A 2 million transistor digital signal processor with 120 nm gates fabricated by 248 nm wavelength phase shift technology (English)
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In:
Microelectronic engineering
;
53
, 1-4
; 101-104
;
2000
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ISSN:
- Article (Journal) / Print
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Title:A 2 million transistor digital signal processor with 120 nm gates fabricated by 248 nm wavelength phase shift technology
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Contributors:Watson, G.P. ( author ) / Kizilyalli, I.C. / Miller, M. / Wang, Y.T. / Pati, B. / Cirelli, R.A. / Nalamasu, O. / Radosevich, J. / Kohler, R. / Freyman, R.
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Published in:Microelectronic engineering ; 53, 1-4 ; 101-104
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Publisher:
- New search for: Elsevier
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Place of publication:Amsterdam [u.a.]
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Publication date:2000
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ISSN:
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ZDBID:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 535/5670
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Keywords:
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Classification:
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Source:
Table of contents – Volume 53, Issue 1-4
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1
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Preface to the Micro and Nano Engineering 1999 proceedings publication| 2000
- 5
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System-On-Chip: A Way Around Lithography LimitationsBaldi, L. et al. | 2000
- 13
-
Image Formation in EUV Lithography: Multilayer and Resist PropertiesCerrina, F. et al. | 2000
- 21
-
Photon confinement effects - from physics to applicationsForchel, A. et al. | 2000
- 29
-
Advanced mesoscopic device concepts and technologyHasegawa, Hideki et al. | 2000
- 37
-
Ion Projection Lithography: Progress of European MEDEA & International ProgramKaesmaier, Rainer et al. | 2000
- 47
-
MEMS: Quo Vadis in Century XXI ?Muller, Richard S. et al. | 2000
- 55
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Prospects for Charged Particle Lithography as a Manufacturing TechnologyPease, R.Fabian et al. | 2000
- 61
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PREVAIL: Proof-of-Concept System and ResultsPfeiffer, Hans C. et al. | 2000
- 67
-
Fabrication of Patterned Media for High Density Magnetic StorageRoss, C.A. et al. | 2000
- 69
-
High-performance and Damage-free Plasma Etching Processes for Future ULSI PatterningSamukawa, Seiji et al. | 2000
- 77
-
Soft x-rays for deep sub-100 nm lithography, with and without masksSmith, Henry I. et al. | 2000
- 87
-
Probing the Limits of Optical Lithography: The Fabrication of Sub-100nm Devices with 193nm Wavelength LithographyCirelli, R.A. et al. | 2000
- 91
-
CD Dispersion Across the Lens Field: Influence on Transistor CharacteristicsToublan, O. et al. | 2000
- 95
-
Deep-Ultraviolet Contact PhotolithographyGoodberlet, James G. et al. | 2000
- 101
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A 2 million transistor digital signal processor with 120 nm gates fabricated by 248 nm wavelength phase shift technologyWatson, G.P. et al. | 2000
- 105
-
Wide band gap fluoride dielectric crystals doped with trivalent rare earth ions as optical materials for 157 nm photolithographySarantopoulou, E. et al. | 2000
- 109
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Determining Mask Effects in Low K1 LithographyMccallum, Martin et al. | 2000
- 113
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248 nm Lithography for 180 nm contact holesRomeo, C. et al. | 2000
- 119
