Process and productivity results from a carrier-based linear transport PVD system for RDL seed layer deposition in fan-out packaging applications (English)
- New search for: Bluck, Terry
- New search for: Chen, Chun-Chung
- New search for: Gallagher, Daniel
- New search for: Kudriavstev, Vladimir
- New search for: Mandrell, Lisa
- New search for: Runstadler, Billy
- New search for: Smith, Chris
- New search for: Werbaneth, Paul
- New search for: Bluck, Terry
- New search for: Chen, Chun-Chung
- New search for: Gallagher, Daniel
- New search for: Kudriavstev, Vladimir
- New search for: Mandrell, Lisa
- New search for: Runstadler, Billy
- New search for: Smith, Chris
- New search for: Werbaneth, Paul
In:
2017 IEEE 19th Electronics Packaging Technology Conference (EPTC)
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1-7
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2017
- Conference paper / Electronic Resource
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Title:Process and productivity results from a carrier-based linear transport PVD system for RDL seed layer deposition in fan-out packaging applications
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Contributors:Bluck, Terry ( author ) / Chen, Chun-Chung ( author ) / Gallagher, Daniel ( author ) / Kudriavstev, Vladimir ( author ) / Mandrell, Lisa ( author ) / Runstadler, Billy ( author ) / Smith, Chris ( author ) / Werbaneth, Paul ( author )
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Published in:
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Publisher:
- New search for: IEEE
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Publication date:2017-12-01
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Size:642376 byte
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ISBN:
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DOI:
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Type of media:Conference paper
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Type of material:Electronic Resource
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Language:English
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Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Challenges of wirebonding with polyimide flexible printed circuit board (FPCB)Jaafar, Norhanani Binte / Damalerio, Ramona et al. | 2017
- 1
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Effects of Pd distribution at free air ball in Pd coated Cu wireJung, Byung Hoon / Yu, Byung Kwan / Kim, Seung Hyoun / Moon, Jeong Tak / Hong, Sang Jeen et al. | 2017
- 1
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Development of the endoscopic clip with a battery-less LED for laparoscopic gastrointestinal resectionShibata, Kyohei / Shinki, Yuharu / Tsutsumi, Ryosuke / Ikeda, Tetsuo / Kanaya, Haruichi et al. | 2017
- 1
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Scanning acoustic microscopy: Resolution reduction due to attenuation of acoustic signal in materialsWong, C.S. et al. | 2017
- 1
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Characterization of molding compound material and dielectric layer of RDLZihao, Chen / Guan, Lim Teck / Wee, David Ho Soon / Chong, Chai Tai / Bhattacharya, Surya et al. | 2017
- 1
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Process development of moldable underfill on fine pitch RDL 1st fan-out wafer level packageLim, Simon Siak Boon / Ding, Mian Zhi / Chong, Ser Choong / Lim, Sharon Pei Siang et al. | 2017
- 1
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Evaluation of single layer adhesive material for thin wafer handling applicationsSekhar, V. N. / Hongmiao, Ji / Arimoto, Shinji / Okazawa, Toru / Fujiwara, Takenori / Kawano, Masaya et al. | 2017
- 1
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Growth and fabrication of carbon-based three-dimensional heterostructure in through-silicon vias (TSVs) for 3D interconnectsZhu, Ye / Tan, Chong Wei / Chua, Shen Lin / Lim, Yu Dian / Tay, Beng Kang / Tan, Chuan Seng et al. | 2017
- 1
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The adhesion study of backside dielectric film within 3D process integrationLi, H. Y. et al. | 2017
- 1
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Study on the impact of primer process control and lead delamination towards cracked/broken wedge bondGoh, S. H. / Lau, C. K. / Chang, K. S. et al. | 2017
