Multichannel mixed-mode IC for digital readout of silicon strip detectors (English)
- New search for: Grybos, P.
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In:
Microelectronics reliability
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42
, 3
; 427-436
;
2002
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ISSN:
- Article (Journal) / Print
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Title:Multichannel mixed-mode IC for digital readout of silicon strip detectors
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Contributors:
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Published in:Microelectronics reliability ; 42, 3 ; 427-436
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Publisher:
- New search for: Elsevier
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Place of publication:Amsterdam [u.a.]
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Publication date:2002
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ISSN:
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ZDBID:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 275/5670
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Keywords:
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Classification:
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Source:
Table of contents – Volume 42, Issue 3
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 307
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A review of ULSI failure analysis techniques for DRAMs 1. Defect localization and verificationBenstetter, Guenther et al. | 2002
- 317
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Recent developments in silicon optoelectronic devicesWong, Hei et al. | 2002
- 327
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Investigation and modeling of stressed thermal oxidesCaputo, Domenico et al. | 2002
- 335
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A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO2 and nitride-oxide dielectricsChen, Fen et al. | 2002
- 343
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Influence of polysilicon-gate depletion on the subthreshold behavior of submicron MOSFETsLiou, Juin J. et al. | 2002
- 349
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The abnormality in gate oxide failure induced by stress-enhanced diffusion of polycrystalline siliconAhn, Yongseok et al. | 2002
- 349
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The abnormality in gate oxide failure induced by stress-enhanced diffusion of polycrystalline silicon (DRAM)Ahn, Yong-Seok / Lee, Sanghyun / Koh, Gwanhyeob / Chung, Taeyoung / Kim, Kinam et al. | 2002
- 355
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1-f noise as a reliability indicator for subsurface Zener diodesZhuang, Yiqi et al. | 2002
- 361
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Temperature-dependent noise characterization and modeling of on-wafer microwave transistorsCaddemi, A. et al. | 2002
- 367
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A thermo-mechanical study on the electrical resistance of aluminum wire conductorsLiu, De-Shin et al. | 2002
- 375
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The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy methodLin, T.Y. et al. | 2002
- 381
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Development of gold to gold interconnection flip chip bonding for chip on suspension assembliesLuk, C.F. et al. | 2002
- 391
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Bump formation for flip chip and CSP by solder paste printingKloeser, Joachim et al. | 2002
- 399
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Impact of component placement in solder joint reliabilityAlander, T. et al. | 2002
- 407
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Board level reliability of a stacked CSP subjected to cyclic bendingWu, J.D. et al. | 2002
- 417
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A novel, zone based process monitoring method for low cost MCM-D substrates manufactured on large area panelsCottet, Didier et al. | 2002
- 427
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Multichannel mixed-mode IC for digital readout of silicon strip detectorsGrybos, P. et al. | 2002
- 437
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On-line testable data path synthesis for minimizing testing timeIsmaeel, A.A. et al. | 2002
- 455
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MOS characteristics of NO-grown oxynitrides on n-type 6H-SiCChakraborty, S. et al. | 2002
- 459
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Prediction of long-term thermal behavior of an irradiated SRAM based on isochronal annealing measurementsSaigné, F. et al. | 2002
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Calendar of forthcoming events| 2002