Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux (English)
- New search for: Zhan, S.
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In:
IEEE transactions on electronics packaging manufacturing
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29
, 3
; 217
;
2006
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ISSN:
- Article (Journal) / Print
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Title:Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux
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Contributors:
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Published in:IEEE transactions on electronics packaging manufacturing ; 29, 3 ; 217
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Publisher:
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Place of publication:New York, NY
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Publication date:2006
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ISSN:
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ZDBID:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
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Table of contents – Volume 29, Issue 3
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 145
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Copper Direct Drilling With TEA CO2 Laser in Manufacture of High-Density InterconnectionPrinted Circuit BoardFang, X.Y. et al. | 2006
- 145
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Copper Direct Drilling With TEA$hbox CO_2$Laser in Manufacture of High-Density Interconnection Printed Circuit BoardXiang Yi Fang, / Yung, K.C. et al. | 2006
- 150
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Planning the e-Scrap Reverse Production System Under Uncertainty in the State of Georgia: A Case StudyI-Hsuan Hong, / Assavapokee, T. / Ammons, J. / Boelkins, C. / Gilliam, K. / Oudit, D. / Realff, M.J. / Vannicola, J.M. / Wongthatsanekorn, W. et al. | 2006
- 163
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An Experimental and Numerical Investigation Into Multilayer Probe Card Layout DesignLiu, D.S. / Shih, M.K. et al. | 2006
- 172
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Using Coupled Transmission Lines to Generate Impedance-Matched Pulses Resembling Charged Device Model ESDMaloney, T.J. / Poon, S.S. et al. | 2006
- 179
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Acid Decapsulation of Epoxy Molded IC Packages With Copper Wire BondsMurali, S. / Srikanth, N. et al. | 2006
- 184
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Establishing a Relationship Between Warranty and ReliabilityPecht, M.G. et al. | 2006
- 191
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Mechanical Strength and Interface Characteristics of Transmission Laser BondingTseng, A.A. / Jong-Seung Park, et al. | 2006
- 202
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Wave Soldering Using Sn/3.0Ag/0.5Cu Solder and Water Soluble VOC-Free FluxWable, G. / Quyen Chu, / Damodaran, P. / Srihari, K. et al. | 2006
- 211
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Reliability Investigation of Mixed BGA AssembliesZbrzezny, A.R. / Snugovsky, P. / Lindsay, T. / Lau, R. et al. | 2006
- 217
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Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean FluxSheng Zhan, / Azarian, M.H. / Pecht, M.G. et al. | 2006
- 224
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- 225
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IEEE Transactions on Advanced Packaging - Table of contents| 2006
- 227
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IEEE Transactions on Components and Packaging Technolog - Table of contents| 2006
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Table of contents| 2006
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IEEE Components, Packaging, and Manufacturing Technology Society Information| 2006