- 1
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Development of chip on wafer bonding with non conductive film using gang bonderChong, Ser Choong / Li, Hongyu / Xie, Ling / Sekhar, Vasarla Nagendra / Cereno, Daniel Ismael et al. | 2017
- 1
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Larger FCBGA package with thin and normal core evaluation and characterizationLin, Vito / Kao, Nicholas / Jiang, Don Son et al. | 2017
- 1
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A novel annular ring design for improved plated-thru-hole impedance matchingKong, Jackson / Cheah, Bok Eng / Yong, Khang Choong / Heck, Howard et al. | 2017
- 1
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2.5D Silicon optical interposer for 400 Gbps electronic-photonic integrated circuit platform packagingKim, Do-Won / Au, K. Y. / Luo, Hong Yu Li. Xianshu / Ye, Yong Liang / Bhattacharya, Surya / Lo, Guo Qiang et al. | 2017
- 1
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Development of highly efficient push-pull power amplifier with center tapped transformer for 5GHz applicationSadakiyo, Tomoki / Kanaya, Haruichi et al. | 2017
- 1
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Qualitative & quantitative study of flux-clean solution for smart high-side deviceAbarro, Ghizelle Jane / Aguinaldo, Victor / Ceasar-Paule, Alex / Tan, Ariel / Ramos, Manny et al. | 2017
- 1
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The life cycle impact assessment that the variabilities of BGA solder connection makesYano, Ryosuke / Yu, Qiang et al. | 2017
- 1
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Impact of 3D stacking on the TSV-induced stress and the CMOS characteristicsDote, Aki / Tashiro, Hiroko / Kitada, Hideki / Tadaki, Shinji / Miyahara, Shoichi / Sakuyama, Seiki et al. | 2017
- 1
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Wideband modeling and characterization of coaxial-annular through-silicon via for 3-D ICsMei, Zheng / Dong, Gang et al. | 2017
- 1
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One micron redistribution for fan-out wafer level packagingFlack, Warren W. / Hsieh, Robert / Nguyen, Ha-Ai / Slabbekoorn, John / Lorant, Christophe / Miller, Andy et al. | 2017
- 1
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Study of underfill dispensing for a large-die packageHuang, Huei Nuan / Tseng, Matt / Liu, Chung Liang / Xu, Cheng Sheng / Lin, Kun Hung / Chu, Che Min / Tsai, Yu Huci et al. | 2017
- 1
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Investigating the role of sidewall surface roughness on the performance of through silicon viasKumar, Somesh / Pathania, Sunil / Sharma, Rohit et al. | 2017
- 1
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Porosity and Young's modulus of pressure-less sintered silver nanoparticlesLong, Xu / Tang, Wenbin / Xia, Weijuan / Wu, Yanpei / Ren, Lianfeng / Yao, Yao et al. | 2017
- 1
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Higher reliability for low-temperature curable positive-tone photo-definable dielectric materialsFujiwara, Takenori / Shoji, Yu / Masuda, Yuki / Hashimoto, Keika / Koyama, Yutaro / Isobe, Kimio / Araki, Hitoshi / Okuda, Ryoji / Tomikawa, Masao et al. | 2017
- 1
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Reliability prediction of LED packaging by fatigue behavior of bonding wire in power cycling accelerated testPan, Yongjun / Zhu, Fulong / Lin, Xinxin / Wang, Fengren / Shi, Lang / Kan, Yan / Liu, Sheng / Fan, Jiajie et al. | 2017
- 1
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2.5D chip TSV open failure analysis by high resolution time-domain reflectometryHashimoto, Masaichi / Shinohara, Makoto / Shang, Yang / Mohan, Aparna / Zee, Bernice et al. | 2017
- 1
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Efficient decoupling and filtering for multiple loads and voltage domains with composite capacitorsKuan, Chin Lee / Jain, Amit K. / Shekhar, Sameer et al. | 2017
- 1
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Method for assessing the delamination risk in BEoL stacks around copper TSV applying nanoindentation and finite element simulationAlbrecht, J. / Weissbach, M. / Auersperg, J. / Rzepka, S. et al. | 2017
- 1
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Novel end-point solution for improvement in die strength and yields with plasma dicing after grind in volume productionBarnett, Richard / Ansell, Oliver / Hanicenic, Martin / Hopkins, Janet et al. | 2017