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Sub-wavelength printing using multiple overlapping masksPau, S. et al. | 2000
- 123
-
Absorbance and outgasing of photoresist polymeric materials for UV lithography below 193 nm including 157 nm lithographyCefalas, A.C. et al. | 2000
- 129
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High order lens aberration monitorPreuninger, J. et al. | 2000
- 133
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AlSixNy as an Embedded Layer for Attenuated Phase-Shifting Mask in 193 nm and the Utilization of a Chemically Amplified Negative Resist NEB-22 for MaskmakingLoong, Wen-an et al. | 2000
- 137
-
Influence of Wafer Chucking on Focus Margin for Resolving Fine Patterns in Optical LithographyUne, A. et al. | 2000
- 141
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A Novel Bottom Antireflective Coating Working for Both KrF and ArF Excimer Laser LithographyWang, L.A. et al. | 2000
- 145
-
Maximising the Process Window in Sub-Half-Micron Optical LithographyArthur, G. et al. | 2000
- 149
-
Excimer Lasers for 0.1 (micro)m Lithography and BeyondVogler, K. et al. | 2000
- 149
-
Excimer Lasers for 0.1 mm Lithography and BeyondVogler, K. / Stamm, U. / Patzel, R. / Tassy, I. / Bragin, I. / Osmanov, R. / Govorkov, S. / Kleinschmidt, J. / Schroeder, T. / Vo, F. et al. | 2000
- 153
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Optical Proximity Correction by Grey Tone PhotolithographyCui, Zheng et al. | 2000
- 159
-
Process development for 30 nm poly gate patterning on 1.2 nm oxideHeitzmann, M. et al. | 2000
- 163
-
Fabrication of high density nanostructures gratings (>500Gbit-in2) used as molds for nanoimprint lithographyCarcenac, F. et al. | 2000
- 167
-
Fabrication of Single Electron Devices by hybrid (E-Beam-DUV) lithographyPalun, L. et al. | 2000
- 171
-
Nanoreplication in polymers using hot embossing and injection moldingSchift, H. et al. | 2000
- 175
-
Tri-layer systems for nanoimprint lithography with an improved process latitudeLebib, A. et al. | 2000
- 179
-
Fabrication and characterization of vacuum nanoelectronic devicesDriskill-Smith, A.A.G. et al. | 2000
- 183
-
Multifunctional AFM-SNOM Cantilever Probes: Fabrication and MeasurementsStopka, M. et al. | 2000
- 187
-
Direct Electron Beam Writing of Nanostructures Using Passivated Gold ClustersBedson, T.R. et al. | 2000
- 191
-
High resolution magnetic patterning using focused ion beam irradiationVieu, C. et al. | 2000
- 195
-
Capacitively- and resistively-coupled single-electron transistorWakaya, F. et al. | 2000
- 199
-
Coulomb Blockade in a Silicon-on-Sapphire NanowireDovinos, D. et al. | 2000
- 205
-
Inverted modulation-doped n-type Si-Si0.77Ge0.23 heterostructuresDunford, R.B. et al. | 2000
- 209
-
Si-Si1-xGex heterostructure field effect transistors fabricated using a low thermal budget CMOS processDunford, R.B. et al. | 2000
- 213
-
1-f-Noise of Sub-100 nm-MOS-Transistors Fabricated by a Special Deposition and Etchback TechniqueHorstmann, J.T. et al. | 2000
- 217
-
Nanofabrication of quantum wires on (100) Si and SiGe by shifted-resist pattern and anisotropic wet etchingGiovine, E. et al. | 2000
- 221
-
Combination of Nanoimprint and Scanning Force Lithography for local tailoring of sidewalls of nanometer devicesSchulz, H. et al. | 2000
- 225
-
Fabrication of Metallic Multilayer Single Electron Tunneling Devices using Low-energy E-beam LithographyWeimann, Th et al. | 2000
- 229
-
Parallel Frequency Readout of an Array of Mass-Sensitive Transducers for Sensor ApplicationsKim, B.H. et al. | 2000
- 233
-
Fabrication of Nanostructures using a UV-based imprint techniqueBender, M. et al. | 2000
- 237
-
70 nm Features on 140 nm Period Using Evanescent Near Field Optical LithographyAlkaisi, M.M. et al. | 2000
- 241
-
Temporal Cross-Section for Carrier Capture by Self-Assembled Quantum DotsRaymond, S. et al. | 2000
