ANNOUNCEMENTS - 56th Electronic Components and Technology Conference (ECTC 2006) (English)
In:
IEEE transactions on electronics packaging manufacturing
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29
, 2
; 137
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2006
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ISSN:
- Article (Journal) / Print
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Title:ANNOUNCEMENTS - 56th Electronic Components and Technology Conference (ECTC 2006)
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Published in:IEEE transactions on electronics packaging manufacturing ; 29, 2 ; 137
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Publisher:
- New search for: IEEE
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Place of publication:New York, NY
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Publication date:2006
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ISSN:
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ZDBID:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 53.53 / 53.51 / 53.12
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Source:
Table of contents – Volume 29, Issue 2
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 69
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Development of horizontal elements in 3-D microcontactsAndreev, S. / Videkov, V. / Arnaudov, R. / Avdjiiski, B. / Yordanov, N. et al. | 2006
- 75
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Effects of fluid properties on dispensing processes for electronics packagingChen, X.B. / Ke, H. et al. | 2006
- 83
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Eco-efficiency of take-back and recycling, a comprehensive approachHuisman, J. / Stevels, L.N. et al. | 2006
- 91
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An accommodative approach designed for TCP gold-to-gold inner lead bondingChing-Yu Ni, / Ching-I Chen, / Ki-Sang Yoon, / Hyo-Jung Ahn, et al. | 2006
- 99
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Online multiobjective Pareto optimal dynamic scheduling of semiconductor back-end using conjunctive simulated schedulingSivakumar, A.I. / Gupta, A.K. et al. | 2006
- 110
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Plastic separation planning for end-of-life electronicsWilliams, J.A.S. / Grant, E.R. / Rios, P. / Blyler, L. / Tieman, L. / Twining, L. / Bonawi-Tan, W. / Madden, M. / Guthrie, N.R.M. et al. | 2006
- 119
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Double bump flip-chip assemblyYan, K.W. / Johnson, R.W. / Stapleton, R. / Ghosh, K. et al. | 2006
- 134
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2nd Annual Organic Microelectronics Workshop (ACS/IEEE/MRS)| 2006
- 134
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ANNOUNCEMENTS - 2nd Annual Organic Microelectronics Workshop (ACS-IEEE-MRS)| 2006
- 135
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ANNOUNCEMENTS - Call for Papers -- 15th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2006)| 2006
- 135
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15th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2006)| 2006
- 136
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8th Electronics Packaging Technology Conference (EPTC 2006)| 2006
- 136
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ANNOUNCEMENTS - Call for Papers -- 8th Electronics Packaging Technology Conference (EPTC 2006)| 2006
- 137
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ANNOUNCEMENTS - 56th Electronic Components and Technology Conference (ECTC 2006)| 2006
- 137
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56th Electronic Components and Packaging Conference (ECPC 2006)| 2006
- 138
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Celebrating the vitality of technology the Proceedings of the IEEE| 2006
- 139
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Have you visited lately? www.ieee.org| 2006
- 140
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Order Form for Reprints| 2006
- 141
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IEEE Transactions on Advanced Packaging - Table of contents| 2006
- 143
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IEEE Transactions on Components and Packaging Technolog - Table of contents| 2006
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Table of contents| 2006
- c2
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IEEE Components, Packaging, and Manufacturing Technology Society [publication information]| 2006
- c3
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IEEE Components, Packaging, and Manufacturing Technology Society - Information for authors| 2006
- c4
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Board of Governors [IEEE Components, Packaging, and Manufacturing Technology Society information]| 2006