- 1
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Measuring methods and measuring errors in electronics production technologiesOppermann, Martin / Zerna, Thomas et al. | 2017
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Stress-free bonding technology with bondable thin glass layer for MEMS based pressure sensorHu, Xiaodong / Mackowiak, P. / Zhang, Yucheng / Ehrmann, Oswin / Lang, Klaus-Dieter / Schneider-Ramelow, Martin / Hansen, Ulli / Maus, Simon / Gyenge, Oliver / Meng, Maozhou et al. | 2017
- 1
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Heterogeneous interposer based integration of chips onto interposer to achieve high speed interfaces for ADC applicationChaudhary, Muhammad Waqas / Heinig, Andy et al. | 2017
- 1
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Selective over-molding of a CMOS TSV wafer with the flexible 3D integration of components and sensorsHamelink, Johan / van Weelden, Ton / Hoedemaker, Mike / Boschman, Eef et al. | 2017
- 1
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Hybrid flexible smart temperature tag with NFC technology for smart packagingZhang, Xi / Shan, Xuechuan / Wei, Jun et al. | 2017
- 1
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Development of next generation solder resistKomuro, Nobuhito / Daijima, Yuta / Imabayashi, Shinya et al. | 2017
- 1
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Ag nanoparticles — Based hybrid Ink with low metallization temperatureHan, Yong D. / Zhang, Si M. / Jing, Hong Y. / Wei, Jun / Bu, Fan H. / Zhao, Lei / Lv, Xiao Q. / Xu, Lian Y. et al. | 2017
- 1
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Survey on 3D-ICs thermal modeling, analysis, and management techniquesSalah, Khaled et al. | 2017
- 1
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Optimizing Ag wire bonding for memory devicesQin, Ivy / Rockey, Tom / Milton, Basil / Schulze, Gary / Olida, Romeo / Chylak, Bob / Chang, Andrew / Wong, Nelson et al. | 2017
- 1
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Trend plots for compound selection utilized for warpage design of MUF FCCSP with 4L ETSChen, Chih-Sung / Kao, Nicholas / Jiang, Don Son et al. | 2017
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The correlation between sintered silver joint reliability and pressure assisted sintering parametersNg, Wayne C W / Sweatman, Keith / Kumagai, Keisuke / Takamura, Kenji / Nishimura, Takatoshi / Letz, Sebastian / Schletz, Andreas et al. | 2017
- 1
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Hybrid hermetic housings for active implantable neural deviceCheng, Ming-Yuan / Chen, Weiguo / Lim, Ruiqi / Damalerio, Ramona et al. | 2017
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Challenges of ultra-thin WLCSPChen, Kelly / Tang, Tom / Lin, Victor / Zhou, Tammi / Tsai, Jensen / Liao, Mark / Hsieh, Steve / Ho, Arthur / Chang, Jerry et al. | 2017
- 1
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Effect of indium on deformation of binary In-Bi alloysJin, Sanghun / Kim, Min-su / Kanayama, Shutetsu / Nishikawa, Hiroshi et al. | 2017
- 1
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Strip warpage assessment of dual side molding SiP moduleWang, Ming-Han / Hu, Ian / Chen, Richard Y C / Yeh, Chan-Lin / Shih, Meng-Kai / Tarng, David et al. | 2017
- 1
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Development of back-end process integration for implantable neurostimulation applicationChen, Po-Chun / Ku, Heng-An / Lin, Pin-Cheng et al. | 2017
- 1
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Predictive analytics in reverse supply chain management commodity life expectancy for quality engineeringDegbotse, Alfred / Ang, Ai Kiar / Vuong, Ngoc Quy / Tan, Julian S K et al. | 2017
- 1
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Additive low temperature 3D printed electronic as enabling technology for IoT applicationStoukatch, S. / Dupont, F. / Seronveaux, L. / Vandormael, D. / Kraft, M. et al. | 2017
- 1
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Perfect molding challenges and the limitationsTan, Lay Tatt / Teo, Yin Yin / Lee, Chee Hong / Lim, Boon Huat et al. | 2017
- 1