- 245
-
Self-organized quantum dot formation by ion sputteringFacsko, S. et al. | 2000
- 249
-
A sub-micron photoluminescence system for nanostructure characterizationDe Vittorio, M. et al. | 2000
- 253
-
Microcontact printing and pattern transfer with a tri-layer processingChen, Y. et al. | 2000
- 257
-
Imaging of Si nano-patterns embedded in SiO2 using scanning electron microscopyNagase, M. et al. | 2000
- 261
-
Electron beam induced deposition of metallic tips and wires for microelectronics applicationsUtke, I. et al. | 2000
- 265
-
Fabrication of MOS-integrated metallic single electron memoriesPépin, A. et al. | 2000
- 271
-
Experimental evaluation of arrayed microcolumn lithographyMuray, L.P. et al. | 2000
- 279
-
An experimental setup to test the MAPPER electron lithography conceptKampherbeek, B.J. et al. | 2000
- 283
-
PREVAIL - Evolution and Properties of Large Area Reduction Projection Electron OpticsStickel, W. et al. | 2000
- 287
-
A study of multiple scattering effect with 10 kV e-beam systemJeon, Chan-Uk et al. | 2000
- 291
-
Experimental and numerical investigations of photomask substrate heating due to electron beam patterningShamoun, B. et al. | 2000
- 295
-
Electron-beam lithography of V-groove quantum wire devicesDwir, B. et al. | 2000
- 299
-
Global Space Charge Effect in SCALPELMkrtchyan, M. et al. | 2000
- 305
-
Determination of proximity effect parameters and the shape bias parameter in electron beam lithographySeo, Eunsung et al. | 2000
- 309
-
Marks for SCALPEL Tool Optics OptimizationFarrow, R.C. et al. | 2000
- 313
-
Study of Resist Surface Roughness in EB LithographyYoshida, A. et al. | 2000
- 317
-
Application of Neural Network to Enhancing Accuracy of E-Beam Proximity Effect CorrectionLee, S.-Y. et al. | 2000
- 321
-
Analysis of a SCALPELTM Multi-Pass Writing StrategyZhu, X. et al. | 2000
- 325
-
Fabrication of Semi-Continuous Profile Diffractive Optical Elements for Beam Shaping by Electron Beam LithographyNottola, A. et al. | 2000
- 329
-
Performance of New E-Beam Lithography System JBX-9300FSTakemura, H. et al. | 2000
- 333
-
A Simple New Method for the Investigation of Process Latitude in E-beam Lithography with Positive Resists.Kudryashov, V.A. et al. | 2000
- 337
-
Optimum energy for high resolution low voltage electron beam lithography - Monte Carlo simulations and experimentsPeuker, M. et al. | 2000
- 341
-
Resist heating with different writing strategies for high-throughput maskmakingBabin, Sergey et al. | 2000
- 345
-
Comparison of PEC approaches for SCALPELStanton, Stuart et al. | 2000
- 349
-
A study of electron forward scattering effects on the footwidth of T-gates fabricated using a bilayer of PMMA and UVIIIChen, Y. et al. | 2000
- 353
-
Influence of electron acceleration voltage in the cell-projection lithography systemKotera, M. et al. | 2000
- 357
-
Thermal Distortion Predictions of a Silicon Wafer during Exposure in a Scalpel ToolGianoulakis, S. et al. | 2000
- 361
-
Improved Pattern-Placement Accuracy in E-Beam Lithography via Sparse-Sample Spatial-Phase LockingHastings, J.T. et al. | 2000
- 367
-
Etch characteristics of giant magnetoresistive materialsResnick, D.J. et al. | 2000
- 371
-
Quantum electron beam probe of sidewall dry-etch damageRahman, M. et al. | 2000
- 375
-
SiO2-Si Selectivity in High Density CHF3-CH4 Plasmas: Role of the Fluorocarbon LayerRolland, L. et al. | 2000
- 381
-
Resist Removal Process in Dual Damascene Structure Integrating Cu and SiLK(R) for 0.18 (micro)m TechnologyLouis, D. et al. | 2000
- 381
-
Resist Removal Process in Dual Damascene Structure Integrating Cu and SiLK for 0.18 mm TechnologyLouis, D. / Arvet, C. / Lajoinie, E. / Peyne, C. / Lee, S. / Berry, I. / Han, Q. et al. | 2000
- 385
-
Synthesis of Silicide Structures by High Energy Ion ProjectionWeidenmüller, U. et al. | 2000
- 391
-
Nanopatterning of organic and inorganic materials by holographic lithography and plasma etchingVisconti, P. et al. | 2000
