu, Yuchen / Takahashi, Toshihide / Kimura, Akiya / Hiratsuka, Daisuke / Sato, Tsuyoshi et al. | 2017
- 390
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Relationship between vacuum degree and measurement accuracy of thermal conductivity using quasi-steady state measurementHatakeyama, Jumpei / Hirose, Koichi / Uchidate, Michimasa / Fukue, Takashi et al. | 2017
- 394
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Embedded heat pipes as thermal solution for PCBsde Sousa, J. Silvano / Fulmek, P. L. / Unger, M. / Haumer, P. / Nicolics, J. et al. | 2017
- 399
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Study of temperature rise of small chip components in case of dense mountingAruga, Yoshinori / Hirasawa, Koichi / Aoki, Hirotoshi / Hatakeyama, Tomoyuki / Nakagawa, Shinji / Ishizuka, Masaru et al. | 2017
- 405
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Basic investigation of cooling performance at upstream side of bend to develop 1-dimensional thermal design schemeIkehata, Jun / Kobayashi, Kota / Fukue, Takashi / Hirose, Koichi / Hata, Yosuke / Ishikawa, Hiroyuki et al. | 2017
- 409
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Development of conductive fusion technology : Advanced die attach materials for high power applicationsPatelka, Maciej / Krasco, Nicholas / Ikeda, Sho / Sato, Toshiyuki / Goni, Miguel / Ziade, Elbara / Schmidt, Aaron J. et al. | 2017
- 417
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Thermal transient test of GaN HEMT devicesHara, Tomoaki / Yanai, Kentaro et al. | 2017
- 422
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FEM simulation of warpage orientation change of FRP polymer substrate during thermal processingKim, Cheolgyu / Lee, Tae-Ik / Kim, Min Sung / Kim, Taek-Soo et al. | 2017
- 424
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Low Dk/Df polyimide adhesives for low transmission loss substratesTasaki, Takashi / Shiotani, Atsushi / Yamaguchi, Takashi / Sugimoto, Keisuke et al. | 2017
- 430
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Direct copper metallization on glass technologyOnitake, Shigeo / Inoue, Kotoku / Takayama, Masatoshi / Fujimura, Tsubasa et al. | 2017
- 434
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Development of through glass vias (TGV) and through quartz vias (TQV) for advanced packagingHoriuchi, Kohei / Ono, Motoshi / Sato, Yoichiro / Takahashi, Shintaro et al. | 2017
- 439
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Developments of high precision printing processes for fabricating the flexible electronicsUshijima, Hirobumi / Kusaka, Yasuyuki / Fujita, Mariko / Nomura, Ken-ichi / Kanazawa, Shusuke / Horii, Yoshinori / Abe, Koji / Yamamoto, Noritaka et al. | 2017
- 441
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Newly developed silver nanoparticle ink for organic TFT circuits fabricated with high resolution printing systemKumaki, Daisuke / Tokito, Shizuo et al. | 2017
- 443
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Print and imprint method for nanoimprint lithography with high-viscosity photo-curable resinsNakamura, T. / Nakagawa, M. et al. | 2017
- 447
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UV-assisted 3D-printing of soft ferrite magnetic components for power electronics integrationLiu, L. / Ge, T. / Yan, Y. / Ngo, K.D.T. / Lu, G-Q. et al. | 2017
- 451
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Imaging the patterning step of R2S microcontact printingKusaka, Yasuyuki / Kanazawa, Shusuke / Yamamoto, Noritaka / Ushijima, Hirobumi et al. | 2017
- 455
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Feasible monitoring methods for lung and circulatory functions using wearable sensorsNebuya, Satoru et al. | 2017
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Stretchable and robust transistor of single wall carbon nanotube, gel and elastomeric materialsSekiguchi, Atsuko / Tanaka, Fumiaki / Yamada, Takeo / Hata, Kenji et al. | 2017
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Fully additive manufacturing of a polymer cantilever with a conductive layerKanazawa, Shusuke / Kusaka, Yasuyuki / Nomura, Ken-ichi / Yamamoto, Noritaka / Ushijima, Hirobumi et al. | 2017