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The fabrication of transmission line on the glass substrateLi, H. Y. / Kim, Do-Won / Sekhar, Vasarla Nagendra et al. | 2017
- 1
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GaAs device two-steps junction stain and scanning capacitance microscopy sample preparationChuang, Yih-Sheng / Huang, Chun-An / Hsu, Ju-Hung / Wu, Yung-Jen et al. | 2017
- 1
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Enhancing magnetoelectric and optical properties of co-doped bismuth ferrite multiferroic nanostructuresMatin, M. A. / Hossain, M. N. / Rizvi, M. H. / Zubair, M. A. / Hakim, M. A. / Hussain, A. / Islam, M. F. et al. | 2017
- 1
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Comprehensive defect monitoring technique for advanced fanout packaging processVangai, Aravindh / Yeoh, Richard / Chang, Wesley / Pan, ShihLin / Kuo, Wei / Pandey, Anuj / Khoo, Kevin / Lakhawat, Rahul / Wang, Kootz et al. | 2017
- 1
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Evaluation of printed capacitive touch sensors for touch panelFan, W. / Lok, B. K. / Lai, F. K. / Wei, J. et al. | 2017
- 1
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More than moore and beyond CMOS: New interconnects schemes and new circuits architecturesSalah, Khaled et al. | 2017
- 1
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Environmental impact analysis of smartwatch using SimaPro8 tools and energy dispersive X-ray spectroscopy (EDX) techniqueMa, Man Man Mani / Zhu, Ze / Chan, Yan Cheong et al. | 2017
- 1
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Photo-dielectric polymer material characterization to improve reliability of 3D-IC packagingAlloutil, Nacima / D'Affroux, Anais / Chausse, Pascal / Moreau, Stephane / Vignoud, Lionel et al. | 2017
- 1
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Risk assessment study of new product developmentAno, Kazuaki et al. | 2017
- 1
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High reliability mid-temperature pb-free alloy for multi-step solderingChoudhury, Pritha / Ribas, Morgana / Sarkar, Siuli et al. | 2017
- 1
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Copper nanoparticle paste on different metallic substrates for low temperature bonded interconnectionKim, Jaewon / Lee, Byunghoon / Koo, Ja-Myeong / Gan, Chee Lip et al. | 2017
- 1
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Investigations of copper wire bonding capability on plasma based additive copper metallizationsHensel, Alexander / von Platen, Klaus Kohlmann / Franke, Joerg et al. | 2017
- 1
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Molding process development for Low-Cost MEMS-WLCSP with silicon pillars and Cu wires as vertical interconnectionsDing, Mian Zhi / Lau, Boon Long / Chen, Zhaohui et al. | 2017
- 1
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Thermal characterization for dual side SiP module technologyChen, Bo-Syun / Chen, Tang-Yuan / Yang, Jin-Feng / Chin-Li-Kao, / Chen, Yu-Chang / Yeh, Chan-Lin / Shih, Meng-Kai et al. | 2017
- 1
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Silica filler content in NCP and its effects on the reliability of 3D TSV Multi-Stack under thermal shock testAlves Braganca, Wagno / Eom, Yong-Sung / Son, Jihye / Jang, Keon-Soo / Bae, Hyun-Cheol / Moon, Seok Hwan / Choi, Kwang-Seong et al. | 2017
- 1
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Comparison of temperature distribution in FinFETs and GAAFETs based on Dual-Phase-Lag heat transfer modelRaszkowski, T. / Samson, A. / Zubert, M. / Janicki, M. et al. | 2017
- 1
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Die level 3D heterogeneous integration of a microfluidic systemKrishna, N.P. Vamsi / Sen, Prosenjit et al. | 2017
- 1
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Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bondingInac, M. / Wietstruck, M. / Goritz, A. / Cetindogan, B. / Baristiran-Kaynak, C. / Lisker, M. / Kruger, A. / Trusch, A. / Saarow, U. / Heinrich, P. et al. | 2017
- 1
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Evaluation of thin film encapsulation strength for commercial packagingLee, Jae-Wung / Merugu, Srinivas / Chong, Ser Choong / Sharma, Jaibir / Singh, Navab et al. | 2017
- 1
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Feasability study of piezo jet printed silver ink structures for interconnection and condition monitoring of power electronics componentsMueller, Martin / Franke, Joerg et al. | 2017