- 395
-
SiO2 and Si Etching in Fluorocarbon Plasmas: Coupling of a Surface Model with a Profile Evolution SimulatorKokkoris, G. et al. | 2000
- 399
-
Fabrication of Sub-10nm Si-tip Array Coated with Si3N4 Thin Film For Potential NSOM and Liquid Metal Ion Source ApplicationsJung, M.Y. et al. | 2000
- 403
-
Resistless patterning of sub-micron structures by evaporation through nanostencilsBrugger, J. et al. | 2000
- 407
-
Low temperature electron cyclotron resonance plasma technique for low loss integrated opticsPernas, P.L. et al. | 2000
- 411
-
Novel Linear and Crosslinking Polymers for Nanoimprinting with High Etch ResistancePfeiffer, K. et al. | 2000
- 415
-
Beam-assisted-etching technique for fabrication of single crystal diamond field emitter tipTaniguchi, J. et al. | 2000
- 419
-
Fabrication of Nanostructures in GaNRong, B. et al. | 2000
- 425
-
A Triphenylene Derivative as a Novel Negative-positive Tone Resist of 10 Nanometer ResolutionTada, T. et al. | 2000
- 429
-
Minimizing Thick Resist Sidewall Slope Dependence on Design Geometry by Optimizing Bake ConditionsPuchner, H. et al. | 2000
- 433
-
Monte Carlo study of High performance resists for SCALPEL nanolithographyOcola, L.E. et al. | 2000
- 437
-
Overview of the STORM Program Application to 193nm Singe Layer ResistsCroffie, E. et al. | 2000
- 443
-
Optimization of an Advanced Positive Tone DUV Photoresist Towards 150 nm and BeyondErcken, M. et al. | 2000
- 449
-
Three-Dimensional Resist Development Simulation - Benchmarks and Integration with LithographyPyka, W. et al. | 2000
- 453
-
Aqueous base developable epoxy resist for high sensitivity electron beam lithographyArgitis, P. et al. | 2000
- 457
-
Bias Printing of APSM Resists for 180 nm Contact HolesTeng, G. et al. | 2000
- 461
-
Comparison of negative tone resists NEB22 and UVN30 in e-beam lithographyvan Dodewaard, A.J. et al. | 2000
- 465
-
157nm photodissociation of polyamidesCefalas, A.C. et al. | 2000
- 471
-
Characterisation of the Ultrasonic Development Process in UVIII ResistYasin, Shazia et al. | 2000
- 475
-
Highly Sensitive Positive Surface Modification ResistsShirai, M. et al. | 2000
- 479
-
Acid Diffusion Analysis in the Chemically Amplified CARL ResistRichter, E. et al. | 2000
- 485
-
High sensitive negative silylation process for 193nm lithographyEndo, M. et al. | 2000
- 489
-
Development mechanism study by dissolution monitoring of positive methacrylate photoresistsRaptis, I. et al. | 2000
- 493
-
Use of SU-8 photoresist for very high aspect ratio x-ray lithographyBogdanov, A.L. et al. | 2000
- 497
-
Application of calixarene for nanometer magnetic particle fabricationJedrasik, P. et al. | 2000
- 501
-
High Density Fluorocarbon Plasma Etching of New Resists Suitable for Nano-Imprint LithographyGaboriau, F. et al. | 2000
- 509
-
Fabrication of a Micromachined Magnetic X-Y-Z Scanner for Parallel Scanning Probe ApplicationsRothuizen, H. et al. | 2000
- 513
-
Micro-Technology for Anti- CounterfeitingLee, R.A. et al. | 2000
- 517
-
Fabrication of NMR - Microsensors for Nanoliter Sample VolumesDechow, J. et al. | 2000
- 521
-
Nanoimprint- and UV-lithography: Mix&Match process for fabrication of interdigitated nanobiosensorsMontelius, L. et al. | 2000
- 525
-
A Novel Insulation Technique for Smart Power Switching Devices and Very High Voltage ICs Above 10 kVMankowski, V. et al. | 2000
- 531
-
Coding Gray-tone Mask for Refractive Microlens FabricationYao, Jun et al. | 2000
- 535
-
A new lithography technique using super-resolution near-field structureKuwahara, M. et al. | 2000
- 539
-
Three-Dimensional Microstructure Elements Fabricated By Electron Beam Lithography and Dry Etching TechniqueSteingrüber, R. et al. | 2000
- 543
-
Micromachined silicon grisms: high resolution spectroscopy in the near infraredCianci, E. et al. | 2000
- 547
-