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Design of printed E-textile probers to supress electrocardiograpy noiseInoue, Masahiro / Amano, Yusaku / Tada, Yasunori et al. | 2017
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Sub-micron printing technology using seamless roller mold (SRM)Komatsu, Kazuma / Matsubara, Shinya / Hitomi, Taishi / Okuno, Kenjiro / Suzuki, Keita / Matsui, Shinji et al. | 2017
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Real-time observation of the reception of silver ink in soft blanket gravure printingIzumi, Konami / Yoshida, Yasunori / Tokito, Sizuo et al. | 2017
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Temperature effects on ink transfer performance of gravure offset printing for fine-line circuitryShen, Yun-Hui / Cheng, Hsien-Chie / Chen, You-Wei / Lu, Su-Tsai / Lin, Shih-Ming / Chen, Wen-Hwa et al. | 2017
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Mouthguard biosensor integrated with wireless module for monitoring human oral informationArakawa, Takahiro / Tomoto, Keisuke / Zhang, Zhiwei / Nitta, Hiroki / Toma, Koji / Takeuchi, Shuhei / Sekita, Toshiaki / Minakuchi, Shunsuke / Mitsubayashi, Kohji et al. | 2017
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Wireless monitoring of mouse by ultra-small and low power implantable sensor nodeLu, Jian / Serizawa, Kouichi / Sato, Mizuho / Zhang, Lan / Maeda, Ryutaro / Toyota, Atsushi et al. | 2017
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Development of high resolution electrostatic tactile displayIshizuka, H. / Suzuki, K. / Terao, K. / Takao, H. / Shimokawa, F. et al. | 2017
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Formation of extremely high-aspect Si sub-micron patterns with smooth wall for MEMS and X-ray devicesKomatsu, Hayato / Yashiro, Wataru / Kato, Hidemi / Kagami, Johji / Totsu, Kentaro / Nakao, Masashi et al. | 2017
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FOWLP technology as wafer level system in packaging (SiP) solutionLee, Leo Seo Hee / Kang, Lewis In-Soo / Kwon, Yong Tae / Kim, T H / Kim, J H / Lee, E J / Lee, J K et al. | 2017
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Carrier glass substrates for fan-out wafer/panel level packagingHayashi, Kazutaka et al. | 2017
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Recent progress in low temperature curable photosensitive dielectricsEnomoto, Tetsuya / Abe, Satoshi / Matsukawa, Daisaku / Nakamura, Tadamitsu / Yamazaki, Noriyuki / Saito, Nobuyuki / Ohe, Masayuki / Motobe, Takeharu et al. | 2017
- 502
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Encapsulation processes and materials for advanced packageYukimaru, Joji / Ishikawa, Yuki / Takao, Tomoya / Ikeda, Kazuhiro / Nakao, Akira et al. | 2017
- 506
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Integrated passive device for TSV (Through-Silicon-Via) interposerKim, Gu-Sung et al. | 2017
- 508
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Impact of backside process on high aspect ratio via-middle Cu through silicon via reliabilityLi, Yunlong / Van Huylenbroeck, Stefaan / De Vos, Joeri / Stucchi, Michele / Croes, Kristof / Beyer, Gerald P. / Beyne, Eric et al. | 2017
- 513
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Influence of surface properties on adhesion strength of dielectric passivation in chip size packagingSuyama, Takuro / Suga, Kensuke / Igarashi, Takatoshi / Fujimori, Noriyuki et al. | 2017
- 517
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Revisit the electromigration effect: In situ synchrotron X-ray and scanning electron microscopy and ab initio calculationsLin, Shih-kang / Liu, Yu-chen / Chiu, Shang-Jui / Liu, Yen-Ting / Lee, Hsin-Yi et al. | 2017
- 519
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Polymer for wafer-level hybrid bonding and its adhesion to passivation layer in 3D integrationLu, Cheng-Hsien / Kho, Yi-Tung / Cheng, Chuan-An / Huang, Yen-Jun / Chen, Kuan-Neng et al. | 2017
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