- 1
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Full wafer redistribution and wafer embedding as key technologies for a multi-scale neuromorphic hardware clusterZoschke, Kai / Guttler, Maurice / Bottcher, Lars / Grubl, Andreas / Husmann, Dan / Schemmel, Johannes / Meier, Karlheinz / Ehrmann, Oswin et al. | 2017
- 1
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Digital micro-dispension of non-conductive adhesives (NCA) by inkjet printerRoshanghias, Ali / Krivec, Matic / Binder, Alfred et al. | 2017
- 1
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Fabrication of paper electrode by dry transfer of Ag NP and Ag NWKim, Sunho / Lee, Hoo-Jeong et al. | 2017
- 1
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Compact heat exchanger design and energy efficiency optimization for data centre cooling applicationTang, Gongyue / Han, Yong / Zhang, Xiaowu et al. | 2017
- 1
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128 × 128 silicon photonic MEMS switch package using glass interposer and pitch reducing fibre arrayHwang, How Yuan / Morrissey, Padraic / Lee, Jun Su / O'Brien, Peter / Henriksson, Johannes / Wu, Ming C. / Seok, Tae Joon et al. | 2017
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Package with simulation method to predict underfill flow pattern with different dispensed conditionYen, Freedman / Hung, Leo / Chen, Hsin Long / Hung, Joseph / Kao, Nicholas / Jiang, Don Son et al. | 2017
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Review on test vehicles for electromigration (EM) study in solder interconnectsZhu, Ze / Chan, Yan-cheong / Wu, Fengshun / Gan, Chee Lip / Chen, Zhong et al. | 2017
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Distributed DC electrical assessment of switch-mode convertersShekhar, Sameer / Jain, Amit K. / Kuan, Chin Lee et al. | 2017
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A comprehensive study on BGA block warpage and prediction methodologyDuca, Roseanne / En Luan, Jing / Hla, Phone Maw / Goh, Kim-Yong et al. | 2017
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Glue selection for robust wire bonding process related to non-stick on padChung, Ee Lin / Ge, Dandong / Wai, Chee Mun et al. | 2017
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Improvement of lifetimetime prediction of silver sintered material in automotive power devicesYaejima, Ryosuke / Okuno, Shota / Yu, Qiang / Nakata, Yusuke / Sugawara, Hiroyuki et al. | 2017
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Factors affecting activation energy for pd-coated cu ball bond resistance degradation on Al bond pads in high temperature storageHook, Michael D. / Hunter, Stevan / Mayer, Michael et al. | 2017
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Scratch test methodology for leadframe platingHo, Ong Chen / Yeo, Alfred / Teng, Wang Hui et al. | 2017
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Analysis and design of low loss differential transmission line structures for high speed applicationsRotaru, Mihai Dragos / Wagih, Mahmoud Ashraf et al. | 2017
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Solder joint fatigue analysis under combined thermal and vibration loadingMeier, K. / Roellig, M. / Liu, Y. / Bock, K. et al. | 2017
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Mechanical and electrical characteristics of screen printed stretchable circuits on thermoplastic polyurethaneChen, S. H. / Shan, X. C. / Tang, W. L. R. / Mohaime, B. M. / Goh, M. H. / Zhong, Z. W. / Wei, J. et al. | 2017
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Challenge and warpage optimization of thermal compression bonding technology on coreless substratesTsai, Mike / Tsai, Jensen / Yao, Yan Han / Lo, Roger / Chang, Cheng Kai / Kao, Nicholas et al. | 2017
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Modelling of wire bonding Cu-Al intermetallic formation growth towards interfacial stressChia, Lee Cher / Yau, Chua Kok / Anand, T. Joseph Sahaya / Shariza, S. / Jamli, Mohamad Ridzuan Bin et al. | 2017
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Thermo-mechanical design of fan-out wafer level package for power converter moduleChen, Zhaohui / Gongyue, Tang / Long, Lau Boon / Zhi, Ding Mian / Ching, Eva Wai Leong / Chong, Chai Tai et al. | 2017
