Nanoporous gold bumps for low temperature bonding (English)
- New search for: Oppermann, Hermann
- New search for: Oppermann, Hermann
- New search for: Dietrich, Lothar
In:
Microelectronics reliability
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52
, 2
; 356-361
;
2012
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ISSN:
- Article (Journal) / Print
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Title:Nanoporous gold bumps for low temperature bonding
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Contributors:Oppermann, Hermann ( author ) / Dietrich, Lothar
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Published in:Microelectronics reliability ; 52, 2 ; 356-361
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Publisher:
- New search for: Elsevier
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Place of publication:Amsterdam [u.a.]
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Publication date:2012
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ISSN:
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ZDBID:
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Type of media:Article (Journal)
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Type of material:Print
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Language:English
- New search for: 275/5670
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Keywords:
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Classification:
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Source:
Table of contents – Volume 52, Issue 2
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 301
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Guest Editorial – Low Temperature Processing for Microelectronics and Microsystems PackagingSuga, Tadatomo / Song, Jenn-Ming / Lai, Yi-Shao et al. | 2011
- 302
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Low temperature bonding technology for 3D integrationKo, Cheng-Ta / Chen, Kuan-Neng et al. | 2011
- 312
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Wafer-level Cu–Cu bonding technologyTang, Ya-Sheng / Chang, Yao-Jen / Chen, Kuan-Neng et al. | 2011
- 321
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Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancementTan, C.S. / Lim, D.F. / Ang, X.F. / Wei, J. / Leong, K.C. et al. | 2011
- 325
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Overview of low temperature hydrophilic Ge to Si direct bonding for heterogeneous integrationByun, Ki Yeol / Colinge, Cindy et al. | 2011
- 331
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Low temperature direct bonding: An attractive technique for heterostructures build-upMoriceau, H. / Rieutord, F. / Fournel, F. / Di Cioccio, L. / Moulet, C. / Libralesso, L. / Gueguen, P. / Taibi, R. / Deguet, C. et al. | 2011
- 342
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Nanoadhesion layer for enhanced Si–Si and Si–SiN wafer bondingKondou, Ryuichi / Wang, Chenxi / Shigetou, Akitsu / Suga, Tadatomo et al. | 2010
- 347
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Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materialsWang, Chenxi / Suga, Tadatomo et al. | 2011
- 352
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BCB-to-oxide bonding technology for 3D integrationLin, S.L. / Huang, W.C. / Ko, C.T. / Chen, K.N. et al. | 2011
- 356
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Nanoporous gold bumps for low temperature bondingOppermann, Hermann / Dietrich, Lothar et al. | 2011
- 361
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Low temperature nanointegration for emerging biomedical applicationsHowlader, Matiar M.R. / Doyle, Thomas E. et al. | 2011
- 375
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Low-temperature low-pressure die attach with hybrid silver particle pasteSuganuma, K. / Sakamoto, S. / Kagami, N. / Wakuda, D. / Kim, K.-S. / Nogi, M. et al. | 2011
- 381
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Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bondingChen, Y.J. / Chang, C.C. / Lin, H.Y. / Hsu, S.C. / Liu, C.Y. et al. | 2010
- 385
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Solid-state interfacial reactions at the solder joints employing Au/Pd/Ni and Au/Ni as the surface finish metallizationsLin, Chi-Pu / Chen, Chih-Ming et al. | 2011
- 391
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Low temperature fabricated conductive lines on flexible substrate by inkjet printingLiu, Yu-Feng / Hwang, Weng-Sing / Pai, Yen-Fang / Tsai, Ming-Hsu et al. | 2011
- 398
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Low temperature fabrication of Ni–P metallic patterns on ITO substrates utilizing inkjet printingLiu, Yih-Ming / Pu, Nen-Wen / Chen, Wen-Ding / Lin, Kun-Hong / Sung, Yuh / Ger, Ming-Der / Chang, Ching-Liang / Tseng, Te-Liand et al. | 2011
- 405
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A technique to mitigate impact of process, voltage and temperature variations on design metrics of SRAM CellIslam, A. / Hasan, Mohd. et al. | 2011
- 412
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Effect of additive N2 and Ar gases on surface smoothening and fracture strength of Si wafers during high-speed chemical dry thinningHeo, W. / Lee, N.-E. et al. | 2011
- 418
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Current transport and formation of energy structures in narrow Au/n-GaAs Schottky diodesMamedov, R.K. / Yeganeh, M.A. et al. | 2011
- 425
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Dependence of the Au/SnOx/n-LTPS/glass thin film MOS Schottky diode CO gas sensing performances on operating temperatureJuang, Feng-Renn / Fang, Yean-Kuen / Chiu, Hung-Yu et al. | 2011
- 430
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To the understanding of the formation of the III–V based droplet epitxial nanoringsNemcsics, Ákos / Stemmann, Andrea / Takács, Jenő et al. | 2011
- 434
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High temperature induced failure in Ti/Al/Ni/Au Ohmic contacts on AlGaN/GaN heterostructureDong, Zhihua / Wang, Jinyan / Wen, C.P. / Liu, Shenghou / Gong, Rumin / Yu, Min / Hao, Yilong / Xu, Fujun / Shen, Bo / Wang, Yangyuan et al. | 2011
- 439
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A health indicator method for degradation detection of electronic productsKumar, Sachin / Vichare, Nikhil M. / Dolev, Eli / Pecht, Michael et al. | 2011
- 446
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Electromigration reliability of interconnections in RF low noise amplifier circuitHe, Feifei / Tan, Cher Ming et al. | 2011
- 455
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High-lead flip chip bump cracking on the thin organic substrate in a module packageJang, J.W. / Li, L. / Bowles, P. / Bonda, R. / Frear, D.R. et al. | 2011
- IFC
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Inside front cover - Editorial board| 2011