CONTRIBUTED PAPERS - Design of Accelerated Corrosion Tests for Electronic Components in Automotive Applications (English)
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In:
IEEE transactions on components and packaging technologies
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24
, 1
; 99-107
;
2001
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ISSN:
- Article (Journal) / Print
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Title:CONTRIBUTED PAPERS - Design of Accelerated Corrosion Tests for Electronic Components in Automotive Applications
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Contributors:
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Published in:IEEE transactions on components and packaging technologies ; 24, 1 ; 99-107
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Publisher:
- New search for: IEEE
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Place of publication:New York, NY
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Publication date:2001
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ISSN:
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ZDBID:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 53.51 / 53.51 / 53.12 / 53.12
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Table of contents – Volume 24, Issue 1
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 2
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CONTRIBUTED PAPERS - Parametric Optimization of Multichanneled Heat Sinks for VLSI Chip CoolingMurakami, Y. et al. | 2001
- 2
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Parametric optimization of multichanneled heat sinks for VLSI chip coolingMurakami, Y. / Mikic, B.B. et al. | 2001
- 10
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Thermal cycling aging effects on microstructural and mechanical properties of a single PBGA solder joint specimenPang, J.H.L. / Kwang Hong Tan, / Xunqing Shi, / Wang, Z.P. et al. | 2001
- 10
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CONTRIBUTED PAPERS - Thermal Cycling Aging Effects on Microstructural and Mechanical Properties of a Single PBGA Solder Joint SpecimenPang, J.H.L. et al. | 2001
- 16
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Nonuniform temperature distribution in electronic devices cooled by flow in parallel microchannelsHetsroni, G. / Mosyak, A. / Segal, Z. et al. | 2001
- 16
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CONTRIBUTED PAPERS - Nonuniform Temperature Distribution in Electronic Devices Cooled by Flow in Parallel MicrochannelsHetsroni, G. et al. | 2001
- 24
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CONTRIBUTED PAPERS - Effect of Nonconducting Filler Additions on ACA Properties and the Reliability of ACA Flip-Chip on Organic SubstratesYim, M.-J. et al. | 2001
- 24
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Effect of nonconducting filler additions on ACA properties and the reliability of ACA flip-chip on organic substratesMyung-Jin Yim, / Kyung-Wook Paik, et al. | 2001
- 33
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CONTRIBUTED PAPERS - A Voltage-Controlled Tunable Thin-Film Distributed RC Notch FilterChoi, W.-Y. et al. | 2001
- 33
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A voltage-controlled tunable thin-film distributed RC notch filterWon-Youl Choi, / Trolier-McKinstry, S. et al. | 2001
- 38
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CONTRIBUTED PAPERS - Study on Effect of Coupling Agents on Underfill Material in Flip Chip PackagingLuo, S. et al. | 2001
- 38
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Study on effect of coupling agents on underfill material in flip chip packagingShijian Luo, / Wong, C.P. et al. | 2001
- 43
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Effect of UV/ozone treatment on surface tension and adhesion in electronic packagingShijian Luo, / Wong, C.P. et al. | 2001
- 43
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CONTRIBUTED PAPERS - Effect of UV-Ozone Treatment on Surface Tension and Adhesion in Electronic PackagingLuo, S. et al. | 2001
- 50
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CONTRIBUTED PAPERS - Contact Resistance Calculations: Generalizations of Greenwood's Formula Including Interface FilmsBoyer, L. et al. | 2001
- 50
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Contact resistance calculations: generalizations of Greenwood's formula including interface filmsBoyer, L. et al. | 2001
- 59
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CONTRIBUTED PAPERS - Development of No-Flow Underfill Materials for Lead-Free Solder Bumped Flip-Chip ApplicationsZhang, Z.Q. et al. | 2001
- 59
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Development of no-flow underfill materials for lead-free solder bumped flip-chip applicationsZhang, Z.Q. / Shi, S.H. / Wong, C.P. et al. | 2001
- 67
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CONTRIBUTED PAPERS - Polymer Thick-Films on Silicon: A Route to Hybrid MicrosystemsPapakostas, T.V. et al. | 2001
- 67
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Polymer thick-films on silicon: a route to hybrid microsystemsPapakostas, T.V. / White, N.M. et al. | 2001
- 76
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CONTRIBUTED PAPERS - Mapping of Mechanical, Thermomechanical, and Wire-Bond Strain Fields in Packaged Si Integrated Circuits Using Synchrotron White Beam X-Ray TopographyMcNally, P.J. et al. | 2001
- 76
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Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam X-ray topographyMcNally, P.J. / Rantamaki, R. / Tuomi, T. / Danilewsky, A.N. / Lowney, D. / Curley, J.W. / Herbert, P.A.F. et al. | 2001
- 84
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Investigation of the underfill delamination and cracking in flip-chip modules under temperature cyclic loadingFan, X.-J. / Wang, H.B. / Lim, T.B. et al. | 2001
- 84
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CONTRIBUTED PAPERS - Investigation of the Underfill Delamination and Cracking in Flip-Chip Modules under Temperature Cyclic LoadingFan, X.-J. et al. | 2001
- 92
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Bonding stress and reliability of high power GaAs-based lasersLisak, D. / Cassidy, D.T. / Moore, A.H. et al. | 2001
- 92
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CONTRIBUTED PAPERS - Bonding Stress and Reliability of High Power GaAs-Based LasersLisak, D. et al. | 2001
- 99
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Design of accelerated corrosion tests for electronic components in automotive applicationsEriksson, P. / Carlsson, B. / Wallinder, I.O. et al. | 2001
- 99
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CONTRIBUTED PAPERS - Design of Accelerated Corrosion Tests for Electronic Components in Automotive ApplicationsEriksson, P. et al. | 2001
- 108
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OPEN FORUM - EditorialPecht, M.G. et al. | 2001
- 109
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Prognostic methodology for deep submicron semiconductor failure modesGoodman, D.L. et al. | 2001
- 109
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OPEN FORUM - Prognostic Methodology for Deep Submicron Semiconductor Failure ModesGoodman, D.L. et al. | 2001
- 115
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IEEE Copyright Form| 2001