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Visualization of oxide removal during ultrasonic wire bonding processLong, Yangyang / Dencker, Folke / Isaak, Andreas / Schneider, Friedrich / Hermsdorf, Jorg / Wurz, Marc / Twiefel, Jens et al. | 2017
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Passive stress sensor development: From 65nm to 28nm technology nodesRaid, I. / Estevez, R. / Gallois-Garreignot, S. / Kermarrec, O. / Vianne, B. et al. | 2017
- 1
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Indexer PVD platform — The key enabler for high productivity and low contact resistance for next-generation WLP applicationsCarazzetti, Patrik / Balon, Frantisek / Hoffmann, Mike / Weichart, Juergen / Erhart, Andreas / Strolz, Ewald et al. | 2017
- 1
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Gallium nitride transistor on glass using epoxy mediated substrate transfer technologyKrishna, N.P. Vamsi / Ramesh, Nayana / Mohan, Nagaboopathy / Muralidharan, Rangarajan / Raghavan, Srinivasan / Nath, Digbijoy N / Sen, Prosenjit et al. | 2017
- 1
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Development of chip-first and die-up fan-out wafer level packagingHua, Xuan / Xu, Hong / Zhang, Li / Chen, Dong / Tan, K H / Lai, C M / Lau, John / Li, Ming / Li, Margie / Kuah, Eric et al. | 2017
- 1
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The mechanism and damage of snail trailsShudong, Zhou et al. | 2017
- 1
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Process and productivity results from a carrier-based linear transport PVD system for RDL seed layer deposition in fan-out packaging applicationsBluck, Terry / Chen, Chun-Chung / Gallagher, Daniel / Kudriavstev, Vladimir / Mandrell, Lisa / Runstadler, Billy / Smith, Chris / Werbaneth, Paul et al. | 2017
- 1
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Chip-to-Wafer (C2W) flip chip bonding for 2.5D high density interconnection on TSV free interposerLim, Sharon Pei-Siang / Ding, Mian Zhi / Kawano, Masaya et al. | 2017
- 1
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Hybrid micro-fluid heat sink for high power dissipation of liquid-cooled data centreHan, Yong / Tang, Gongyue / Lau, Boon Long / Zhang, Xiaowu et al. | 2017
- 1
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Research on Dual-Linear Motor Synchronous Control in the High-precision Gantry Motion PlatformYunbo, He / Wentao, Ye / Jian, Gao / Chengqiang, Cui / Xun, Chen / Xin, Chen / Zhijun, Yang / Kai, Zhang / Yun, Chen / Yu, Zhang et al. | 2017
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- 1
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Design of NFC WISP system for wearable devicesZhang, Xuesong / Wang, Qian / Guo, Han / Chen, Yu / Cai, Jian et al. | 2017
- 1
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Optimization of chemistry for a vapour phase process to deflux no clean lead free materials on pcbasDuchi, Patrick J. / Cetier, Jonathan / Levasseur, Laurent / Coquio, Jaquemine / Aguilar, Rodrigo et al. | 2017
- 1
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The design of near-field horizontal probe for wireless charging coilWang, Tian-An / Chen, Bo-You / Wu, Sung-Mao et al. | 2017
- 1
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Design and electrical analysis for adavanced fan-out package-on-packagePan, Po-Chih / Hsieh, Tsun-Lung / Huang, Chih-Yi / Jhong, Ming-Fong / Wang, Chen-Chao et al. | 2017
- 1
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Novel ICP Plasma Etching for Backside TSVSakuishi, Toshiyuki / Murayama, Takahide / Morikawa, Yasuhiro et al. | 2017
- 1
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Dispensing challenges of large format packaging and some of its possible solutionsKuah Th, Eric / Ling, Chan Wei / Yuan, Hao Ji / Fan, Nelson / Ming, Li / Lau, John / Kai, Wu et al. | 2017
- 1
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Modeling of manufacturing induced residual stresses of viscoelastic epoxy mold compound encapsulationsGschwandl, Mario / Fuchs, Peter Filipp / Mitev, Ivaylo / Yalagach, Mahesh / Antretter, Thomas / Qi, Tao / Schingale, Angelika et al. | 2017
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Wafer level vacuum packaging with Al-Ge bonding for MEMSDaw Don, Cheam / Jae-Wung, Lee / Bangtao, Chen / Singh, Navab et al. | 2017