Microstructures etched in doped TMAH solutionsBrida, S. et al. | 2000
- 553
-
Submicron semiconductor structure for microwave detectionAsmontas, S. et al. | 2000
- 557
-
Replication of 3D-micro- and nanostructures using different UV-curable polymersRudschuck, St et al. | 2000
- 561
-
A micromachined bistable 1x2 switch for optical fibersPieri, F. et al. | 2000
- 565
-
A micromachined Xenon flow regulator for space applicationsDiligenti, A. et al. | 2000
- 569
-
A Structure Definition Technique for 25 nm Lines of Silicon and Related MaterialsHilleringmann, U. et al. | 2000
- 573
-
A silicon microfabricated electrostatic transducer: 1 MHz transmission in air and in waterCaliano, G. et al. | 2000
- 577
-
Flexible, Reliable and Simple Fabrication of Integrated Spot Size Converters with Shifting Mask TechniqueSteingrüber, R. et al. | 2000
- 581
-
High-value MOS capacitor arrays in ultradeep trenches in siliconRoozeboom, F. et al. | 2000
- 587
-
Overlay Performance of SR Lithography in 64M DRAM LayersSumitani, H. et al. | 2000
- 591
-
Using X-ray Lithography to make sub 100 nm MMICsSelzer, Robert Bob et al. | 2000
- 595
-
Fine pattern fabrication of a-type Ta on a membrane for X-ray mask absorber using ECR ion stream etchingTsuchizawa, T. et al. | 2000
- 599
-
3D Microstructures Fabricated By Partially Opaque X-Ray Lithography MasksCabrini, S. et al. | 2000
- 605
-
Ion Projection Lithography for Resistless Patterning of Thin Magnetic FilmsBruenger, W.H. et al. | 2000
- 609
-
Dry Etch Improvements in the SOI Wafer Flow Process for IPL Stencil Mask FabricationLetzkus, F. et al. | 2000
- 613
-
Temperature and energy spread investigations of alloy LMISBischoff, L. et al. | 2000
- 617
-
Comparison of experimental and Monte Carlo results of stochastic Coulomb interaction in projection beam lithographyde Jager, P.W.H. et al. | 2000
- 623
-
Modeling Pattern Transfer in Ion-Beam Lithography MasksFrisque, G. et al. | 2000
- 627
-
The Birefringence and Polarization Effects of Amorphous Ge and Si Gratings by Focused-Ion-BeamShin, Kyung et al. | 2000
- 631
-
Electroabsorption in a GaAs n-i-p-i Structure with Selective Contacts Fabricated by Focused Ion Molecular Beam EpitaxyVijendran, S. et al. | 2000
- 637
-
Application of Scanning Probe Microscopy for the determination of the structural accuracy of high aspect ratio microstructuresAchenbach, S. et al. | 2000
- 641
-
Multilayer integrated-circuit imaging with contrast enhancement in a large-area, high-resolution electron-beam systemWeaver, D.J. et al. | 2000
- 645
-
X-ray nano-diffraction: 100 nm resolution obtained in a novel imaging technique for strain measurement at buried interfacesLagomarsino, S. et al. | 2000
- 649
-
Development of a secondary-electron detection system for high-speed high-sensitivity inspection SEM imagingTakafuji, A. et al. | 2000
- 653
-
High Resolution and High Sensitivity Near-Field Optical MicroscopeFreyland, J.M. et al. | 2000
- 659
-
Mitigation of surface contamination from resist outgassing in EUV lithographyMertens, B.M. et al. | 2000
- 663
-
A proposal of high power EUV lithography illumination system using synchrotron radiationGomei, Y. et al. | 2000
- 667
-
A Liquid-Xenon-Jet Laser-Plasma X-Ray and EUV SourceHansson, B.A.M. et al. | 2000
- 671
-
Theoretical Estimation of Absorption Coefficients of Various Polymers at 13 n mMatsuzawa, Nobuyuki N. et al. | 2000
- 677
-
Fabrication of stair-case profiles with high aspect ratios for blazed diffractive optical elementsDavid, C. et al. | 2000
- 681
-
Comparison of Extreme Ultraviolet Sources for Lithography ApplicationsBanine, V.Y. et al. | 2000
- 685
-
Nanostructuring of Zone Plates for Helium Atom Beam FocusingRehbein, S. et al. | 2000
- 689
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Prediction of Resolution using wet-develop type single layer and dry-development process for EUV lithographyMori, Shigeyasu et al. | 2000