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Ultra-small packaged micro-cooler for medical applicationsFernandes, J. / Anacleto, P. / Rocha, L. A. / Gaspar, J. / Mendes, P. M. et al. | 2017
- 1
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3D Si interposer & WLP for small power devices for harsh conditionsCharbonnier, J. / Plihon, A. / Assous, M. / Argoud, M. / Allouti, N. / Moreau, S. / David, N. / Brunet-Manquat, C. / Hartler, C. / Siegert, J. et al. | 2017
- 1
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Board level solder reliability simulation for epoxy mold compound based power packageQian, Qiuxiao / Liu, Yong et al. | 2017
- 1
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Effect of rheological characterization on the jet printing performance of lead-free solder pasteLi, Saipeng / Hao, Jian / Tian, Shuang / Wang, Dapeng / Zhou, Jian / Xue, Feng et al. | 2017
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Measurement issues in LED characterization for Delphi4LED style combined electrical-optical-thermal LED modelingHantos, G. / Hegedus, J. / Bein, M. C. / Gaal, L. / Farkas, G. / Sarkany, Z. / Ress, S. / Poppe, A. / Rencz, M. et al. | 2017
- 1
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Simulation analysis of a wearable dry EEG electrodes for epilepsy monitoringChen, Weiguo / Damalerio, Ramona / Lim, Ruiqi / Gao, Yuan / Chan, Derrick / Cheng, Ming-Yuan et al. | 2017
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Establish electrostatic discharge simulation environment combined with near-field measurementTsai, Chia-Hsuan / Li, Cheng-Dao / Wu, Sung-Mao et al. | 2017
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Constitutive model for SMA considering arbitrary thermal-mechanical loading and loading historyZhang, Xiaoyong / Huang, Dawei / Qi, Mingjing / Yan, Xiaojun et al. | 2017
- 1
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Plating challenges associated with high-density fan-out (HDFO) technologyThorkelsson, Kari / Banik, Stephen / Mayer, Steve / Buckalew, Bryan et al. | 2017
- 1
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Thermal design and analysis of through silicon interposer (TSI) packageBu, Lin / Han, Yong / Zhang, Xiaowu / Chai, T. C. et al. | 2017
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Automation of ATE test program execution in offline and onlineMaria, Deva Ruban / Viswanathan, Kamalakannan / Amal, Michael / Kumar, Karthik Krishna et al. | 2017
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Effective layout scheme of power and ground TSVs for more reliable power delivery in 3-D ICsZhu, Weijun / Dong, Gang / Mei, Zheng et al. | 2017
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Development of the high efficiency cooling structure of the liquid immersion cooling SR motorWakabayashi, Daiki / Yu, Qiang / Nakamura, Yoshmobu et al. | 2017
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Novel coated silver (Ag) bonding wire: Bondability and reliabilityKumar, Balasubramanian Senthil / Murali, Sarangapani / Tae, Kang Il / Evonne, Lim Yee Weon / Wei, Tok Chee / James, Kim Tae Yeop / Eric, Tan Swee Seng / Xi, Zhang et al. | 2017
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Integration benefits and challenges on Fan-Out to enable system in package for IoT/Wearable DevicesTang, Humi / Lu, Max / Tsai, Jensen / Jiang, Jase / Cheng, Honda / Lu, Terrence / Wang, Yu-Po et al. | 2017
- 1
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Reliability of wearable electronics — Case of water proof tests on smartwatchYip, Yuk-ngang Zita / Zhu, Ze / Chan, Yan-cheong et al. | 2017
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Non-contact technology by near-field measurementSu, Ping-Chia / Li, Cheng-Dao / Wu, Sung-Mao et al. | 2017
- 1
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Dielectric constant measure using near-field measurement systemTsai, Li-Xuan / Cheng, Kuan-I / Wu, Sung-Mao et al. | 2017
- 1
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Through-Silicon Via process module with backside metallization and redistribution layer within a 130 nm SiGe BiCMOS technologyWietstruck, M. / Marschmeyer, S. / Lisker, M. / Kruger, A. / Wolansky, D. / Fraschke, M. / Kulse, P. / Goritz, A. / Inac, M. / Voss, T. et al. | 2017
- 1
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Towards reliable pitch assembly using Cu/Ni/SnAg based interconnectsTaneja, D. / Volpert, M. / Mendizabal, L. / Chaira, T. / Henry, D. / Hodaj, F. et al. | 2017
- 1
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Low temperature Cu-Cu bonding using tin nanoparticles fabricated by high pressure magnetron sputteringWu, Zijian / Wang, Qian / Cai, Jian et al. | 2017
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The calibration of the path between SMA connecter to co-planer structureLai, Chun-Ting / Chen, Bo-You / Wu, Sung-Mao et al. | 2017
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Silver alloy wire bonding and optimization using robust development approachLoo, Shei Meng / Zhang, Ray / Orr, Geok Koon / De Jesus, Edsel / Fundan, Raquel / Renard, Loic / Luan, Jing-En et al. | 2017
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Bond pad effects on the shear strength of copper wire bondsManoharan, Subramani / Hunter, Stevan / McCluskey, Patrick et al. | 2017
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Study of critical load force towards thin plating on pre-plated leadframeWang, H.T. / Ong, C.H. / Wang, X.J. / Li, W.H. / Ng, L.P. et al. | 2017
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Leading edge die stacking and wire bonding technologies for advanced 3D memory packagesYauw, Oranna / Wu, Jie / Tan, Andrew / Qin, Ivy / Shah, Aashish / Yang, Jeong Ho / Schulze, Gary et al. | 2017
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Study on warpage and stress of TSV wafer with ultra-fine pitch vias for high density chip stackingChe, F.X. / Xie, L. / Chen, Z.H. / Wickramanayaka, Sunil et al. | 2017
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Inductance characterization and improvement on a small GQFN packageTubillo, Carolyn / Kyaw, Ko Lwin / Dimaano, Jun / Suthiwongsunthorn, Nathapong et al. | 2017
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Thermo-mechanical reliability prediction for copper pillar 3D IC devicesHariharan, Ganesh / Bhat, Chandan / Chaware, Raghunandan / Singh, Inderjit / Anandan, Ramasamy et al. | 2017
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Optimal design of a microchannel heat sink with a pin-fin array integrated with Si interposerSun, Yunna / Kang, Taegyu / Li, Jian / Jin, Zhiyu / Chang, Xinyue / Wang, Yan / Yang, Zhuoqing / Wang, Guilian / Ding, Guifu et al. | 2017
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Application of failure analysis on package copper pillar bump electromigrationWang, Wei-chiao / Cheng, Kuan-I / Wu, Sung-Mao et al. | 2017
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Direct printing of electrical connections from metal melts using StarJet technologyJehle, Michael / Gerdes, Bjorn / Soukup, Pavel / Fechtig, Michael / Zengerle, Roland / Koltay, / Riegger, Lutz et al. | 2017
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Wafer-Level packaging technology for optical sensor devicesToschkoff, G. / Bodner, T. / Etschmaier, H. / Schrank, F. et al. | 2017
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Electromigration polarity effect of Cu/Ni/Sn-Ag microbumps for three-dimensional integrated circuitsSon, Kirak / Ryu, Hyodong / Kim, Gahui / Lee, Jina / Park, Young-Bae et al. | 2017
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The influence of the cycling parameters on the reliability test results of IGBTsSarkany, Zoltan / Rencz, Marta et al. | 2017
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Reaction competition in micro-bump and the influences on reliabilitiesChen, Yi-Ting Henry / Chaware, Raghunandan / Anandan, Ramasamy / Singh, Inderjit et al. | 2017
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High temperature endurable die attach material for power electronics package — Process challengesWai, Leong Ching / Ding, Mian Zhi / Tang, Gong Yue et al. | 2017
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FOWLP design for HBM applicationsGuan, Lim Teck / Ho, David / Chinq, Jong Ming / Bhattacharya, Surya et al. | 2017
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Ultra-fine-pitch bonding based on photolithography and electroplatingLi, Dongyang / Dai, Xuhan / Kang, Taegyu / Ding, Guifu et al. | 2017
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Enabling faster design and implementation decisions using virtual prototypingFujita, Yoko / Koga, Kazunari / Whipple, Tom et al. | 2017